Patents by Inventor Toshiki Naito

Toshiki Naito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120262054
    Abstract: A reflecting resin sheet provides a reflecting resin layer at the side of a light emitting diode element and includes a first release substrate and the reflecting resin layer provided on one surface in a thickness direction of the first release substrate. In the first release substrate and the reflecting resin layer, a through hole extending therethrough in the thickness direction is formed corresponding to the light emitting diode element so as to allow an inner circumference surface of the through hole in the reflecting resin layer to be disposed in opposed relation to a side surface of the light emitting diode element.
    Type: Application
    Filed: April 13, 2012
    Publication date: October 18, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yasunari OOYABU, Hisataka ITO, Toshiki NAITO
  • Publication number: 20120261681
    Abstract: A method for producing a light emitting transfer sheet includes the steps of preparing a light emitting element sheet including a light semiconductor layer connected to an electrode portion on one side surface and a phosphor layer laminated on the other side surface; dividing the light emitting element sheet into plural pieces to form a plurality of light emitting elements; disposing a plurality of the light emitting elements on a substrate to be spaced apart from each other; forming a reflecting resin layer containing a light reflecting component on the substrate so as to cover the light emitting elements; and removing the reflecting resin layer partially so that one side surface of the electrode portion is exposed from the reflecting resin layer.
    Type: Application
    Filed: April 13, 2012
    Publication date: October 18, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yasunari OOYABU, Toshiki NAITO, Satoshi SATO
  • Publication number: 20120261700
    Abstract: A phosphor reflecting sheet provides a phosphor layer on one side in a thickness direction of a light emitting diode element and provides a reflecting resin layer at the side of the light emitting diode element. The phosphor reflecting sheet includes the phosphor layer and the reflecting resin layer provided on one surface in the thickness direction of the phosphor layer. The reflecting resin layer is formed corresponding to the light emitting diode element so as to be disposed in opposed relation to the side surface of the light emitting diode element.
    Type: Application
    Filed: April 13, 2012
    Publication date: October 18, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yasunari OOYABU, Hisataka ITO, Tsutomu NISHIOKA, Toshiki NAITO
  • Publication number: 20120261699
    Abstract: A reflecting resin sheet provides a reflecting resin layer at the side of a light emitting diode element. The reflecting resin sheet includes a release substrate and the reflecting resin layer provided on one surface in a thickness direction of the release substrate. The reflecting resin layer is formed corresponding to the light emitting diode element so as to be capable of being in close contact with the light emitting diode element.
    Type: Application
    Filed: April 13, 2012
    Publication date: October 18, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yasunari OOYABU, Tsutomu NISHIOKA, Hisataka ITO, Toshiki NAITO
  • Patent number: 8252237
    Abstract: A substance detection sensor comprises an insulation layer (2) having flexibility, two electrodes (3A, 3B) so disposed on the insulation layer as to be opposite to each other at a space therebetween and connected to an electric resistance detector, and a conductive layer (4) which is so formed on the insulation layer as to span the two electrodes and to be electrically connected to the two electrodes. The swelling ratio of the conductive layer (4) is changed according to the type and/or the quantity of a specific substance.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: August 28, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Toshiki Naito, Hiroshi Yamazaki, Toshihiko Omote
  • Patent number: 8236186
    Abstract: A production method of a suspension board with circuit includes the steps of forming, on a metal supporting board, an insulating layer formed with a first opening, forming a metal thin film on the insulating layer and on the metal supporting board exposed from the first opening, forming, on a surface of the metal thin film, a conductive layer having terminal portions forming, on the terminal portions, a metal plating layer by electrolytic plating using the metal supporting board as a lead, forming a second opening in a portion of the metal supporting board opposing the first opening, and partially etching the metal supporting board to form the suspension board with circuit and a support frame. In the step of forming the insulating layer, the first opening is formed in the insulating layer in which the supporting frame is formed.
    Type: Grant
    Filed: April 13, 2009
    Date of Patent: August 7, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Aya Mizushima, Toshiki Naito
  • Patent number: 8208225
    Abstract: A suspension board with circuit includes a conductive pattern, a board main body portion on which a magnetic head is mounted, and an auxiliary portion capable of being folded back with respect to the board main body portion so as to face a back surface of the board main body portion. The conductive pattern includes a first conductive pattern including a first terminal electrically connected to an external circuit, and a second terminal electrically connected to the magnetic head, and a second conductive pattern including a third terminal electrically connected to the external circuit, and a fourth terminal electrically connected to an electronic element. Both of the first terminal and the second terminal are disposed on the board main body portion. The third terminal is disposed on the board main body portion or on the auxiliary portion, and the fourth terminal is disposed on the auxiliary portion.
    Type: Grant
    Filed: November 2, 2009
    Date of Patent: June 26, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Toshiki Naito
  • Patent number: 8194353
    Abstract: A suspension board with circuit includes a conductive pattern, a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed on a side of the suspension board with circuit which is closer to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed on a side of the suspension board with circuit which is closer to the auxiliary portion. The conductive pattern includes a first conductive pattern including first and second terminals connected to an external circuit and the magnetic head, and second conductive pattern including third and fourth terminals connected to the external circuit and light emitting element. Both of the first and second terminal are disposed on the board main body portion. The third and fourth terminals are disposed on the board main body portion and on the auxiliary portion respectively.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: June 5, 2012
    Assignee: NITTO DENKO Corporation
    Inventors: Tetsuya Ohsawa, Toshiki Naito
  • Patent number: 8184931
    Abstract: A suspension board with circuit includes a circuit board, and an optical waveguide formed on the circuit board. The circuit board is provided with a pedestal for supporting a slider. The pedestal allows the optical waveguide to be disposed so as to overlap the slider in a thickness direction of the circuit board.
