Patents by Inventor Toshiaki Ishii

Toshiaki Ishii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200406341
    Abstract: A continuous casting method includes, conveying a cast slab from a casting mold, stirring a non-solidified portion in the cast slab with a first electromagnetic stirring device, stirring the non-solidified portion with a second electromagnetic stirring device disposed downstream of the first electromagnetic stirring device in a conveyance direction of the cast slab, and subsequently, rolling the cast slab with a reduction roll, in which, the first electromagnetic stirring device alternately imparts the cast slab with electromagnetic force in one direction to cause the non-solidified portion to flow toward one width direction side of the cast slab at a flow rate of at least 5 cm/s, and with electromagnetic force in another direction to cause the non-solidified portion to flow toward another width direction side of the cast slab at a flow rate of at least 5 cm/s.
    Type: Application
    Filed: March 1, 2019
    Publication date: December 31, 2020
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Shinji NAGAI, Toshiaki MIZOGUCHI, Kenji KUBO, Makoto ISHII
  • Patent number: 10881014
    Abstract: Providing a highly reliable electronic control device capable of achieving both low cost and productivity. An electronic control device including an electronic component, a control substrate on which the electronic component is mounted, and a sealing resin that seals the control substrate, the electronic control device being installed outside the vehicle cabin or in the engine compartment, the electronic control device further including a housing case that fixes the control substrate, and an outer periphery of the housing case being covered with a sealing resin.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: December 29, 2020
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Yujiro Kaneko, Yoshio Kawai, Toshiaki Ishii
  • Patent number: 10787993
    Abstract: This valve device is provided with: a body (10) that has at least one passage (11, 12) for passing a fluid and valve shaft holes (13, 14, 15); a valve shaft (20), which is passed through the valve shaft holes so as to be rotatable; and butterfly valves (30, 40), which are fixed on the valve shaft and are for opening and closing the passages (11, 12). The butterfly valves (30, 40) are disposed so as to close the passages (11, 12) on a downstream side or an upstream side of the valve shaft holes (13, 14, 15) in a flow direction of the fluid. As a result, it is possible to prevent fluid leakage and achieve effective utilization of exhaust heat in an exhaust heat recovery system.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: September 29, 2020
    Assignee: MIKUNI CORPORATION
    Inventors: Toshio Karasawa, Toshiaki Ishii, Takashi Watabe
  • Patent number: 10743386
    Abstract: A display device includes a pixel including a plurality of sub-pixels. Each of the plurality of sub-pixels includes: a light-emission region; and a non-light-emission region other than the light-emission region. The light-emission region includes one or more effective light-emitting parts in which a first electrode, a light emitting layer, and a second electrode are stacked in order, and a light guide provided on side of the one or more effective light-emitting parts on which light is extracted.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: August 11, 2020
    Assignee: JOLED INC.
    Inventors: Kaoru Abe, Kazuma Teramoto, Toshiaki Imai, Jiro Yamada, Takahide Ishii, Hideki Kobayashi
  • Patent number: 10738715
    Abstract: This valve device includes a body having passages and valve shaft holes, a valve shaft passed through the valve shaft holes in a rotatable manner, and butterfly valves. The butterfly valves include first contour parts and second contour parts forming outer contour parts that are smaller than the first contour parts. The first and second contour parts are fixed to the valve shaft in order to close off the passages at positions set apart from the valve shaft holes toward the downstream side (upstream side) of the passages, and are disposed flanking a straight line parallel to the valve shaft to form prescribed outer contour parts. The body includes first seal parts with which the first contour parts are brought into contact and second seal parts with which the second contour parts are brought into contact within the passages. Fluid leakage in a closed state can thereby be reliably prevented.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: August 11, 2020
    Assignee: MIKUNI CORPORATION
    Inventor: Toshiaki Ishii
  • Publication number: 20200227333
    Abstract: An object of the present invention is to provide a power semiconductor device enabling maintenance in reliability and improvement in productivity. According to the present invention, provided are: a circuit body including a semiconductor element and a conductive portion; a first insulation and a second insulation opposed to each other, the circuit body being interposed between the first insulation and the second insulation; a first base and a second base opposed to each other, the circuit body, the first insulation, and the second insulation being interposed between the first base and the second base; a case having a first opening portion covered with the first base and a second opening portion covered with the second base; and a distance regulation portion provided in space between the first base and the second base, the distance regulation portion regulating a distance between the first base and the second base in contact with the first base and the second base.
