Abstract: A semiconductor thin film according to an embodiment of the present invention includes: a polycrystallized semiconductor thin film formed by applying laser light to an amorphous semiconductor thin film; and crystal grains arranged into a lattice shape with a size that is about ½ of an oscillation wavelength of the laser light.

Abstract: On a translucent substrate, an insulating film having a refractive index n and an amorphous silicon film are deposited successively. By irradiating the amorphous silicon film with a laser beam having a beam shape of a band shape extending along a length direction with a wavelength ?, a plurality of times from a side of amorphous silicon film facing the insulating film, while an irradiation position of the laser beam is shifted each of the plurality of times in a width direction of the band shape by a distance smaller than a width dimension of the band shape, a polycrystalline silicon film is formed from the amorphous silicon film. Forming the polycrystalline silicon film forms crystal grain boundaries which extend in the width direction and are disposed at a mean spacing measured along the length direction and ranging from (?/n)×0.95 to (?/n)×1.

Abstract: An island-like semiconductor layer is formed on a main surface of an insulating substrate. A side wall of the island-like semiconductor layer is made substantially perpendicular to the insulating substrate. An insulating film is formed along the side wall of the semiconductor layer. The insulating film is formed to include a slanted face and have a sectional shape in which a width measured from the side wall of the semiconductor layer decreases as a distance to a bottom increases. A gate insulating film can be formed on the semiconductor layer with good step coverage because of inclusion of the insulating film, to preclude a possibility of causing disconnection of a gate electrode. Also, a thickness of a portion of the semiconductor layer in which a channel region is formed is uniform, to obtain stable transistor characteristics.

Abstract: A wiring layer includes a signal line and covers a predetermined portion on a source region and a drain region of a crystalline silicon layer. A gate insulating layer is on the crystalline silicon layer and the wiring layer. A gate electrode layer above the gate insulating layer includes a scanning line, a gate electrode corresponding to a channel region of the crystalline silicon layer, and a capacitor electrode corresponding to a predetermined portion of the wiring layer. The capacitor electrode is formed separately from the scanning line and the gate electrode and is configured to form a capacitor with the wiring layer. An interlayer insulating film is on the gate electrode layer and the gate insulating layer. A pixel electrode layer on the interlayer insulating film includes a pixel electrode connected to the wiring layer through a contact hole in the gate insulating layer and the interlayer insulating film.

Abstract: A semiconductor device includes a glass substrate having a main surface, a polysilicon film formed on the main surface, having a channel region formed and having a source region and a drain region formed on opposing sides of the channel region, a gate insulating film provided so as to be in contact with the polysilicon film and containing oxygen, and a gate electrode provided in a position facing the channel region with the gate insulating film being interposed. The polysilicon film has a thickness larger than 50 nm and not larger than 150 nm. The polysilicon film contains hydrogen in a proportion not smaller than 0.5 atomic percent and not larger than 10 atomic percent. With such a structure, a semiconductor device attaining a large drain current and having a desired electric characteristic is provided.

Abstract: A thin film transistor includes: an insulation substrate; a semiconductor layer formed on the insulation substrate including, conductive regions that includes impurity, and a channel region sandwiched between the conductive regions; an insulation layer that covers the semiconductor layer; a gate electrode that is formed on the insulator layer at a position where opposes the channel region; and a source electrode and a drain electrode connected to the conductive regions. The channel region divided into a plurality of channel regions and each of channel widths of the plurality of channel regions is in a range from 5 ?m to 30 ?m.

Abstract: In an evaluation device a plurality of evaluation cells, a signal wiring for applying a voltage to the evaluation cells, and an output terminal pad for a signal taking out wiring for measuring outputs from the evaluation cells through a signal taking out wiring are provided on an insulating substrate. Thus, the in-plane distribution of electric characteristics can be easily measured. Further, the electric characteristics related to the particle diameter of the crystal of a poly-crystal silicon film are evaluated so that the in-plane unevenness of the particle diameter of the crystal of the poly-crystal silicon film can be managed.

Abstract: A transparent conductive film substantially made from In2O3, SnO2 and ZnO, having a molar ratio In/(In+Sn+Zn) of 0.65 to 0.8 and also a molar ratio Sn/Zn of 1 or less: The transparent conductive film has a favorable electric contact property with an electrode or line made from Al or Al alloy film. Further, a semiconductor device having an electrode or line made from the transparent conductive film has high reliability and productivity.

Abstract: It is an object to obtain a display device which has a thin film transistor using a semiconductor film, and in which initial failures are reduced, and a high-resolution display due to miniaturization of the thin film transistor is enabled. In a thin film transistor, a gate electrode 6 is formed above a polycrystalline semiconductor film 4 via a gate insulating film 5. A taper angle ?2 of a section of a pattern end portion of the polycrystalline semiconductor film 4 in a region where the polycrystalline semiconductor film 4 and the gate electrode 6 intersect with each other is smaller than a taper angle ?1 of the other region.

Abstract: In a thin film transistor using a polycrystalline semiconductor film, when a storage capacitor is formed, it is often that a polycrystalline semiconductor film is used also in one electrode of the capacity. In a display device having a storage capacitor and thin film transistor which have a polycrystalline semiconductor film, the storage capacitor exhibits a voltage dependency due to the semiconductor film, and hence a display failure is caused. In the display device of the invention, a metal conductive film 5 is stacked above a semiconductor layer 4d made of a polycrystalline semiconductor film which is used as a lower electrode of a storage capacitor 130.

