Patents by Inventor Toshikazu Kondo

Toshikazu Kondo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100190907
    Abstract: A rubber composition for tires, which includes a rubber component containing a natural rubber component consisting of at least either a natural rubber or an epoxidized natural rubber, and an inorganic filler containing silica, and a pneumatic tire using such a rubber composition for tires are provided. The rubber composition can be used as a rubber composition for clinch apex, and in this case, the rubber component preferably consists of the natural rubber component, with the inorganic filler being contained in a range of 50 to 80 parts by mass and carbon black being contained in a range of 2 to 5 parts by mass relative to 100 parts by mass of the rubber component.
    Type: Application
    Filed: March 7, 2008
    Publication date: July 29, 2010
    Inventors: Yoichi Mizuno, Toshikazu Kondo
  • Publication number: 20100174023
    Abstract: Provided are a rubber composition for sidewalls containing 100 parts by mass of a rubber component consisting of at least a natural rubber or a modified natural rubber, 5 parts by mass or less of carbon black, 10 to 40 parts by mass of silica and 5 to 30 parts by mass of an inorganic filler component composed of one kind or two or more kinds of inorganic filler excluding carbon black and silica, and a pneumatic tire provided with a sidewall rubber prepared using the rubber composition. The used amounts of raw materials derived from petroleum resources have been reduced in this rubber composition. Moreover, the rubber composition exhibits low fuel consumption due to low rolling resistance and good flex crack growth resistance.
    Type: Application
    Filed: March 7, 2008
    Publication date: July 8, 2010
    Inventor: Toshikazu Kondo
  • Publication number: 20090204305
    Abstract: A turbine bypass control method includes: a high-pressure side pressure controller configured to output a first operation amount signal corresponding to a valve opening; a low-pressure side pressure controller configured to output a second operation amount signal corresponding to a valve opening; a high value selector configured to output as a high value operation amount signal, one of the first operation amount signal and the second operation amount signal which indicates a larger opening; a first signal switching unit configured to receive the high value operation amount signal and the second operation amount signal and output a first bypass valve operation amount signal; a second signal switching unit configured to receive the high value operation amount signal and the first operation amount signal and output a second bypass valve operation amount signal; and a rapid opening controller.
    Type: Application
    Filed: February 4, 2009
    Publication date: August 13, 2009
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Naohiko ISHIBASHI, Takehiro ISHIGAKI, Toshikazu KONDO
  • Patent number: 7105277
    Abstract: The present invention aims to provide a printing plate capable of preventing paste of high viscosity adhering to an edge of a squeegee from being transferred to and left on a through hole of a printed circuit board when the paste is being filled by a squeegeeing method. The printing plate has a metal sheet (3) provided with a squeegee cleaning section (7) formed thereon and fixed to the back surface of a slanting area (5) of mask (2) attached to a plate framework (1). The through hole of the printed circuit board is filled with paste only after paste of high viscosity adhering to the edge of the squeegee is removed by the squeegee cleaning section (7), to prevent the paste from being left on the through hole, and thereby achieving the printed circuit board of excellent quality.
    Type: Grant
    Filed: September 19, 2003
    Date of Patent: September 12, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiaki Takenaka, Toshihiro Nishii, Hideaki Komoda, Toshikazu Kondo, Shinji Nakamura
  • Patent number: 7066344
    Abstract: A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be maintained, and peeling between the mask film and prepreg sheet can be prevented. Further, by preventing the fusing adhesion between the mask film and prepreg sheet due to heat generated when forming penetration holes, a circuit board having an excellent quality is obtained.
    Type: Grant
    Filed: January 9, 2003
    Date of Patent: June 27, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiaki Takenaka, Toshikazu Kondo, Kunio Kishimoto, Shinji Nakamura, Fumio Echigo
  • Patent number: 7018672
    Abstract: A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.
    Type: Grant
    Filed: December 4, 2001
    Date of Patent: March 28, 2006
    Assignee: Matushita Electric Industrial Co., Ltd.
    Inventors: Toshiaki Takenaka, Toshihiro Nishii, Yuichiro Sugita, Shinji Nakamura, Hideaki Komoda, Toshikazu Kondo
  • Patent number: 6962352
    Abstract: A gasket provided with a sliding-treated layer on the surface of a fluorine rubber gasket body. The sliding-treated layer is a baked coated film of a sliding treating agent. The sliding treating agent is an aqueous emulsion containing a solid lubricant, an urethane-based resin as a matrix, and a reactive group-coupled alkyltrialkoxysilane series compound represented by the following chemical formula as an adherability modifier. X—CnH2n—Si(OR)3 {wherein X (reactive group) is an amino-containing group or an epoxy-containing group, n is a natural number of 2 to 4, and R is an alkyl group having a carbon number of 1 to 3}.
    Type: Grant
    Filed: July 25, 2003
    Date of Patent: November 8, 2005
    Assignees: Toyoda Gosei Co., Ltd., Tokyo Silicone Co., Ltd.
    Inventors: Hiroyuki Sato, Takahiro Asai, Toshikazu Kondo, Hirokazu Fujimo
  • Publication number: 20040248041
    Abstract: The present invention aims to provide a printing plate capable of preventing paste of high viscosity adhering to an edge of a squeegee from being transferred to and left on a through hole of a printed circuit board when the paste is being filled by a squeegeeing method. The printing plate has a metal sheet (3) provided with a squeegee cleaning section (7) formed thereon and fixed to the back surface of a slanting area (5) of mask (2) attached to a plate framework (1). The through hole of the printed circuit board is filled with paste only after paste of high viscosity adhering to the edge of the squeegee is removed by the squeegee cleaning section (7), to prevent the paste from being left on the through hole, and thereby achieving the printed circuit board of excellent quality.