    Type: Application
    Filed: May 22, 2018
    Publication date: July 16, 2020
    Inventors: Nobutake TSUYUNO, Hiromi SHIMAZU, Akihiro NAMBA, Akira MATSUSHITA, Hiroshi HOUZOUJI, Atsuo NISHIHARA, Toshiaki ISHII, Takashi HIRAO
  • Patent number: 10699917
    Abstract: An object is to provide the structure of an ECU enabling resin to be filled without deformation of an electronic circuit board. A resin-sealed vehicle-mounted control device includes: a circuit board; a base member housing the circuit board; and resin filled between the circuit board and the base member. The base member has: a base portion fixing the circuit board; and a side wall opposed to the side surface side of the circuit board. The resin is provided at least between the circuit board and the base portion. The side wall has an opening at any position on the side of the base portion from a position opposed to the side surface side of the electronic circuit board.
    Type: Grant
    Filed: February 1, 2017
    Date of Patent: June 30, 2020
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Maki Ito, Toshiaki Ishii, Yoshio Kawai, Nobutake Tsuyuno, Yujiro Kaneko, Takayuki Fukuzawa, Masahiko Asano
  • Patent number: 10601158
    Abstract: There is a problem that an oxide film or high resistance abrasion powder is formed at the contact interface due to micro sliding abrasion in a high temperature environment or temperature cycle to increase the contact resistance at the contact portion of a non-noble metal connection terminal. Provided is an in-vehicle electronic module, a connector, and a connection structure thereof, which have the same connection reliability as noble metals even when exposed to a harsh environment and can reduce cost of members.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: March 24, 2020
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Ryouichi Kajiwara, Toshiaki Ishii, Masaru Kamoshida
  • Publication number: 20200046284
    Abstract: A system (10) for evaluating a movement of a subject comprises: detection means (111, 112) for detecting a myoelectric signal indicating an activity of a muscle when a subject performs a movement intended to be a predetermined movement comprising a jaw movement, a tongue movement, or a throat movement; processing means (221) for outputting a processed myoelectric signal by applying predetermined processing on the detected myoelectric signal; and determination means (222) for determining a motion level in the predetermined movement of the subject, based on a pattern contained in the processed myoelectric signal.
    Type: Application
    Filed: July 30, 2018
    Publication date: February 13, 2020
    Inventors: Tatsuya SEKI, Toshiaki ISHII, Hiroyuki YAMADA, Fumiyo TAMURA, Takeshi KIKUTANI
  • Patent number: 10448498
    Abstract: The invention provides an in-vehicle controller equipped with a heat radiation coating film which can efficiently radiate heat from a high temperature portion such as a heat generating body to a casing. An in-vehicle controller includes a heat radiation coating film, wherein the heat radiation coating film includes a first region that has a first boundary surface abutting on a base material, and a second region that has a second boundary surface where the heat radiation coating film abuts on air, wherein a thermal conductivity of the first region is higher than that of the second region, and wherein a thermal emissivity of the second region is higher than that of the first region.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: October 15, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Maki Ito, Yuusuke Yasuda, Toshiaki Ishii, Yoshio Kawai, Masahiko Asano
  • Patent number: 10428936
    Abstract: A hydraulic control device that includes a source pressure generating valve that generates a source pressure; a solenoid valve that can supply the engagement pressure based on the source pressure; and a supply pressure switching valve that can be switched between a first state where the supply pressure switching valve can supply the engagement pressure to the second engagement element and a second state where the supply pressure switching valve can supply the source pressure to the second engagement element, the supply pressure switching valve being in the first state when the solenoid valve is operating normally, and being switched to the second state in case of abnormality in the solenoid valve.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: October 1, 2019
