Abstract: In a defect inspecting apparatus, a differential interference optical system forms a differential interference image which is produced from an optical interference of images in a predetermined direction, the images corresponding to inspecting parts of a pattern formed on a mask. A control part varies the predetermined direction so as to cause the differential interference optical system to produce another differential interference image. An image pickup sensor picks up the differential interference images in accordance with the variation of the predetermined direction. A defect detecting unit detects a defect in the pattern formed on the mask from comparing the differential interference images with reference images, respectively.

Abstract: The present invention is to allow rapid detection of such a defect as buried in a pixel positional deviation, expansion/contraction noise or sensing noise on an image. A relationship between an inspection reference pattern image and a pattern image to be inspected is identified during inspection to construct a mathematical model obtained by absorbing (applying fitting on) a pixel positional deviation, expansion/contraction noise or sensing noise on an image, and a defect is detected by comparing a new inspection reference pattern image (model image) obtained by simulating the mathematical model and a pattern image to be inspected.

Abstract: A defect inspection method comprises irradiating a sample including a pattern under inspection with light, acquiring measurement pattern data of the pattern based on intensity of light reflected by the sample, generating conversion data including pixel data corresponding to the measurement pattern data from design data of the sample, applying FIR filter process to the conversion data, reconstructing the conversion data by replacing pixel data having value not larger than first reference value with first pixel data, replacing pixel data having value larger than second reference value larger than first reference value with second pixel data having value larger than first pixel data, replacing pixel data having value larger than first reference value and less than second reference value with third pixel data having value between the value of first and second pixel data, the pixel data having larger value being replaced with third pixel data having higher value.

Abstract: An alignment apparatus for substrates comprises a first movement mechanism moving a substrate to be treated in a horizontal direction, a second movement mechanism moving the substrate in a vertical direction, a rotation mechanism rotating the substrate in a substrate plane, an illumination tool irradiating the substrate from a sidewise direction in a state where the substrate is held in a desired height position by the second movement mechanism, an image sensor picking up an image on a back surface of the substrate in an irradiated state, an edge position sensor sensing plural edge positions of the substrate from an image obtained by the image sensor, and a control computer obtaining a positional shift of the substrate based on the edge positions sensed by the edge position sensor and correcting a positional shift of the horizontal and rotation directions by the first movement and rotation mechanisms.

Abstract: An alignment apparatus for substrates comprises a first movement mechanism moving a substrate to be treated in a horizontal direction, a second movement mechanism moving the substrate in a vertical direction, a rotation mechanism rotating the substrate in a substrate plane, an illumination tool irradiating the substrate from a sidewise direction in a state where the substrate is held in a desired height position by the second movement mechanism, an image sensor picking up an image on a back surface of the substrate in an irradiated state, an edge position sensor sensing plural edge positions of the substrate from an image obtained by the image sensor, and a control computer obtaining a positional shift of the substrate based on the edge positions sensed by the edge position sensor and correcting a positional shift of the horizontal and rotation directions by the first movement and rotation mechanisms.

Abstract: An automatic focusing apparatus comprises a stage holding a substrate, an objective lens disposed facing the substrate surface, an illumination optics illuminating the substrate surface with a spotted light beam from an oblique direction, a photodetector detecting reflected light from the substrate surface, a position detection circuit detecting a vertical position of the substrate surface from an electric signal obtained from the photodetector to output a position signal, a correction circuit monitoring the position signal in real time and subtracting a surplus exceeding a signal change corresponding to a surface shape change of the substrate from the position signal, when a change amount per unit time of the position signal exceeds a predetermined level and outputting a corrected position signal, and a stage control circuit controlling the vertical position of the stage based on the corrected position signal.

Abstract: A photolithography mask inspection apparatus has at least two sensors. One sensor is configured to sense light transmitted through an object to be inspected, and the other sensor senses light reflected off the object. A first optical system is arranged to expose a first portion of the object with a first light beam, and a second optical system is arranged to expose a second portion of the object, spaced form the first portion, with a second light beam. A third optical system focuses the transmitted light on to the first sensor, as well as the reflected light on to the second sensor. A defect detecting circuit is also provided to detect a defect of the object, based upon image data associated with the reflected and transmitted light.

