Soldering controller
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Description
The portion shown by broken lines is for illustrative purposes only and forms no part of the claimed design. The dashed lines show a borderline between the claimed design and other portion.
Claims
The ornamental design for a soldering controller, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
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| D490448 | May 25, 2004 | Ishihara |
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| 3450845 | June 2005 | CN |
Patent History
Patent number: D590853
Type: Grant
Filed: Nov 10, 2007
Date of Patent: Apr 21, 2009
Assignee: Hakko Corporation (Osaka)
Inventors: Tetsuo Yokoyama (Osaka), Toshikazu Mochizuki (Osaka)
Primary Examiner: Sandra Snapp
Assistant Examiner: Patricia Palasik
Attorney: Squire, Sanders & Dempsey, L.L.P.
Application Number: 29/297,439
Type: Grant
Filed: Nov 10, 2007
Date of Patent: Apr 21, 2009
Assignee: Hakko Corporation (Osaka)
Inventors: Tetsuo Yokoyama (Osaka), Toshikazu Mochizuki (Osaka)
Primary Examiner: Sandra Snapp
Assistant Examiner: Patricia Palasik
Attorney: Squire, Sanders & Dempsey, L.L.P.
Application Number: 29/297,439
Classifications
Current U.S. Class:
Solid Material Melting, E.g., Solder, Etc. (D15/144.2)