    Assignees: AISIN AW CO., LTD., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kenichi Tsuchida, Toshiaki Hayashi, Yuta Seriguchi, Masafumi Takasu, Yoichiro Kimura, Kenichi Ishii, Syuji Moriyama, Yoshinobu Soga, Hiromitsu Nitani, Takafumi Inagaki
  • Patent number: 10396010
    Abstract: Provided is an inexpensive and highly reliable resin sealed-type onboard electronic control device is mounted in a vehicle such as an engine control unit and a control unit for automatic transmission, which have a heat dissipation structure for dissipating heat generated from an electronic component such as a semiconductor element. The onboard control device includes a circuit board, a member provided to face the circuit board, a heat generating electronic component mounted between the circuit board and the member, a heat dissipating material provided between the heat generating electronic component and the member, and a sealing resin to seal the circuit board and the heat generating electronic component. And a space between the member and the circuit board is at least a part of a range where the heat dissipating material is not provided, and is narrower than a range where the heat dissipating material is provided.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: August 27, 2019
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Kazuhiro Suzuki, Toshiaki Ishii, Yoshio Kawai, Yujiro Kaneko
  • Publication number: 20190195146
    Abstract: This valve device includes a body having passages and valve shaft holes, a valve shaft passed through the valve shaft holes in a rotatable manner, and butterfly valves. The butterfly valves include first contour parts and second contour parts forming outer contour parts that are smaller than the first contour parts. The first and second contour parts are fixed to the valve shaft in order to close off the passages at positions set apart from the valve shaft holes toward the downstream side (upstream side) of the passages, and are disposed flanking a straight line parallel to the valve shaft to form prescribed outer contour parts. The body includes first seal parts with which the first contour parts are brought into contact and second seal parts with which the second contour parts are brought into contact within the passages. Fluid leakage in a closed state can thereby be reliably prevented.
    Type: Application
    Filed: April 7, 2017
    Publication date: June 27, 2019
    Applicant: MIKUNI CORPORATION
    Inventor: Toshiaki ISHII
  • Publication number: 20190080931
    Abstract: An object is to provide the structure of an ECU enabling resin to be filled without deformation of an electronic circuit board. A resin-sealed vehicle-mounted control device includes: a circuit board; a base member housing the circuit board; and resin filled between the circuit board and the base member. The base member has: a base portion fixing the circuit board; and a side wall opposed to the side surface side of the circuit board. The resin is provided at least between the circuit board and the base portion. The side wall has an opening at any position on the side of the base portion from a position opposed to the side surface side of the electronic circuit board.
    Type: Application
    Filed: February 1, 2017
    Publication date: March 14, 2019
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Maki ITO, Toshiaki ISHII, Yoshio KAWAI, Nobutake TSUYUNO, Yujiro KANEKO, Takayuki FUKUZAWA, Masahiko ASANO
  • Publication number: 20190032598
    Abstract: This valve device is provided with: a body (10) that has at least one passage (11, 12) for passing a fluid and valve shaft holes (13, 14, 15); a valve shaft (20), which is passed through the valve shaft holes so as to be rotatable; and butterfly valves (30, 40), which are fixed on the valve shaft and are for opening and closing the passages (11, 12). The butterfly valves (30, 40) are disposed so as to close the passages (11, 12) on a downstream side or an upstream side of the valve shaft holes (13, 14, 15) in a flow direction of the fluid. As a result, it is possible to prevent fluid leakage and achieve effective utilization of exhaust heat in an exhaust heat recovery system.