Abstract: A display device includes a substrate, a gate insulating film provided over the substrate and disposed between a semiconductor layer and a first conductive layer including a capacitor electrode and a gate electrode, an interlayer insulating film formed over the semiconductor layer, the first conductive layer and the gate insulating film, a second conductive layer having a signal line formed over the interlayer insulating film, a protective film formed over the interlayer insulating film and the second conductive layer and a pixel electrode layer formed over the protective film. The semiconductor layer and the second conductive layer are connected via the pixel electrode layer by the pixel electrode layer penetrating the protective film to reach the second conductive layer and also penetrating the protective film, the interlayer insulating film and the gate insulating film to reach the semiconductor layer.

Abstract: A semiconductor thin film according to an embodiment of the present invention includes: a polycrystallized semiconductor thin film formed by applying laser light to an amorphous semiconductor thin film; and crystal grains arranged into a lattice shape with a size that is about ½ of an oscillation wavelength of the laser light.

Abstract: A display device according to an embodiment of the present invention includes: a crystalline silicon layer formed on a substrate and including a source region, a drain region, and a channel region; a wiring layer including a signal line and formed to cover at least a predetermined portion on the source region and the drain region; a gate insulating layer formed on the crystalline silicon layer and the wiring layer; a gate electrode layer formed above the gate insulating layer and including a scanning line, a gate electrode corresponding to the channel region, and a capacitor electrode corresponding to a predetermined portion of the wiring layer; an interlayer insulating film formed on the gate electrode layer; and a pixel electrode layer formed on the interlayer insulating film, and including a pixel electrode connected to the drain region or the source region through a contact hole formed in the gate insulating layer and the interlayer insulating film.

Abstract: A transparent conductive film substantially made from In2O3, SnO2 and ZnO, having a molar ratio In/(In+Sn+Zn) of 0.65 to 0.8 and also a molar ratio Sn/Zn of 1 or less: The transparent conductive film has a favorable electric contact property with an electrode or line made from Al or Al alloy film. Further, a semiconductor device having an electrode or line made from the transparent conductive film has high reliability and productivity.

Abstract: A method of manufacturing a liquid crystal display holding a liquid crystal layer between a picture element substrate on which a pixel electrode driven by a thin film transistor is formed and a opposed counter substrate and forming a terminal to an external driving circuit on the picture element substrate, includes forming a semiconductor layer on the substrate, forming a gate insulating film on the semiconductor layer, forming a gate electrode on the gate insulating film, forming a source-drain region in the semiconductor layer, forming a source-drain wire on the substrate, forming a terminal wire on the substrate, forming insulating inorganic films on regions of the terminal wire on the external driving circuit and a display area sides, forming an organic resin film on the insulating inorganic film, and forming a conductive film on the terminal wire. The conductive film has a predetermined distance to the organic resin film.

Abstract: A TFT according to an embodiment of the present invention includes an insulative base film formed on a TFT array substrate, and a semiconductor film including a channel region formed on the base film, in which an impurity concentration of a channel region in the semiconductor film becomes substantially uniform in a film thickness direction of the semiconductor film, the impurity concentration of the channel region is discontinuous at a boundary between the semiconductor film and the base film, and an impurity concentration of the base film is lower than an impurity concentration of the semiconductor film and is monotonously decreased toward the TFT array substrate.

Abstract: An island-like semiconductor layer is formed on a main surface of an insulating substrate. A side wall of the island-like semiconductor layer is made substantially perpendicular to the insulating substrate. An insulating film is formed along the side wall of the semiconductor layer. The insulating film is formed to include a slanted face and have a sectional shape in which a width measured from the side wall of the semiconductor layer decreases as a distance to a bottom increases. A gate insulating film can be formed on the semiconductor layer with good step coverage because of inclusion of the insulating film, to preclude a possibility of causing disconnection of a gate electrode. Also, a thickness of a portion of the semiconductor layer in which a channel region is formed is uniform, to obtain stable transistor characteristics.

Abstract: A thin film transistor includes: an insulation substrate; a semiconductor layer formed on the insulation substrate including, conductive regions that includes impurity, and a channel region sandwiched between the conductive regions; an insulation layer that covers the semiconductor layer; a gate electrode that is formed on the insulator layer at a position where opposes the channel region; and a source electrode and a drain electrode connected to the conductive regions. The channel region divided into a plurality of channel regions and each of channel widths of the plurality of channel regions is in a range from 5 ?m to 30 ?m.

Abstract: Impurity ions contained in a semiconductor layer are diffused downwardly from a gate electrode by irradiating laser light from the back surface of a transparent substrate after source-drain regions are formed. Thus, a GOLD structure is formed. Consequently, the GOLD structure is formed by performing a smaller number of processes. Also, variation in characteristics can be suppressed by preventing occurrence of asymmetry between left and right LDD regions.

Abstract: A gate insulating film of a thin-film transistor is formed on a polysilicon film in which a source region and a drain region of the thin-film transistor are formed. A gate electrode of the thin-film transistor is formed on the gate insulating film. An insulating layer containing a silicon atom, a dangling bond of which is terminated with a nitrogen atom or an ON group, is provided in an interface between the polysilicon film and the gate insulating film.