Patents by Inventor Toshiaki Ishii

Toshiaki Ishii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10396010
    Abstract: Provided is an inexpensive and highly reliable resin sealed-type onboard electronic control device is mounted in a vehicle such as an engine control unit and a control unit for automatic transmission, which have a heat dissipation structure for dissipating heat generated from an electronic component such as a semiconductor element. The onboard control device includes a circuit board, a member provided to face the circuit board, a heat generating electronic component mounted between the circuit board and the member, a heat dissipating material provided between the heat generating electronic component and the member, and a sealing resin to seal the circuit board and the heat generating electronic component. And a space between the member and the circuit board is at least a part of a range where the heat dissipating material is not provided, and is narrower than a range where the heat dissipating material is provided.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: August 27, 2019
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Kazuhiro Suzuki, Toshiaki Ishii, Yoshio Kawai, Yujiro Kaneko
  • Publication number: 20190195146
    Abstract: This valve device includes a body having passages and valve shaft holes, a valve shaft passed through the valve shaft holes in a rotatable manner, and butterfly valves. The butterfly valves include first contour parts and second contour parts forming outer contour parts that are smaller than the first contour parts. The first and second contour parts are fixed to the valve shaft in order to close off the passages at positions set apart from the valve shaft holes toward the downstream side (upstream side) of the passages, and are disposed flanking a straight line parallel to the valve shaft to form prescribed outer contour parts. The body includes first seal parts with which the first contour parts are brought into contact and second seal parts with which the second contour parts are brought into contact within the passages. Fluid leakage in a closed state can thereby be reliably prevented.
    Type: Application
    Filed: April 7, 2017
    Publication date: June 27, 2019
    Applicant: MIKUNI CORPORATION
    Inventor: Toshiaki ISHII
  • Publication number: 20190080931
    Abstract: An object is to provide the structure of an ECU enabling resin to be filled without deformation of an electronic circuit board. A resin-sealed vehicle-mounted control device includes: a circuit board; a base member housing the circuit board; and resin filled between the circuit board and the base member. The base member has: a base portion fixing the circuit board; and a side wall opposed to the side surface side of the circuit board. The resin is provided at least between the circuit board and the base portion. The side wall has an opening at any position on the side of the base portion from a position opposed to the side surface side of the electronic circuit board.
    Type: Application
    Filed: February 1, 2017
    Publication date: March 14, 2019
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Maki ITO, Toshiaki ISHII, Yoshio KAWAI, Nobutake TSUYUNO, Yujiro KANEKO, Takayuki FUKUZAWA, Masahiko ASANO
  • Publication number: 20190032598
    Abstract: This valve device is provided with: a body (10) that has at least one passage (11, 12) for passing a fluid and valve shaft holes (13, 14, 15); a valve shaft (20), which is passed through the valve shaft holes so as to be rotatable; and butterfly valves (30, 40), which are fixed on the valve shaft and are for opening and closing the passages (11, 12). The butterfly valves (30, 40) are disposed so as to close the passages (11, 12) on a downstream side or an upstream side of the valve shaft holes (13, 14, 15) in a flow direction of the fluid. As a result, it is possible to prevent fluid leakage and achieve effective utilization of exhaust heat in an exhaust heat recovery system.
    Type: Application
    Filed: January 26, 2017
    Publication date: January 31, 2019
    Applicant: MIKUNI CORPORATION
    Inventors: Toshio KARASAWA, Toshiaki ISHII, Takashi WATABE
  • Patent number: 10190563
    Abstract: An internal combustion engine ignition coil according to the present invention includes: a central iron core; a primary coil disposed on an outer circumference of the central iron core; a secondary coil disposed on an outer circumference of the primary coil; a side iron core disposed on an outer circumference of the secondary coil; and an insulating material sealing the central iron core, the primary coil, and the secondary coil on an inner side of the side iron core. A first layered silicate having a particle diameter less than a winding diameter of the secondary coil is present at a higher concentration in a vicinity of the secondary coil than that in a vicinity of the side iron core in the insulating material. A second layered silicate having a particle diameter greater than the winding diameter of the secondary coil is present at a higher concentration than that of the first layered silicate between the outer circumference side of the secondary coil and the side iron core.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: January 29, 2019
    Assignee: Hitachi Automotive Systems Hanshin, Ltd.