Abstract: A pattern inspection apparatus comprises an illumination optics applying a first inspection light on a predetermined wavelength to a surface opposite to a pattern formed surface of the substrate, and a second inspection light whose wavelength is equal to the wavelength of the first inspection light to the pattern formed surface, a detector independently detecting a transmitted light from the substrate by irradiation of the first inspection light and a reflected light from the substrate by irradiation of the second inspection light, and a space separation mechanism provided in the vicinity of an optical focal plane toward the pattern formed surface, and spatially separates an irradiation area of the first and second inspection lights such that the transmitted and reflected lights from the substrate are imaged in two discrete areas-separated on the optical focal plane.

Abstract: With a pattern inspection apparatus, image data corresponding to all patterns on an inspection target plate can be generated on the basis of scanned pattern data obtained with low-magnification optics different from ordinary inspection optics, or design pattern data. A pattern repeated area can be automatically detected from the image data. Therefore, die-to-die comparative inspection can be performed if the operator does not specify which dies to inspect. Thus, the inspection throughput can be improved.

Abstract: A pattern inspection apparatus uses a die-to-database comparison method which compares detected pattern data obtained from an optical image of a pattern of a plate to be inspected with first reference pattern data obtained from designed pattern data in combination with a die-to-die comparison method which compares the detected pattern data with second reference pattern data obtained by detecting an area to be a basis for repetition. A computer detects presence of a plurality of repeated pattern areas from layout information contained in the designed pattern data, reads the arrangement, the number, the dimension and the repeated pitch of the repeated pattern areas, and automatically fetches an inspection area of the die-to-die comparison method.

Abstract: According to one embodiment of the present invention, the present invention may provide a temperature measuring method in a pattern drawing apparatus having a drawing chamber for drawing a pattern on a substrate to be transferred inside, a stage installed inside the drawing chamber, a standby chamber connected to the drawing chamber, and a thermostatic device installed inside the standby chamber, characterized in that a dummy substrate having a temperature measuring device and a recording device for recording the temperature measured by the temperature measuring device is transferred to the thermostatic device, then transferred into the drawing chamber, and then put on the stage, thus the temperature history of the dummy substrate in the transfer route from the thermostatic device to the stage is measured by the temperature measuring device and recorded in the recording device.

Abstract: An alignment apparatus for substrates comprises a first movement mechanism moving a substrate to be treated in a horizontal direction, a second movement mechanism moving the substrate in a vertical direction, a rotation mechanism rotating the substrate in a substrate plane, an illumination tool irradiating the substrate from a sidewise direction in a state where the substrate is held in a desired height position by the second movement mechanism, an image sensor picking up an image on a back surface of the substrate in an irradiated state, an edge position sensor sensing plural edge positions of the substrate from an image obtained by the image sensor, and a control computer obtaining a positional shift of the substrate based on the edge positions sensed by the edge position sensor and correcting a positional shift of the horizontal and rotation directions by the first movement and rotation mechanisms.

Abstract: A vacuum processing apparatus performs processing such-as a pattern depiction with a charged beam within a process chamber evacuated to a high vacuum by an ion pump. The vacuum processing apparatus, which makes it possible to prevent the accuracy of the charged beam pattern depiction from being deteriorated by ions and electrons leaking from the ion pump, has a conductor and a voltage applying unit. The conductor is arranged in the vicinity of the suction port of the process chamber communicating with the ion pump such that the conductor is electrically insulated from the process chamber. The voltage applying unit imparts a potential differing from that of the process chamber to the conductor. Because of the potential difference between the conductor and the process chamber, the ions and electrons leaking from the ion pump are reflected or adsorbed by the conductor so as to suppress leakage of the ions and electrons into the process chamber.

