Abstract: The invention is directed to a control station for a soldering system capable of operating with various types of soldering devices, including various soldering tip configurations, and a program and database of operating parameters that the control station utilizes to identify preferred or optimal power delivery settings for each type of soldering tip size, type of solder and type of work to be soldered so as to have the soldering control station generate and display a suggestion as to the power level settings and requirements for the optimum soldering conditions to users.

Abstract: A cartridge for a soldering system that is capable of being powered by a 400 Watt power supply and which includes a pair of sensors to provide precise and rapid control over the temperature of the soldering cartridge tip.

Abstract: The object of the invention is to provide a nozzle for a desoldering tool that facilitates the removal of solder from components having a large difference between the width and thickness dimensions of the solder connection. The present application discloses a nozzle for use with a desoldering tool for melting and sucking solder away. The nozzle includes a distal end surface which is heated to a temperature melting the solder. The distal end surface, as an upstream end of a molten solder suction path, defines a non-circular elongated generally oval shaped opening.

Abstract: A desoldering tool and control system including enhanced features for detecting solder clogging as well as on-delay and sleep mode functions to enhance the life of the desoldering tool components.

Abstract: A desoldering tool and control system including enhanced features for detecting solder clogging as well as on-delay and sleep mode functions to enhance the life of the desoldering tool components.

Abstract: The object of the invention is to provide a nozzle for a desoldering tool that facilitates the removal of solder from components having a large difference between the width and thickness dimensions of the solder connection. The present application discloses a nozzle for use with a desoldering tool for melting and sucking solder away. The nozzle includes a distal end surface which is heated to a temperature melting the solder. The distal end surface, as an upstream end of a molten solder suction path, defines a non-circular elongated generally oval shaped opening.

Abstract: A soldering assembly comprises a heater, a lock member, and a bias member. The lock member is moveable relative to the heater, includes a ramp feature, and is configured to receive a tip or a tip holder. The bias member is configured to urge movement of the lock member away from a distal segment of the heater.

Abstract: A soldering assembly comprises a heater, a lock member, and a bias member. The lock member is moveable relative to the heater, includes a ramp feature, and is configured to receive a tip or a tip holder. The bias member is configured to urge movement of the lock member away from a distal segment of the heater.

Abstract: An air filter assembly has a fan, pre-filter, a main filter, and a control circuit which generates various signals to the user as to when the pre-filter and the main filter should be replaced. The control circuit detects when the pre-filter should be replaced from two conditions: a first pre-filter replacement condition based decreased air flow, and a second pre-filter replacement condition based on cumulative operating time. The control circuit detects when the main filter should be replaced based on a formula containing a number of the occurrences of the first pre-filter replacement condition and a number of occurrences of the second pre-filter replacement condition. The control circuit also detects a main filter replacement condition based on cumulative operating time of main filter. The main filter can have a fuse that is blown when the main filter should be replaced.

Abstract: An air filter assembly has a fan, pre-filter, a main filter, and a control circuit which generates various signals to the user as to when the pre-filter and the main filter should be replaced. The control circuit detects when the pre-filter should be replaced from two conditions: a first pre-filter replacement condition based decreased air flow, and a second pre-filter replacement condition based on cumulative operating time. The control circuit detects when the main filter should be replaced based on a formula containing a number of the occurrences of the first pre-filter replacement condition and a number of occurrences of the second pre-filter replacement condition. The control circuit also detects a main filter replacement condition based on cumulative operating time of main filter. The main filter can have a fuse that is blown when the main filter should be replaced.

Abstract: A solder handling temperature controller comprises a body (10) of the solder handling temperature controller, a rotating shaft (77) housed in the body (10) and adapted to be rotatable about its axis, a set temperature changing means (75) adapted to change a set temperature according to a rotation angle of the rotating shaft (77), a rotary knob (20) supported by the body (10) in a rotatable manner relative to the rotating shaft (77), and a temperature lock key (40) adapted to be selectively insertable into and withdrawable from the body (10) in a position coaxial with the rotating shaft (77) and the knob (20), and, in an inserted state thereof, to mechanically couple the rotating shaft (77) and the knob (20) together to allow them to be interlockingly rotated, wherein, when the temperature lock key (40) is withdrawn from the body (10), the coupling between the rotating shaft (77) and the knob (20) is released to prohibit the change of the set temperature by the rotation of the knob (20).

Abstract: A solder handling temperature controller comprises a body (10) of the solder handling temperature controller, a rotating shaft (77) housed in the body (10) and adapted to be rotatable about its axis, a set temperature changing means (75) adapted to change a set temperature according to a rotation angle of the rotating shaft (77), a rotary knob (20) supported by the body (10) in a rotatable manner relative to the rotating shaft (77), and a temperature lock key (40) adapted to be selectively insertable into and withdrawable from the body (10) in a position coaxial with the rotating shaft (77) and the knob (20), and, in an inserted state thereof, to mechanically couple the rotating shaft (77) and the knob (20) together to allow them to be interlockingly rotated, wherein, when the temperature lock key (40) is withdrawn from the body (10), the coupling between the rotating shaft (77) and the knob (20) is released to prohibit the change of the set temperature by the rotation of the knob (20).

Abstract: This invention provides a system capable of melting solder and removing the melted solder from a substrate. The heating system includes a desoldering tool having at least two handles, a first handle and a second handle. This way, an operator may grip the first handle or the second handle depending on the operator's preference of gripping the desoldering tool. The first handle has a cavity adapted to releaseably receive a storage where the melted solder can be deposited and stored. The storage may have a divot adapted to receive a key from the first handle so that the storage may be orientated in a predetermined position relative to the cavity. The cavity in the first handle is exposed so that the storage can be readily inserted or replaced. This allows the operator to easily replace and maintain the desoldering tool without a significant downtime.