    Inventors: Masayuki Kamikawa, Nobutake Tsuyuno, Toshiaki Ishii, Yoichi Anzo
  • Publication number: 20190027848
    Abstract: There is a problem that an oxide film or high resistance abrasion powder is formed at the contact interface due to micro sliding abrasion in a high temperature environment or temperature cycle to increase the contact resistance at the contact portion of a non-noble metal connection terminal. Provided is an in-vehicle electronic module, a connector, and a connection structure thereof, which have the same connection reliability as noble metals even when exposed to a harsh environment and can reduce cost of members.
    Type: Application
    Filed: December 22, 2016
    Publication date: January 24, 2019
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Ryouichi KAJIWARA, Toshiaki ISHII, Masaru KAMOSHIDA
  • Patent number: 10186473
    Abstract: An object of the present invention is to provide a power module capable of realizing a superior heat radiation property while satisfying a high insulation property. A power module according to the present invention includes: a conductor plate to which a switching element is connected; a heat radiation plate which is disposed to face the conductor plate; an insulating member which is disposed between the conductor plate and the heat radiation plate; and a conductive intermediate conductor which is disposed in the insulating member in a state of being electrically insulated from the conductor plate and the heat radiation plate, wherein the intermediate conductor has a communication region which communicates between the insulating member disposed on the side of the conductor plate with respect to the intermediate conductor and the insulating member disposed on the side of the heat radiation plate with respect to the intermediate conductor.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: January 22, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Fusao Hojo, Nobutake Tsuyuno, Toshiaki Ishii, Junpei Kusukawa, Akira Matsushita
  • Patent number: 10128164
    Abstract: An electronic component has a semiconductor element and a thermally conductive support member. A heat sink is disposed on one surface of the circuit body, and a thermally conductive insulating member is interposed between the heat sink and the support member. Input and output terminals and a ground terminal are also provided. A sealing resin is formed to expose a part of each of the input and output terminals and the ground terminal and one surface of the heat sink, and to cover a periphery of the electronic component structure. A main body conductor layer is formed to be insulated from the input and output terminals and cover an immersion region of the sealing resin and one surface of the heat sink immersed in a cooling medium. A ground conductor layer covers at least a part of the ground terminal and is electrically connected with the main body conductor layer.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: November 13, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hiroyuki Temmei, Mina Amo, Nobutake Tsuyuno, Takeshi Tokuyama, Toshiaki Ishii, Toshiya Satoh
  • Publication number: 20180277460
    Abstract: Provided is an inexpensive and highly reliable resin sealed-type onboard electronic control device is mounted in a vehicle such as an engine control unit and a control unit for automatic transmission, which have a heat dissipation structure for dissipating heat generated from an electronic component such as a semiconductor element. The onboard control device includes a circuit board, a member provided to face the circuit board, a heat generating electronic component mounted between the circuit board and the member, a heat dissipating material provided between the heat generating electronic component and the member, and a sealing resin to seal the circuit board and the heat generating electronic component. And a space between the member and the circuit board is at least a part of a range where the heat dissipating material is not provided, and is narrower than a range where the heat dissipating material is provided.
    Type: Application
    Filed: August 8, 2016
    Publication date: September 27, 2018
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Kazuhiro SUZUKI, Toshiaki ISHII, Yoshio KAWAI, Yujiro KANEKO
  • Publication number: 20180255658
    Abstract: Providing a highly reliable electronic control device capable of achieving both low cost and productivity. An electronic control device including an electronic component, a control substrate on which the electronic component is mounted, and a sealing resin that seals the control substrate, the electronic control device being installed outside the vehicle cabin or in the engine compartment, the electronic control device further including a housing case that fixes the control substrate, and an outer periphery of the housing case being covered with a sealing resin.
