Abstract: An insulating substrate is prepared. In this substrate, plural via holes penetrating in a thickness direction are filled with a conductive paste. This paste is produced by adding an organic solvent to a powder of an, and by processing the power of the alloy to a paste. The substrate is then pressed from a front surface and a back surface of the substrate, while being heated. The conductive paste is solid-phase sintered and interlayer connecting members are formed. A front surface protective member is disposed on a front surface of the substrate and a back surface protective member is disposed on a back surface of the substrate, and a laminate is formed. The laminate is integrated by a lower pressure being applied while heating at a lower temperature, compared to the temperature and pressure in the process of forming the interlayer connecting members.

Abstract: As the first conductive paste, a paste is used which is made by adding an organic solvent to powder of alloy in which a plurality of atoms keep a given crystal structure constant. As the second conductive paste, a paste is used which is made by adding an organic solvent to powder of metal different in kind from the alloy. In a step of making the stack body, cavities are formed in the stack body. In a uniting step, the cavities work to facilitate flow of thermoplastic resin to absorb pressure acting in a direction different from a direction in which pressure exerted on the first conductive paste to unite the stack body, thereby resulting in an increase in pressure for the uniting to solid-state sinter the first conductive paste to make the first layer-to-layer connecting member.

Abstract: To provide a heat generating device which is capable of minimizing the application of a large amount of heat through a contact with the heat generating device. The heat generating device includes an insulating base which contains a thermoplastic resin and has a front surface and a reverse surface and in which a plurality of via holes are formed to extend through a thickness, and heating resistors which are disposed in the via holes and generated heat when energized. Some of the heating resistors are connected in parallel.

Abstract: In a method of making a multilayer wiring board having a substrate and a wiring pattern formed in the substrate, base films are stacked in a predetermined direction to form a stacked film structure. Each base film includes thermoplastic resin. Pressure and heat are applied to the stacked film structure from its both sides in the stacked direction so that the base films are joined together to form the substrate. At least one of the base films is a combined film including a fiber sheet. Both sides of the fiber sheet are covered with the thermoplastic resin in such a manner that air space remains in the fiber sheet.

Abstract: In a printed circuit board manufacturing equipment, a pressing die includes a first pressing part, a second pressing part, and a frame part. A buffer member is disposed between a first surface of a laminated body and the first pressing part. The second pressing part has a portion facing a second surface of the laminated body and a portion facing the buffer member. The frame part surrounds a whole area of a side surface of the buffer member. Before pressing and heating, the laminated body, the second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member deformed due to the pressing. A lip protrudes from the frame part toward the laminated body. The lip is deformed following the deformation of the buffer member and comes in contact with a surface of the second pressing part facing the buffer member.

Abstract: A method of soil improvement work drills the ground with a drilling head arranged at a lower end of a rotary shaft and sends the rotary shaft into the ground. The method mixes pressurized water with compressed air on the ground, to prepare a fluid mixture, feeds the fluid mixture through a feed path arranged along the rotary shaft into an ejector arranged on the drilling head, and ejects the fluid mixture from the ejector toward the ground to drill. An envelope defined by a front end of the drilling head has a conical shape.

Abstract: In a printed circuit board manufacturing equipment, a pressing die includes a first pressing part, a second pressing part, and a frame part. A buffer member is disposed between a first surface of a laminated body and the first pressing part. The second pressing part has a portion facing a second surface of the laminated body and a portion facing the buffer member. The frame part surrounds a whole area of a side surface of the buffer member. Before pressing and heating, the laminated body, the second pressing part, and the buffer member define an escape space therebetween for escaping the buffer member deformed due to the pressing. A lip protrudes from the frame part toward the laminated body. The lip is deformed following the deformation of the buffer member and comes in contact with a surface of the second pressing part facing the buffer member.

Abstract: A workpiece holding method and holding system able to shorten the workpiece attachment/detachment time, wherein pressurized air is circulated through a nozzle of an ejector unit of a chuck at all times to make the inside of a suction chamber a negative pressure before chucking a workpiece, completion of chucking is detected based on a pressure value detected by a pressure sensor after chucking the workpiece, and the workpiece is unchucked by having a valve close an exhaust port to raise the pressure inside an exhaust chamber and introducing pressurized air from the ejector unit to the suction chamber.

Abstract: In a method of making a multilayer wiring board having a substrate and a wiring pattern formed in the substrate, base films are stacked in a predetermined direction to form a stacked film structure. Each base film includes thermoplastic resin. Pressure and heat are applied to the stacked film structure from its both sides in the stacked direction so that the base films are joined together to form the substrate. At least one of the base films is a combined film including a fiber sheet. Both sides of the fiber sheet are covered with the thermoplastic resin in such a manner that air space remains in the fiber sheet.

