Patents by Inventor Toru Komatsu

Toru Komatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240353789
    Abstract: A cartridge includes a drum flange provided at one end portion of a photosensitive drum, with the drum flange including a hollow interior portion elongated along the axis of the photosensitive drum and an interior surface. A coupling member is operatively connected to the drum flange, with the coupling member being configured to transmit the driving force to the drum flange. A coil spring is provided for urging the coupling member, and at least a part of the coil spring is positioned within the hollow interior portion of the drum flange. The interior surface of the drum flange includes an abutting portion configured to restrict movement of the coupling member in the direction away from the photosensitive drum along the axis of the photosensitive drum by abutting the coupling member.
    Type: Application
    Filed: April 25, 2024
    Publication date: October 24, 2024
    Inventors: Noriyuki Komatsu, Shunsuke Uratani, Toru Oguma
  • Patent number: 12087701
    Abstract: A module is provided that includes a substrate having a first main surface, a first component mounted on the first main surface, a first sealing resin disposed so as to cover the first main surface and the first component, and a shield film covering at least an upper surface of the first sealing resin. The shield film includes a conductive layer, a first protective layer covering the conductive layer, and a second protective layer. The first protective layer is locally formed with a marking section. The second protective layer includes a first region covering the first protective layer and a second region covering the marking section.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: September 10, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Toru Komatsu, Tadashi Nomura
  • Publication number: 20240287106
    Abstract: To provide a synthesis scheme capable of easily synthesizing various kinds of fluorescent probes. A method for preparing a compound represented by Formula (III) below, the method including steps (1) to (5).
    Type: Application
    Filed: June 9, 2022
    Publication date: August 29, 2024
    Inventors: Toru Komatsu, Yasuteru Urano, Shingo Sakamoto, Rikiya Watanabe, Yu Kagami
  • Publication number: 20240266108
    Abstract: An electronic component includes an element body including a first principal surface and a second principal surface opposing each other, and first and second external electrodes disposed on the first principal surface and separated from each other. The element body includes a first region including the first principal surface and a second region located between the first region and the second principal surface. The first region includes a portion located between the first and second external electrodes. The portion included in the first region is in contact with the first and second external electrodes. When viewed in a direction in which the first principal surface and the second principal surface oppose each other, the portion included in the first region covers an end of each of the first and second external electrodes. The first region has hardness greater than that of the second region.
    Type: Application
    Filed: January 29, 2024
    Publication date: August 8, 2024
    Applicant: TDK Corporation
    Inventors: Youichi KAZUTA, Kazuya TOBITA, Yuto SHIGA, Yuichi TAKUBO, Xuran GUO, So KOBAYASHI, Hiroto KOMATSU, Toru YAGINUMA
  • Publication number: 20240266097
    Abstract: The electronic component includes an element body, a first external electrode, and a second external electrode. The first external electrode and the second external electrode are disposed on a principal surface and are separated from each other in a first direction. The first external electrode includes a first region and a second region. The first region includes an end edge that opposes the second external electrode in the first direction and is located inside the element body. The second region is continuous with the first region and is exposed from the principal surface. The second external electrode includes a third region and a fourth region. The third region includes an edge that opposes the first region in the first direction and is located inside the element body. The fourth region is continuous with the third region and is exposed from the principal surface.
    Type: Application
    Filed: January 30, 2024
    Publication date: August 8, 2024
    Applicant: TDK Corporation
    Inventors: Xuran GUO, Youichi Kazuta, Kazuya Tobita, Yuto Shiga, Yuichi Takubo, So Kobayashi, Hiroto Komatsu, Toru Yaginuma
  • Patent number: 11871523
    Abstract: An electronic component module includes a substrate, an electronic component, an insulating resin, and a shield film. The insulating resin covers a first main surface side of the substrate. The insulating resin exposes an opposite surface of the electronic component. The shield film covers the insulating resin and the opposite surface of the electronic component. The opposite surface has an uneven portion. A concave portion of the uneven portion has a smoother shape than a convex portion of the uneven portion.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: January 9, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryohei Okabe, Toru Komatsu
  • Publication number: 20230413418
    Abstract: To provide electronic circuit module capable of dissipating heat generated by electronic component while suppressing increase in thickness, and capable of improving identifiability and visibility of identification character and identification mark as compared with conventional technique. Electronic circuit module according to present disclosure includes board, plurality of electronic components mounted on upper surface of board; and sealing resin configured to cover electronic component. Sealing resin has lower surface in contact with upper surface of board, and upper surface positioned on opposite side from board with respect to electronic component to face in opposite direction from lower surface. Identification recess constituting at least one of identification character and identification mark when viewed from thickness direction of board is formed in upper surface of sealing resin.