    Type: Application
    Filed: January 26, 2017
    Publication date: January 31, 2019
    Applicant: MIKUNI CORPORATION
    Inventors: Toshio KARASAWA, Toshiaki ISHII, Takashi WATABE
  • Patent number: 10190563
    Abstract: An internal combustion engine ignition coil according to the present invention includes: a central iron core; a primary coil disposed on an outer circumference of the central iron core; a secondary coil disposed on an outer circumference of the primary coil; a side iron core disposed on an outer circumference of the secondary coil; and an insulating material sealing the central iron core, the primary coil, and the secondary coil on an inner side of the side iron core. A first layered silicate having a particle diameter less than a winding diameter of the secondary coil is present at a higher concentration in a vicinity of the secondary coil than that in a vicinity of the side iron core in the insulating material. A second layered silicate having a particle diameter greater than the winding diameter of the secondary coil is present at a higher concentration than that of the first layered silicate between the outer circumference side of the secondary coil and the side iron core.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: January 29, 2019
    Assignee: Hitachi Automotive Systems Hanshin, Ltd.
    Inventors: Masayuki Kamikawa, Nobutake Tsuyuno, Toshiaki Ishii, Yoichi Anzo
  • Publication number: 20190027848
    Abstract: There is a problem that an oxide film or high resistance abrasion powder is formed at the contact interface due to micro sliding abrasion in a high temperature environment or temperature cycle to increase the contact resistance at the contact portion of a non-noble metal connection terminal. Provided is an in-vehicle electronic module, a connector, and a connection structure thereof, which have the same connection reliability as noble metals even when exposed to a harsh environment and can reduce cost of members.
    Type: Application
    Filed: December 22, 2016
    Publication date: January 24, 2019
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Ryouichi KAJIWARA, Toshiaki ISHII, Masaru KAMOSHIDA
  • Patent number: 10186473
    Abstract: An object of the present invention is to provide a power module capable of realizing a superior heat radiation property while satisfying a high insulation property. A power module according to the present invention includes: a conductor plate to which a switching element is connected; a heat radiation plate which is disposed to face the conductor plate; an insulating member which is disposed between the conductor plate and the heat radiation plate; and a conductive intermediate conductor which is disposed in the insulating member in a state of being electrically insulated from the conductor plate and the heat radiation plate, wherein the intermediate conductor has a communication region which communicates between the insulating member disposed on the side of the conductor plate with respect to the intermediate conductor and the insulating member disposed on the side of the heat radiation plate with respect to the intermediate conductor.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: January 22, 2019
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Fusao Hojo, Nobutake Tsuyuno, Toshiaki Ishii, Junpei Kusukawa, Akira Matsushita
  • Patent number: 10128164
    Abstract: An electronic component has a semiconductor element and a thermally conductive support member. A heat sink is disposed on one surface of the circuit body, and a thermally conductive insulating member is interposed between the heat sink and the support member. Input and output terminals and a ground terminal are also provided. A sealing resin is formed to expose a part of each of the input and output terminals and the ground terminal and one surface of the heat sink, and to cover a periphery of the electronic component structure. A main body conductor layer is formed to be insulated from the input and output terminals and cover an immersion region of the sealing resin and one surface of the heat sink immersed in a cooling medium. A ground conductor layer covers at least a part of the ground terminal and is electrically connected with the main body conductor layer.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: November 13, 2018
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Hiroyuki Temmei, Mina Amo, Nobutake Tsuyuno, Takeshi Tokuyama, Toshiaki Ishii, Toshiya Satoh
  • Publication number: 20180277460
    Abstract: Provided is an inexpensive and highly reliable resin sealed-type onboard electronic control device is mounted in a vehicle such as an engine control unit and a control unit for automatic transmission, which have a heat dissipation structure for dissipating heat generated from an electronic component such as a semiconductor element. The onboard control device includes a circuit board, a member provided to face the circuit board, a heat generating electronic component mounted between the circuit board and the member, a heat dissipating material provided between the heat generating electronic component and the member, and a sealing resin to seal the circuit board and the heat generating electronic component. And a space between the member and the circuit board is at least a part of a range where the heat dissipating material is not provided, and is narrower than a range where the heat dissipating material is provided.
    Type: Application
    Filed: August 8, 2016
    Publication date: September 27, 2018
    Applicant: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Kazuhiro SUZUKI, Toshiaki ISHII, Yoshio KAWAI, Yujiro KANEKO