Abstract: A dummy work (DW: a work for printing a reference necessary for subsequent printing) is moved to a printing position while the dummy work is fixed to a work alignment mechanism 2, and solder printing is made. The printed dummy work is then returned to the work alignment position and its image is taken by image processing cameras 7 and an image of position coordinates of a solder bump specified for alignment is stored. Positioning of subsequent works W is conducted on the basis of the image of the dummy work stored and solder printing of the works is subsequently made at the printing position.

Abstract: A method of soil improvement work drills the ground with a drilling head arranged at a lower end of a rotary shaft and sends the rotary shaft into the ground. The method mixes pressurized water with compressed air on the ground, to prepare a fluid mixture, feeds the fluid mixture through a feed path arranged along the rotary shaft into an ejector arranged on the drilling head, and ejects the fluid mixture from the ejector toward the ground to drill. An envelope defined by a front end of the drilling head has a conical shape.

Abstract: The present invention provides a recycler that recycles a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. The insulating body base of the printed circuit board as the waste printed circuit board can be a thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material. The recycler includes a pressuring device that pressurizes the waste printed circuit board, a heater that heats the waste printed circuit board to a predetermined temperature at which the waste printed circuit board is at least softened, and a filter that filters the resin material from the waste printed circuit board. The heater can be maintain the filter at the predetermined temperature provided by the heater.

Abstract: A workpiece holding method and holding system able to shorten the workpiece attachment/detachment time, wherein pressurized air is circulated through a nozzle of an ejector unit of a chuck at all times to make the inside of a suction chamber a negative pressure before chucking a workpiece, completion of chucking is detected based on a pressure value detected by a pressure sensor after chucking the workpiece, and the workpiece is unchucked by having a valve close an exhaust port to raise the pressure inside an exhaust chamber and introducing pressurized air from the ejector unit to the suction chamber.

Abstract: A liquid (10) stored in a generation chamber (2) is sprayed by an injection nozzle (33) using pressurized gas introduced to it. This strikes a buffer valve (4) where it is atomized. The generated mist is held in the generation chamber (2). The atomized generated mist is introduced into a particle classifier (5) and made to collide with a collision plate (52). The particles of less than 10 ?m size bouncing off the collision plate are discharged as a micro-mist from a discharge port (56) and fed to a target workpiece. The large particles deposited on the collision plate are recovered in a generator.

Abstract: The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material.

Abstract: A dummy work (DW: a work for printing a reference necessary for subsequent printing) is moved to a printing position while the dummy work is fixed to a work alignment mechanism 2, and solder printing is made. The printed dummy work is then returned to the work alignment position and its image is taken by image processing cameras 7 and an image of position coordinates of a solder bump specified for alignment is stored. Positioning of subsequent works W is conducted on the basis of the image of the dummy work stored and solder printing of the works is subsequently made at the printing position.

Abstract: A printing mechanism 6 of a screen printing machine 1 for printing paste P at a printing position to a work W through a screen S includes a packing nozzle 62 coming into contact, at the distal end thereof, with the screen, a packing head 62 to which the paste consumed during printing is packed and a feed tank 63 for supplying the paste to the filling head. Each of the packing head and the feed tank has therein an extrusion mechanism 62b, 63a and can control an extrusion pressure of the paste to the screen. The printing mechanism further includes a packing head supporting mechanism 64 capable of supporting the packing head in such a manner as to be capable of moving up and down and also capable of regulating the pushing force of the packing head onto the screen.

Abstract: To supply microfine liquid droplets to a microscopic space for enabling micromachining and provide a method and an apparatus for forming the microfine liquid droplets, there is provided a method and an apparatus for generating liquid fine particles, comprising atomizing a liquid, fractionating the atomized liquid particles to form microfine liquid droplets by inertial fractionation and contacting the microfine liquid droplets with a heated carrier gas, thereby thermally drying the liquid particles to form finer particles.

Abstract: The present invention provides a method and apparatus of recycling a printed circuit board for separating and retrieving a metallic material, which includes a printed metallic material, and an insulating material, both composing the printed circuit board. Both the metallic material and the insulating material, which are separated and retrieved, are possible for recycling. In the method for recycling the printed circuit board, hot filtration equipment 4a and resin-metal separation equipment 51 are used in hot filtration process P400. The waste printed circuit board 1 is heated and force-filtered so that only the insulating material 1a pass through the filter. Then, the insulating material 1a and the metallic material 1b are separated and retrieved. It is preferred that the insulating body base 23 of the printed circuit board 100 as the waste printed circuit board is made of thermoplastic resin or a mixture of thermoplastic resin and inorganic loading material.

Abstract: A method for filling a fluidized material into a hole having a bottom, the hole disposed on one surface of a sheet member, the method includes the steps of: depressurizing a first closed space, which is formed on the one surface of the sheet member; depressurizing a second closed space, which is adjacent to the first closed space and accumulates the fluidized material; displacing the hole together with the sheet member to the second closed space, the hole depressurized in the first closed space; applying the fluidized material on the surface of the sheet member; and filling the applied fluidized material into the hole.