    Type: Application
    Filed: August 30, 2023
    Publication date: December 21, 2023
    Inventors: Toru KOMATSU, Tadashi NOMURA
  • Patent number: 11837555
    Abstract: A module includes a substrate including a first main surface, a first component mounted on the first main surface, a first sealing resin including a first upper surface, the first component being sealed with the first sealing resin, a first shield film that covers at least a part of the first upper surface of the first sealing resin, and a second shield film that covers a side surface of the first sealing resin and a side surface of the substrate. A step portion lower than the first upper surface of the first sealing resin is provided on an outer periphery of the first sealing resin. The first shield film and the second shield film are electrically connected to each other on a side surface below the step portion.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: December 5, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Toru Komatsu, Tadashi Nomura
  • Publication number: 20230246010
    Abstract: An electronic component module includes a substrate, a sub-module to be mounted on a main surface of the substrate, and a terminal conductor formed on a main surface of the substrate. The sub-module includes a substrate, an electronic component, an electronic component, and an electronic component. The substrate has a main surface and a main surface. The electronic component and the electronic component are mounted on the main surface. The electronic component is mounted on the main surface. The substrate has a through hole that penetrates between the main surface and the main surface. The sub-module is mounted so that the electronic component may be housed in the through hole.
    Type: Application
    Filed: April 7, 2023
    Publication date: August 3, 2023
    Inventors: Toru KOMATSU, Tadashi NOMURA
  • Publication number: 20230223355
    Abstract: An electronic component module includes a plurality of components including a terminal and placed along a plane, a frame substrate supporting at least some components among the plurality of components, a sealing resin portion sealing the plurality of components and the frame substrate, and a shield layer covering an outer surface of the sealing resin portion. The frame substrate includes an insulating layer, a ground layer, and a ground bump electrically connected to the ground layer, and also an opening supporting a portion other than solder bumps of bump components, and the ground layer of the frame substrate is exposed to a side surface of the frame substrate and is electrically connected to the shield layer. The terminal of the plurality of components and the ground bump are exposed while protruding from a plane of the sealing resin portion and are used as mounting terminals of the electronic component module.
    Type: Application
    Filed: March 16, 2023
    Publication date: July 13, 2023
    Inventors: Tadashi NOMURA, Toru KOMATSU
  • Publication number: 20230225092
    Abstract: An electronic component module includes a substrate having a main surface, an electronic component mounted on the main surface, a sealing resin having an insulation property and covering the electronic component and the main surface, and a conductive film that covers an outer surface of the sealing resin. The electronic component includes a housing whose outer surface has an insulation property, and a first external electrode arranged at one end of the housing. The electronic component module includes a conductive auxiliary layer that covers a part of the first external electrode and a part of the housing on a side of the electronic component opposite to the substrate. The sealing resin has a recessed portion that exposes the conductive auxiliary layer. A conductive portion is formed in the recessed portion and is connected to the conductive film and the conductive auxiliary layer.
    Type: Application
    Filed: March 17, 2023
    Publication date: July 13, 2023
    Inventors: Toru KOMATSU, Motohiko KUSUNOKI, Tadashi NOMURA
  • Publication number: 20230217599
    Abstract: An electronic component module includes a plurality of components having terminals and arranged along a plane, a sealing resin portion that covers and seals these components and has a plane as one plane of an outer surface, and a shield layer that covers the outer surface of the sealing resin portion. Terminals of the plurality of components are exposed in a state of protruding from the plane of the sealing resin portion, and the terminals of these components protruding from the plane of the sealing resin portion are used as mounting terminals of the electronic component module.
    Type: Application
    Filed: March 16, 2023
    Publication date: July 6, 2023
    Inventors: Toru KOMATSU, Tadashi NOMURA
  • Publication number: 20230052551
    Abstract: Provided is a novel fluorescent probe. A compound of the following general formula (I) or a salt thereof.
    Type: Application
    Filed: June 8, 2020
    Publication date: February 16, 2023
    Applicants: THE UNIVERSITY OF TOKYO, PUBLIC UNIVERSITY CORPORATION NAGOYA CITY UNIVERSITY, RIKEN
    Inventors: Yasuteru URANO, Toru KOMATSU, Shingo SAKAMOTO, Hiroyuki NOJI, Hidehiko NAKAGAWA, Mitsuyasu KAWAGUCHI, Rikiya WATANABE
  • Publication number: 20220352088
    Abstract: A module includes a substrate including a first surface, at least one first component mounted on the first surface, a shield member mounted on the first surface to cover the first component, and a first sealing resin arranged at least between the shield member and the first surface. The shield member includes a top surface portion in a form of a plate and a plurality of leg portions that extend from the top surface portion toward the first surface.
