Patents by Inventor Toshiaki Iwafuchi
Toshiaki Iwafuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120211855Abstract: A semiconductor apparatus includes: a first sheet-like member having a light receiving surface of an imaging device and a first connection terminal disposed thereon, the imaging device generating an image by receiving incident light from a light collecting section for collecting external light disposed thereon; a second sheet-like member having a second connection terminal to be connected to the first connection terminal provided thereon; a conductive bonding portion made of a conductive material and bonded with the first connection terminal; and a bonding wire connecting the conductive bonding portion and the second connection terminal, wherein the bonding wire is disposed along the plane of the first sheet-like member such that reflected light from the bonding wire does not impinge on the light receiving surface.Type: ApplicationFiled: January 18, 2012Publication date: August 23, 2012Applicant: Sony CorporationInventors: Toshiaki IWAFUCHI, Masahiko Shimizu
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Patent number: 8101432Abstract: A method of repairing a defective one of devices mounted on substrate is provided. Devices are arrayed on a substrate and electrically connected to wiring lines connected to a drive circuit, to be thus mounted on the substrate. The devices mounted on the substrate are then subjected to an emission test. If a defective device is detected in this test, a repair device is mounted at a position corresponding to a position of the defective device. At this time, after wiring lines connected to the defective device are cut off, the repair device is electrically connected to portions of the wiring lines, the portions of the wiring lines being located at positions nearer to the drive circuit side than the cut-off positions of the wiring lines.Type: GrantFiled: June 14, 2006Date of Patent: January 24, 2012Assignee: Sony CorporationInventors: Toyoharu Oohata, Toshiaki Iwafuchi, Hisashi Ohba
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Image display unit with light emitting devices having a resin surrounding the light emitting devices
Patent number: 7888690Abstract: An image display unit and a method of producing the image display unit, wherein the image display unit includes an array of a plurality of light emitting devices for displaying an image, and wherein the method of producing the image display unit employs, for example, a space expanding transfer, whereby a first transfer step includes transferring the devices arrayed on a first substrate to a temporary holding member such that the devices are spaced from each other with a pitch larger than a pitch of the devices arrayed on the first substrate, a second holding step includes holding the devices on the temporary holding member, and a third transfer step includes transferring the devices held on the temporary holding member onto a second board such that the devices are spaced from each other with a pitch larger than the pitch of the devices held on the temporary holding member.Type: GrantFiled: February 20, 2008Date of Patent: February 15, 2011Assignee: Sony CorporationInventors: Toshiaki Iwafuchi, Toyoharu Oohata, Masato Doi -
Patent number: 7880184Abstract: An image display unit and a method of producing the image display unit, wherein the image display unit includes an array of a plurality of light emitting devices for displaying an image, and wherein the method of producing the image display unit employs, for example, a space expanding transfer, whereby a first transfer step includes transferring the devices arrayed on a first substrate to a temporary holding member such that the devices are spaced from each other with a pitch larger than a pitch of the devices arrayed on the first substrate, a second holding step includes holding the devices on the temporary holding member, and a third transfer step includes transferring the devices held on the temporary holding member onto a second board such that the devices are spaced from each other with a pitch larger than the pitch of the devices held on the temporary holding member.Type: GrantFiled: April 30, 2003Date of Patent: February 1, 2011Assignee: Sony CorporationInventors: Toshiaki Iwafuchi, Toyoharu Oohata, Masato Doi
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Patent number: 7763139Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.Type: GrantFiled: October 23, 2006Date of Patent: July 27, 2010Assignee: Sony CorporationInventors: Kunihiko Hayashi, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi, Hisashi Ohba
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Patent number: 7723764Abstract: A method of repairing a defective one of devices mounted on substrate is provided. Devices are arrayed on a substrate and electrically connected to wiring lines connected to a drive circuit, to be thus mounted on the substrate. The devices mounted on the substrate are then subjected to an emission test. If a defective device is detected in this test, a repair device is mounted at a position corresponding to a position of the defective device. At this time, after wiring lines connected to the defective device are cut off, the repair device is electrically connected to portions of the wiring lines, the portions of the wiring lines being located at positions nearer to the drive circuit side than the cut-off positions of the wiring lines.Type: GrantFiled: May 25, 2006Date of Patent: May 25, 2010Assignee: Sony CorporationInventors: Toyoharu Oohata, Toshiaki Iwafuchi, Hisashi Ohba