    Type: Application
    Filed: March 23, 2004
    Publication date: December 9, 2004
    Inventors: Toshiaki Takenaka, Toshihiro Nishii, Hideaki Komoda, Toshikazu Kondo, Shinji Nakamura
  • Patent number: 6776090
    Abstract: A circuit board with high quality is provided by preventing the falling of paste which comes around to the squeegee complementary angle side during the pattern printing or paste filling by the squeegeeing method. While lowering, the squeegee is passed through the inclined portion of a paste removing section (3) provided on a mask (2) before pattern printing or paste filling, whereby the paste on the non-printing side (complementary angle) of the squeegee can be removed; thus, a circuit board superior in quality is obtained.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: August 17, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiaki Takenaka, Toshikazu Kondo, Mitsunori Maeda, Hiroshi Tahara, Shinji Nakamura, Yuichiro Sugita
  • Publication number: 20040155413
    Abstract: A gasket provided with a sliding-treated layer on the surface of a fluorine rubber gasket body. The sliding-treated layer is a baked coated film of a sliding treating agent. The sliding treating agent is an aqueous emulsion containing a solid lubricant, an urethane-based resin as a matrix, and a reactive group-coupled alkyltrialkoxysilane series compound represented by the following chemical formula as an adherability modifier.
    Type: Application
    Filed: July 25, 2003
    Publication date: August 12, 2004
    Inventors: Hiroyuki Sato, Takahiro Asai, Toshikazu Kondo, Hirokazu Fujino
  • Patent number: 6694612
    Abstract: A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be maintained, and peeling between the mask film and prepreg sheet can be prevented. Further, by preventing the fusing adhesion between the mask film and prepreg sheet due to heat generated when forming penetration holes, a circuit board having an excellent quality is obtained.
    Type: Grant
    Filed: May 18, 2000
    Date of Patent: February 24, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshiaki Takenaka, Toshikazu Kondo, Kunio Kishimoto, Shinji Nakamura, Fumio Echigo
  • Publication number: 20030153197
    Abstract: A mask film includes a base material, a parting layer and a non-parting portion placed on the base material. Accordingly, an optimum adhesion strength of the mask film and a prepreg sheet can be maintained, and peeling between the mask film and prepreg sheet can be prevented. Further, by preventing the fusing adhesion between the mask film and prepreg sheet due to heat generated when forming penetration holes, a circuit board having an excellent quality is obtained.
    Type: Application
    Filed: January 9, 2003
    Publication date: August 14, 2003
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Toshiaki Takenaka, Toshikazu Kondo, Kunio Kishimoto, Shinji Nakamura, Fumio Echigo
  • Publication number: 20030138553
    Abstract: A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.
    Type: Application
    Filed: November 21, 2002
    Publication date: July 24, 2003
    Inventors: Toshiaki Takenaka, Toshihiro Nishii, Yuichiro Sugita, Shinji Nakamura, Hideaki Komoda, Toshikazu Kondo
  • Publication number: 20020178942
    Abstract: A circuit board with high quality is provided by preventing the falling of paste which comes around to the squeegee complementary angle side during the pattern printing or paste filling by the squeegeeing method. While lowering, the squeegee is passed through the inclined portion of a paste removing section (3) provided on a mask (2 ) before pattern printing or paste filling, whereby the paste on the non-printing side (complementary angle) of the squeegee can be removed; thus, a circuit board superior in quality is obtained.
    Type: Application
    Filed: January 3, 2002
    Publication date: December 5, 2002
    Inventors: Toshiaki Takenaka, Toshikazu Kondo, Mitsunori Maeda, Hiroshi Tahara, Shinji Nakamura, Yuichiro Sugita
  • Patent number: 4769059
    Abstract: A glass melting furnace includes a furnace body including for storing molten glass, an upstanding tank including a bottom member lying flush with the bottom wall of the furnace body and a rear wall remote from the furnace body, the upstanding tank communicating with the furnace body, a feeder disposed upwardly of the rear wall of the upstanding tank and communicating with the upstanding tank, and a drainage mechanism disposed in a corner defined between the rear wall and bottom member of the upstanding tank for draining out heterogeneous molten glass. The upstanding tank has a width smaller than the width of the furnace body. The drainage mechanism comprises a through hole having an inlet opening into the upstanding tank and an outlet opening at a rear surface of the rear wall, the through hole being tapered from the inlet toward the outlet.
    Type: Grant
    Filed: July 27, 1987
    Date of Patent: September 6, 1988
    Assignee: Nippon Sheet Glass Co., Ltd.
    Inventors: Tadakazu Hidai, Toshikazu Kondo
  • Patent number: 4732601
    Abstract: An apparatus for producing a plate glass which comprises(A) a melter for storing a molten glass material,(B) a molding portion for molding the molten glass material from the melter into a plate,(C) a temperature adjusting tank located between the melter and the molding portion for maintaining the molten glass material from the melter at a uniform temperature, said temperature adjusting tank having a glass material channel for introducing the molten glass material maintained at the uniform temperature into the molding portion in a position facing on the molding portion, and(D) a tweel for adjusting a flow rate of the glass material which is raisable and lowerable in the glass material channel and has a hole through which a surface layer stream of the molten glass material can be separated and passed in the glass material channel.
    Type: Grant
    Filed: February 26, 1987
    Date of Patent: March 22, 1988
    Assignee: Nippon Sheet Glass Co., Ltd.
    Inventors: Tadakazu Hidai, Toshikazu Kondo