Abstract: According to one embodiment of the present invention, the present invention may provide a temperature measuring method in a pattern drawing apparatus having a drawing chamber for drawing a pattern on a substrate to be transferred inside, a stage installed inside the drawing chamber, a standby chamber connected to the drawing chamber, and a thermostatic device installed inside the standby chamber, characterized in that a dummy substrate having a temperature measuring device and a recording device for recording the temperature measured by the temperature measuring device is transferred to the thermostatic device, then transferred into the drawing chamber, and then put on the stage, thus the temperature history of the dummy substrate in the transfer route from the thermostatic device to the stage is measured by the temperature measuring device and recorded in the recording device.

Abstract: A pattern writing method acquires the area of a pattern segment located in each of a plurality of small regions obtained by dividing a region on which a pattern is to be written, small region by small region, and writes a pattern based on an optimum dose calculated based on this area. This method employs a scheme of shifting pattern segments and averaging the accumulated area, so that even when the pitch of repetitive patterns slightly differs from the side length of each small region in the pitch direction, a peculiar error does not occur, thereby ensuring highly-precise proximity effect correction and contributing to improving the precision of writing an LSI pattern.

Abstract: A method of transferring a sample to and from a treating chamber kept in a vacuum atmosphere through a pressure regulatively preparatory chamber. The sample is contained in the sample transfer container, which is kept air-permeable by a dust filtering filter, in a cleaned atmosphere before the sample is transferred to the treating chamber. The sample transfer container is transferred into the preparatory chamber, and the inside of the preparatory chamber is evacuated to a vacuum atmosphere. The sample is then extracted from the sample transfer container in the vacuum atmosphere and is transferred into the treating chamber. Also disclosed is an apparatus for supporting the sample transferring method.

Abstract: An apparatus for emitting a beam to a sample used for manufacturing a semiconductor device in order to process the sample, includes a chamber having an opening, a moving mechanism provided in the chamber, for moving the sample in X-, Y- and Z-axis directions, and a beam emitting system associated with the opening of the chamber, for emitting a beam to the sample in the chamber. The apparatus further includes an optical position detector for guiding a coherent light beam into the chamber and detecting a light beam output from the chamber. The optical position detector has light beam generating unit for generating a coherent light beam to be emitted to the sample, light-receiving unit for receiving a light beam from a surface of the sample, and converting unit for converting a signal output from the light-receiving unit into signals in the X-, Y- and Z-axis directions.

Abstract: A pattern forming apparatus comprising a sample base for positioning a sample on the base and moving a drawing position of the sample, a position measuring unit for measuring a position of the sample base, a correcting unit for mutually independently correcting drawing positions at those respective areas into which a whole drawing section of the sample is divided, the drawing position being calculated by the position measuring unit at the respective area, and a drawing unit for drawing a pattern on the sample on the basis of the position of the sample base measured by the position measuring unit and drawing position of the respective area corrected by the correcting unit.

Abstract: A photomask defect inspection method is provided by which defects of pin holes with the diameter equal to or less than 0.35 .mu.m can be detected with certainty. According to the inspection method, a pattern whose image is projected onto an imaging position by the use of illumination light (P1) for exposure consists of light transmitting portions (41) formed on a glass base (2) and light intercepting portions (42) which transmit part of the illumination light (P1) in such a way that a phase of the part of the illumination light (P1) passing through the light intercepting portions (42) is delayed with respect to a phase of the illumination light (P1) passing through the light transmitting portions (41).

Abstract: A method of transferring a sample to and from a treating chamber kept in a vacuum atmosphere through a pressure regulative preparatory chamber. The sample is contained in the sample transfer container, which is kept air-permeable by a dust filtering filter, in a cleaned atmosphere before the sample is transferred to the treating chamber. The sample transfer container is transferred into the preparatory chamber, and the inside of the preparatory chamber is evacuated to a vacuum atmosphere. The sample is then extracted from the sample transfer container in the vacuum atmosphere and is transferred into the treating chamber. Also disclosed is an apparatus for supporting the sample transferring method.