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Patent number: 7705351Abstract: A semiconductor device includes: a circuit board; a semiconductor chip mounted over the circuit board with a predetermined gap therebetween and electrically connected to the circuit board by a protruding electrode; a first resin material filled into the gap between the circuit board and the semiconductor chip; a second resin material that seals the semiconductor chip mounted over the circuit board; a first reflector which is formed on a surface of the circuit board on the semiconductor chip side and reflects a predetermined testing light; and a second reflector which is formed on a surface of the semiconductor chip on the circuit board side and reflects the predetermined testing light.Type: GrantFiled: January 8, 2007Date of Patent: April 27, 2010Assignee: Sony CorporationInventors: Nobuaki Ikebe, Toshiaki Iwafuchi, Michihiro Satou, Yuji Yamagata
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Publication number: 20090103292Abstract: An image display unit and a method of producing the image display unit, wherein the image display unit includes an array of a plurality of light emitting devices for displaying an image, and wherein the method of producing the image display unit employs, for example, a space expanding transfer, whereby a first transfer step includes transferring the devices arrayed on a first substrate to a temporary holding member such that the devices are spaced from each other with a pitch larger than a pitch of the devices arrayed on the first substrate, a second holding step includes holding the devices on the temporary holding member, and a third transfer step includes transferring the devices held on the temporary holding member onto a second board such that the devices are spaced from each other with a pitch larger than the pitch of the devices held on the temporary holding member.Type: ApplicationFiled: February 20, 2008Publication date: April 23, 2009Applicant: SONY CORPORATIONInventors: Toshiaki Iwafuchi, Toyoharu Oohata, Masato Doi
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Patent number: 7462879Abstract: A display device is formed by burying at least part of a light emitting device in an insulating material, wherein a drive electrode for the light emitting device is formed so as to be extracted on a surface of the insulating material. A display unit is produced by two-dimensionally arraying such light emitting devices on a base body. Since the display device is modularized by burying a light emitting device finely formed in an insulating material, to re-shape the light emitting device into a size easy to handle, it is possible to suppress the production cost of the display unit using such display devices, and to ensure a desirable handling performance of the light emitting device; for example, facilitate the carrying of the light emitting device or the mounting thereof on a base body.Type: GrantFiled: March 23, 2005Date of Patent: December 9, 2008Assignee: Sony CorporationInventors: Toyoharu Oohata, Hideharu Nakajima, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi
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Publication number: 20080144048Abstract: A semiconductor device includes: a circuit board; a semiconductor chip mounted over the circuit board with a predetermined gap therebetween and electrically connected to the circuit board by a protruding electrode; a first resin material filled into the gap between the circuit board and the semiconductor chip; a second resin material that seals the semiconductor chip mounted over the circuit board; a first reflector which is formed on a surface of the circuit board on the semiconductor chip side and reflects a predetermined testing light; and a second reflector which is formed on a surface of the semiconductor chip on the circuit board side and reflects the predetermined testing light.Type: ApplicationFiled: January 8, 2007Publication date: June 19, 2008Inventors: Nobuaki Ikebe, Toshiaki Iwafuchi, Michihiro Satou, Yuji Yamagata
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Patent number: 7297566Abstract: A display device is formed by burying at least part of a light emitting device in an insulating material, wherein a drive electrode for the light emitting device is formed so as to be extracted on a surface of the insulating material. A display unit is produced by two-dimensionally arraying such light emitting devices on a base body. Since the display device is modularized by burying a light emitting device finely formed in an insulating material, to re-shape the light emitting device into a size easy to handle, it is possible to suppress the production cost of the display unit using such display devices, and to ensure a desirable handling performance of the light emitting device; for example, facilitate the carrying of the light emitting device or the mounting thereof on a base body.Type: GrantFiled: April 11, 2005Date of Patent: November 20, 2007Assignee: Sony CorporationInventors: Toyoharu Oohata, Hideharu Nakajima, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi
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Patent number: 7297985Abstract: A display device is formed by burying at least part of a light emitting device in an insulating material, wherein a drive electrode for the light emitting device is formed so as to be extracted on a surface of the insulating material. A display unit is produced by two-dimensionally arraying such light emitting devices on a base body. Since the display device is modularized by burying a light emitting device finely formed in an insulating material, to re-shape the light emitting device into a size easy to handle, it is possible to suppress the production cost of the display unit using such display devices, and to ensure a desirable handling performance of the light emitting device; for example, facilitate the carrying of the light emitting device or the mounting thereof on a base body.Type: GrantFiled: May 15, 2002Date of Patent: November 20, 2007Assignee: Sony CorporationInventors: Toyoharu Oohata, Hideharu Nakajima, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi
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Patent number: 7289089Abstract: A light emitting unit represented by an image display unit includes chips, each of which is formed by burying a light emitting device such as a GaN based semiconductor light emitting device in a resin, wherein external terminals connected to the light emitting device buried in each chip are provided on the chip, and a drive control device such as a pixel transistor for controlling the drive of the light emitting device are connected to the external terminals in a state being at least partially overlapped to the chip. Such an image display unit is advantageous in improving a device density such as a pixel density, enhancing the connection reliability by increasing the diameters of via-holes for wiring without excessively reducing the size of each chip, improving the fabrication yield, facilitating the handling of the chip (or device) at the time of bonding by increasing the apparent area of the chip (or device), and lowering the required specification in terms of alignment accuracy of the chip (or device).Type: GrantFiled: August 2, 2002Date of Patent: October 30, 2007Assignee: Sony CorporationInventor: Toshiaki Iwafuchi
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Patent number: 7233030Abstract: A device transfer method includes the steps of: covering a plurality of devices, which have been formed on a substrate, with a resin layer; forming electrodes in the resin layer in such a manner that the electrodes are connected to the devices; cutting the resin layer, to obtain resin buried devices each containing at least one of the devices; and peeling the resin buried devices from the substrate and transferring them to a device transfer body. This device transfer method is advantageous in easily, smoothly separating devices from each other, and facilitating handling of the devices in a transfer step and ensuring good electric connection between the devices and external wiring, even if the devices are fine devices.Type: GrantFiled: December 23, 2003Date of Patent: June 19, 2007Assignee: Sony CorporationInventors: Yoshiyuki Yanagisawa, Toyoharu Oohata, Toshiaki Iwafuchi
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Publication number: 20070087644Abstract: A method of producing the image display unit, wherein the image display unit includes an array of a plurality of light emitting devices for displaying an image, and wherein the method of producing the image display unit employs, for example, a space expanding transfer, whereby a first transfer step includes transferring the devices arrayed on a first substrate to a temporary holding member such that the devices are spaced from each other with a pitch larger than a pitch of the devices arrayed on the first substrate, a second holding step includes holding the devices on the temporary holding member, and a third transfer step includes transferring the devices held on the temporary holding member onto a second board such that the devices are spaced from each other with a pitch larger than the pitch of the devices held on the temporary holding member.Type: ApplicationFiled: November 10, 2006Publication date: April 19, 2007Applicant: Sony CorporationInventors: Toshiaki Iwafuchi, Toyoharu Oohata, Masato Doi
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Patent number: 7205213Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.Type: GrantFiled: March 14, 2005Date of Patent: April 17, 2007Assignee: Sony CorporationInventors: Kunihiko Hayashi, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi, Hisashi Ohba
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Patent number: 7205212Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.Type: GrantFiled: March 14, 2005Date of Patent: April 17, 2007Assignee: Sony CorporationInventors: Kunihiko Hayashi, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi, Hisashi Ohba
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Patent number: 7205214Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.Type: GrantFiled: March 14, 2005Date of Patent: April 17, 2007Assignee: Sony CorporationInventors: Kunihiko Hayashi, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi, Hisashi Ohba
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Patent number: 7195687Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.Type: GrantFiled: December 22, 2004Date of Patent: March 27, 2007Assignee: Sony CorporationInventors: Kunihiko Hayashi, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi, Hisashi Ohba
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Publication number: 20070048891Abstract: A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate.Type: ApplicationFiled: October 23, 2006Publication date: March 1, 2007Applicant: Sony CorporationInventors: Kunihiko Hayashi, Yoshiyuki Yanagisawa, Toshiaki Iwafuchi, Hisashi Ohba