    Type: Application
    Filed: July 7, 2022
    Publication date: November 3, 2022
    Inventors: Tadashi NOMURA, Yukiya YAMAGUCHI, Hiroshi NISHIKAWA, Toru KOMATSU
  • Publication number: 20220310317
    Abstract: An electronic component module includes a substrate with a first main surface and a second main surface. Mount electronic components and a second conductive member are mounted on the second main surface, and the second conductive member is disposed between the mount electronic component and the mount electronic component. The second conductive member is connected to a shield film disposed near the second main surface through a depression. Mount electronic components and a first conductive member are mounted on the first main surface, and the first conductive member is disposed between the mount electronic component and the mount electronic component. The first conductive member is connected to a shield film disposed near the first main surface through a depression.
    Type: Application
    Filed: June 14, 2022
    Publication date: September 29, 2022
    Inventors: Minoru KOMIYAMA, Motohiko KUSUNOKI, Mitsuo ISHIDO, Toru KOMATSU
  • Publication number: 20220264748
    Abstract: An electronic component module includes a substrate, an electronic component, an insulating resin, and a shield film. The insulating resin covers a first main surface side of the substrate. The insulating resin exposes an opposite surface of the electronic component. The shield film covers the insulating resin and the opposite surface of the electronic component. The opposite surface has an uneven portion. A concave portion of the uneven portion has a smoother shape than a convex portion of the uneven portion.
    Type: Application
    Filed: May 10, 2022
    Publication date: August 18, 2022
    Inventors: Ryohei OKABE, Toru KOMATSU
  • Publication number: 20220216164
    Abstract: A module includes a substrate including a first surface, a first component mounted on first surface, and a first sealing resin sealing first component. First sealing resin contains a filler. An upper surface of first sealing resin includes a first region and a second region. A ratio of an area where the filler is exposed from first sealing resin in the second region is smaller than a ratio of an area where the filler is exposed from first sealing resin in the first region, at least the first region and side surfaces of the first sealing resin are covered with a shield film, and the second region is not covered with shield film.
    Type: Application
    Filed: March 23, 2022
    Publication date: July 7, 2022
    Inventors: Toru KOMATSU, Tadashi NOMURA, Yukiya YAMAGUCHI
  • Publication number: 20220208626
    Abstract: A module includes a substrate, a first component, and a first sealing resin layer. The substrate includes a first principal surface. The first component is mounted on the first principal surface. The first sealing resin layer contains a filler containing an inorganic oxide as a main component. The first sealing resin layer is provided on the first principal surface. The first sealing resin layer seals the first component. A marking portion is provided on a surface of the first sealing resin layer on a side opposite to the substrate. In the first sealing resin layer, the content rate of the filler is smaller in a second portion on the side opposite to the substrate than in a first portion on the substrate.
    Type: Application
    Filed: March 17, 2022
    Publication date: June 30, 2022
    Inventors: Toru KOMATSU, Tadashi NOMURA
  • Publication number: 20220122925
    Abstract: A module includes a substrate including a first main surface, a first component mounted on the first main surface, a first sealing resin including a first upper surface, the first component being sealed with the first sealing resin, a first shield film that covers at least a part of the first upper surface of the first sealing resin, and a second shield film that covers a side surface of the first sealing resin and a side surface of the substrate. A step portion lower than the first upper surface of the first sealing resin is provided on an outer periphery of the first sealing resin. The first shield film and the second shield film are electrically connected to each other on a side surface below the step portion.
    Type: Application
    Filed: December 28, 2021
    Publication date: April 21, 2022
    Inventors: Toru KOMATSU, Tadashi NOMURA
  • Patent number: 11282797
    Abstract: A high frequency module having a groove for shielding formed in a sealing resin layer achieves downsizing without damaging wiring electrodes formed on a wiring board or mounting components. A manufacturing method of a high frequency module includes mounting components on an upper surface of a wiring board, and then forming a sacrificial layer for forming a groove. The method further includes forming a sealing resin layer for sealing the components and the sacrificial layer, and dissolving and removing the sacrificial layer to form the groove for shielding. Finally, the method includes forming a shield film coating the surface of the sealing resin layer, and the high frequency module is manufactured. With this method, even when the groove is formed at a position overlapping with the component or a surface layer wiring electrode, the high frequency module can be downsized without damaging the component or the surface layer wiring electrode.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: March 22, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Tadashi Nomura, Toru Komatsu