    Type: Grant
    Filed: June 9, 2009
    Date of Patent: May 22, 2012
    Assignee: Nitto Denko Corporation
    Inventors: Hitoki Kanagawa, Jun Ishii, Toshiki Naito
  • Patent number: 8184404
    Abstract: A suspension board with circuit includes a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed close to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed close to the auxiliary portion. The conductive pattern includes a first conductive pattern including a first terminal, and a second terminal connected to the magnetic head, and a second conductive pattern including a third terminal and a fourth terminal connected to the light emitting element. The first, second and third terminals are disposed on the board main body portion. The fourth terminal is disposed on the auxiliary portion. The back surface of the board main body portion is formed with a main-body-side interfitting portion. A back surface of the auxiliary portion is formed with an auxiliary-portion-side interfitting portion.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: May 22, 2012
    Assignee: NITTO DENKO Corporation
    Inventors: Tetsuya Ohsawa, Toshiki Naito
  • Publication number: 20120045170
    Abstract: An optical waveguide for a touch panel is capable of causing light beams emitted from a light-emitting optical waveguide section to enter a light-receiving optical waveguide section even when warpage or distortion occurs. Edges of an over cladding layer covering an end surface of a core for emitting a light beams and an end surface of a core for receiving the light beams respectively are configured in the form of light-emitting and light-receiving lens portions each having an outwardly-bulging arcuately curved surface as seen in vertical sectional view. The light-emitting lens portion has one of the following configurations: a configuration in which a light beam emitted from the light-emitting lens portion is adapted to diffuse in the direction of the height of the light-emitting lens portion; and a configuration in which the height of the light-emitting lens portion is less than that of the light-receiving lens portion.
    Type: Application
    Filed: August 11, 2011
    Publication date: February 23, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naoki Shibata, Toshiki Naito
  • Patent number: 8056223
    Abstract: A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: November 15, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishii, Hitoki Kanagawa, Toshiki Naito
  • Patent number: 8017871
    Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.
    Type: Grant
    Filed: June 24, 2009
    Date of Patent: September 13, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Toshiki Naito, Tetsuya Ohsawa, Kouji Kataoka
  • Patent number: 8014103
    Abstract: A suspension board with circuit includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive layer formed on the insulating layer, and a pedestal for supporting a slider. The pedestal includes a lower pedestal made of the insulating layer, and formed in a continuous frame shape so as to surround a bonding surface of the metal supporting board to the slider, and an upper pedestal made of the conductive layer, and formed in a discontinuous frame shape on the lower pedestal.
    Type: Grant
    Filed: November 3, 2008
    Date of Patent: September 6, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Tetsuya Ohsawa, Toshiki Naito, Hirotoshi Iguchi
  • Patent number: 8000566
    Abstract: A suspension board with circuit includes a metal supporting board; an insulating base layer formed on the metal supporting board; a conductive pattern formed on the insulating base layer; an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern; and an optical waveguide. The optical waveguide is adhered on the metal supporting board, the insulating base layer, or the insulating cover layer.
    Type: Grant
    Filed: June 17, 2009
    Date of Patent: August 16, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Toshiki Naito, Jun Ishii
  • Patent number: 7971353
    Abstract: A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.
    Type: Grant
    Filed: February 7, 2008
    Date of Patent: July 5, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Yuichi Takayoshi, Kazushi Ichikawa, Toshiki Naito
  • Publication number: 20110155421
    Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.
    Type: Application
    Filed: February 23, 2011
    Publication date: June 30, 2011
    Applicant: Nitto Denko Corporation
    Inventors: Toshiki Naito, Tetsuya Ohsawa, Kouji Kataoka
  • Publication number: 20110139490
    Abstract: A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for supporting the plurality of wired circuit boards and the distinguishing marks. Each of the distinguishing marks has an indication portion for indicating a specified one of the wired circuit boards.
    Type: Application
    Filed: February 23, 2011
    Publication date: June 16, 2011
    Applicant: Nitto Denko Corporation
    Inventors: Toshiki Naito, Tetsuya Ohsawa, Kouji Kataoka
  • Patent number: 7957614
    Abstract: A suspension board with circuit includes a circuit board containing a metal supporting board, an insulating pattern formed on the metal supporting board, and a conductive pattern formed on the insulating pattern; an optical waveguide disposed on the circuit board; and a positioning portion provided on the circuit board in order to position the optical waveguide with respect to the circuit board.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: June 7, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishii, Hitoki Kanagawa, Toshiki Naito
  • Patent number: 7925127
    Abstract: A suspension board with circuit includes a circuit board formed with an opening, and having a mounting portion defined by the opening for mounting thereon a slider on which a magnetic head is mounted, and an optical waveguide disposed on the circuit board so as to traverse the opening. The optical waveguide is slack in the opening.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: April 12, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Jun Ishii, Hitoki Kanagawa, Toshiki Naito