    Type: Application
    Filed: August 5, 2016
    Publication date: September 6, 2018
    Inventors: Yujiro KANEKO, Yoshio KAWAI, Toshiaki ISHII
  • Publication number: 20180218963
    Abstract: An object of the present invention is to provide a power module capable of realizing a superior heat radiation property while satisfying a high insulation property. A power module according to the present invention includes: a conductor plate to which a switching element is connected; a heat radiation plate which is disposed to face the conductor plate; an insulating member which is disposed between the conductor plate and the heat radiation plate; and a conductive intermediate conductor which is disposed in the insulating member in a state of being electrically insulated from the conductor plate and the heat radiation plate, wherein the intermediate conductor has a communication region which communicates between the insulating member disposed on the side of the conductor plate with respect to the intermediate conductor and the insulating member disposed on the side of the heat radiation plate with respect to the intermediate conductor.
    Type: Application
    Filed: July 11, 2016
    Publication date: August 2, 2018
    Inventors: Fusao HOJO, Nobutake TSUYUNO, Toshiaki ISHII, Junpei KUSUKAWA, Akira MATSUSHITA
  • Publication number: 20180190425
    Abstract: An ignition coil for an internal combustion engine includes an iron core, a primary coil disposed around the iron core, a secondary coil disposed around the primary coil, and an insulating portion sealing the iron core, the primary coil, and the secondary coil. The insulating portion includes a resin and a linear aliphatic group-containing organic substance, and has a sea-island structure in which the organic substance is dispersed in a matrix of the resin.
    Type: Application
    Filed: December 14, 2017
    Publication date: July 5, 2018
    Inventors: Masayuki KAMIKAWA, Yu Yasuda, Nobutake Tsuyuno, Toshiaki Ishii
  • Publication number: 20180007778
    Abstract: Provided is an onboard control apparatus (ECU) having a thermal radiating coating film capable of efficiently radiating heat generated from an electronic component to the outside of the casing. An onboard control apparatus includes: a circuit board stored in a housing; an electronic component mounted on the circuit board; and a thermal radiating coating film which is disposed on the electronic component to radiate heat generated from the electronic components, wherein the thermal radiating coating includes a resin and thermal radiating particles which radiate heat, and the thermal radiating particles and the resin have substantially same specific gravity.
    Type: Application
    Filed: January 12, 2016
    Publication date: January 4, 2018
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Maki ITO, Toshiaki ISHII, Yoshio KAWAI
  • Patent number: 9852962
    Abstract: A waterproof electronic device includes: an electronic component module having an electronic component including a semiconductor element, a heat dissipating member provided on the electronic component in a thermally conductive manner, and an insulating material that surrounds the electronic component in such a manner that one surface of the heat dissipating member is exposed; and a waterproof film that is formed at least on whole surfaces in regions of the electronic component module that are to be immersed in a coolant.
    Type: Grant
    Filed: February 4, 2015
    Date of Patent: December 26, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hiroyuki Temmei, Mina Amo, Nobutake Tsuyuno, Eiichi Ide, Takeshi Tokuyama, Toshiya Satoh, Toshiaki Ishii, Kazuaki Naoe
  • Publication number: 20170309540
    Abstract: An electronic component has a semiconductor element and a thermally conductive support member. A heat sink is disposed on one surface of the circuit body, and a thermally conductive insulating member is interposed between the heat sink and the support member. Input and output terminals and a ground terminal are also provided. A sealing resin is formed to expose a part of each of the input and output terminals and the ground terminal and one surface of the heat sink, and to cover a periphery of the electronic component structure. A main body conductor layer is formed to be insulated from the input and output terminals and cover an immersion region of the sealing resin and one surface of the heat sink immersed in a cooling medium. A ground conductor layer covers at least a part of the ground terminal and is electrically connected with the main body conductor layer.
    Type: Application
    Filed: October 15, 2015
    Publication date: October 26, 2017
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Hiroyuki TEMMEI, Mina AMO, Nobutake TSUYUNO, Takeshi TOKUYAMA, Toshiaki ISHII, Toshiya SATOH
  • Publication number: 20170241393
    Abstract: An internal combustion engine ignition coil according to the present invention includes: a central iron core; a primary coil disposed on an outer circumference of the central iron core; a secondary coil disposed on an outer circumference of the primary coil; a side iron core disposed on an outer circumference of the secondary coil; and an insulating material sealing the central iron core, the primary coil, and the secondary coil on an inner side of the side iron core. A first layered silicate having a particle diameter less than a winding diameter of the secondary coil is present at a higher concentration in a vicinity of the secondary coil than that in a vicinity of the side iron core in the insulating material. A second layered silicate having a particle diameter greater than the winding diameter of the secondary coil is present at a higher concentration than that of the first layered silicate between the outer circumference side of the secondary coil and the side iron core.
    Type: Application
    Filed: February 8, 2017
    Publication date: August 24, 2017
    Inventors: Masayuki KAMIKAWA, Nobutake TSUYUNO, Toshiaki ISHII, Yoichi ANZO
  • Patent number: 9743539
    Abstract: There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: August 22, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Ryouichi Kajiwara, Masaru Kamoshida, Toshiaki Ishii
  • Patent number: 9736952
    Abstract: There is provided an on-vehicle electronic module that includes an external connecting function and environment resistant reliability similar to a previous on-vehicle electronic module and that simultaneously achieves downsizing without a male connector housing component and cost reduction due to reduction of the number of components and assembly man-hours. There are included a circuit board 1 including a mounting region 2 and a terminal forming region 3, and a case housing the mounting region 2 of the circuit board 1. Electronic components 9 and 10 are mounted on the mounting region 2. A board terminal is formed in the terminal forming region 3. The case includes a case member 13 integrally formed with a wall surface and a male connector housing 13a. The wall surface forms a case internal space 21 that houses the mounting region 2. A female connector is mounted to the male connector housing 13a.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: August 15, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Ryoichi Kajiwara, Toshiaki Ishii, Masaru Kamoshida
  • Publication number: 20170215271
    Abstract: The invention provides an in-vehicle controller equipped with a heat radiation coating film which can efficiently radiate heat from a high temperature portion such as a heat generating body to a casing. An in-vehicle controller includes a heat radiation coating film, wherein the heat radiation coating film includes a first region that has a first boundary surface abutting on a base material, and a second region that has a second boundary surface where the heat radiation coating film abuts on air, wherein a thermal conductivity of the first region is higher than that of the second region, and wherein a thermal emissivity of the second region is higher than that of the first region.
    Type: Application
    Filed: August 21, 2015
    Publication date: July 27, 2017
    Inventors: Maki ITO, Yuusuke YASUDA, Toshiaki ISHII, Yoshio KAWAI, Masahiko ASANO
  • Patent number: 9591789
    Abstract: An insulation film that strongly adheres to a power semiconductor module having a resin sealer and a conductor plate and has high thermal conductivity is provided. An insulation layer 700 is provided between a power semiconductor module 302 and a heat dissipation portion 307B. The power semiconductor module 302 includes a resin sealer 348, which covers a circumferential side surface of a conductor plate 315, and a plurality of recesses 348D are provided in the resin sealer 348. The insulation layer 700 is formed of a spray coated film 710, an insulation film 720, and a resin layer 730, and the spray coated film 710 is formed on the surface of the resin sealer 348 including recesses 348D to form a seamless flat surface. The planar size of each of the recesses 348D is greater than the planar size of each flat portion 711, which forms the spray coated film 710.
    Type: Grant
    Filed: November 9, 2012
    Date of Patent: March 7, 2017
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Eiichi Ide, Eiji Nishioka, Toshiaki Ishii, Junpei Kusukawa, Kinya Nakatsu, Nobutake Tsuyuno, Toshiya Satoh, Masahiko Asano