Patents by Inventor Toshio Hayakawa

Toshio Hayakawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10916269
    Abstract: Disclosed here is a magnet for use in a motor. The magnet comprises a magnet body. The magnet body comprises a plurality of coated magnetic granules. Each coated magnetic granule of the plurality of coated magnetic granules comprises a magnetic granule and a metallic layer coating the magnetic granule.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: February 9, 2021
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Toshio Takahashi, Kazushi Tsuwako, Masamichi Sakauchi, Takako Hayakawa, Kouki Uefune
  • Publication number: 20200265868
    Abstract: Disclosed here is a magnet comprising a magnet body. The magnet body comprises a plurality of coated magnetic granules.
    Type: Application
    Filed: August 28, 2019
    Publication date: August 20, 2020
    Inventors: Toshio Takahashi, Kazushi Tsuwako, Masamichi Sakauchi, Takako Hayakawa, Kouki Uefune
  • Patent number: 10451869
    Abstract: A light deflector includes: a polygon mirror made of plastic and having a plurality of reflecting surfaces; a motor including a rotor and configured to rotate the polygon mirror; and a pressing member configured to press the polygon mirror toward the rotor in an axial direction of the motor. The polygon mirror has a first surface having a polygonal shape, and a second surface opposite to the first surface in the axial direction and having a polygonal shape. The second surface faces the rotor. The polygon mirror includes a plurality of first contact portions configured to be in contact with and pressed by the pressing member, and the first contact portions are provided on the first surface at positions equally distant from an axis of the motor between each of vertices of the first surface and the axis of the motor.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: October 22, 2019
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventors: Kazuhiro Hayakawa, Toshio Sakai, Hidetaka Hoshino, Junji Fujitani
  • Patent number: 10269726
    Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein, and a laminated film covering an upper surface of the mold resin, the laminated film including a magnetic film and a first metal film. The first metal film is connected to the power supply pattern. The magnetic film is selectively thick on the first region.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: April 23, 2019
    Assignee: TDK CORPORATION
    Inventors: Kenichi Kawabata, Toshio Hayakawa, Toshiro Okubo
  • Patent number: 10170431
    Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein and has a concave portion above the first region, a magnetic film selectively provided in the concave portion, and a first metal film that is connected to the power supply pattern and covers the mold resin.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: January 1, 2019
    Assignee: TDK CORPORATION
    Inventors: Kenichi Kawabata, Toshio Hayakawa, Toshiro Okubo
  • Patent number: 9966343
    Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a magnetic film formed of a composite magnetic material obtained by dispersing magnetic fillers in a thermosetting resin material, the magnetic film covering upper and side surfaces of the molding resin and an edge portion of the front surface exposed to a side surface of the substrate; and a metal film connected to the power supply pattern and covering the molding resin through the magnetic film.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: May 8, 2018
    Assignee: TDK CORPORATION
    Inventors: Kenichi Kawabata, Toshio Hayakawa, Toshiro Okubo
  • Patent number: 9953932
    Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a laminated structure of a magnetic film and a metal film, the laminated structure covering at least an upper surface of the molding resin. The metal film is connected to the power supply pattern, and a resistance value at an interface between the magnetic film and the metal film is equal to or larger than 106?.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: April 24, 2018
    Assignee: TDK CORPORATION
    Inventors: Kenichi Kawabata, Toshio Hayakawa, Toshiro Okubo
  • Publication number: 20180033738
    Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein, and a laminated film covering an upper surface of the mold resin, the laminated film including a magnetic film and a first metal film. The first metal film is connected to the power supply pattern. The magnetic film is selectively thick on the first region.
    Type: Application
    Filed: July 5, 2017
    Publication date: February 1, 2018
    Applicant: TDK Corporation
    Inventors: Kenichi KAWABATA, Toshio Hayakawa, Toshiro Okubo
  • Publication number: 20170309576
    Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a magnetic film formed of a composite magnetic material obtained by dispersing magnetic fillers in a thermosetting resin material, the magnetic film covering upper and side surfaces of the molding resin and an edge portion of the front surface exposed to aside surface of the substrate; and a metal film connected to the power supply pattern and covering the molding resin through the magnetic film.
    Type: Application
    Filed: March 21, 2017
    Publication date: October 26, 2017
    Applicant: TDK Corporation
    Inventors: Kenichi KAWABATA, Toshio HAYAKAWA, Toshiro OKUBO
  • Publication number: 20170301628
    Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a laminated structure of a magnetic film and a metal film, the laminated structure covering at least an upper surface of the molding resin. The metal film is connected to the power supply pattern, and a resistance value at an interface between the magnetic film and the metal film is equal to or larger than 106?.
    Type: Application
    Filed: March 21, 2017
    Publication date: October 19, 2017
    Applicant: TDK Corporation
    Inventors: Kenichi KAWABATA, Toshio HAYAKAWA, Toshiro OKUBO
  • Publication number: 20170294387
    Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein and has a concave portion above the first region, a magnetic film selectively provided in the concave portion, and a first metal film that is connected to the power supply pattern and covers the mold resin.
    Type: Application
    Filed: December 16, 2016
    Publication date: October 12, 2017
    Applicant: TDK Corporation
    Inventors: Kenichi KAWABATA, Toshio HAYAKAWA, Toshiro OKUBO
  • Publication number: 20170278804
    Abstract: Disclosed herein is an electronic circuit package includes: a substrate having a power supply pattern; an electronic component mounted on a surface of the substrate; a mold resin covering the surface of the substrate so as to embed therein the electronic component; a magnetic film formed so as to contact at least a top surface of the mold resin; and a metal film electrically connected to the power supply pattern and covering the mold resin through the magnetic film.
    Type: Application
    Filed: November 15, 2016
    Publication date: September 28, 2017
    Applicant: TDK Corporation
    Inventors: KENICHI KAWABATA, Toshio HAYAKAWA, Toshiro OKUBO
  • Publication number: 20160041003
    Abstract: A shift position detection device that has excellent durability and is capable of detecting many shift positions is provided. The present invention is a shift position detection device provided with a shaft that is a moving body that touches and is displaced by a cam that is a displacement member displaced according to changes in the shift position of the transmission of a vehicle; a magnet that is displaced with the shaft; a magnetism detecting element that detects the displacement of the magnet and outputs a detection signal; a display device that displays a shift position on the basis of the detection signal of the magnetism detecting element; and a control device that controls the display device on the basis of the detection signal. A memory unit is provided for storing an output signal that controls the display device and is based on the detection signal of the magnetism detecting element, and the output signal, which is based on the detection signal and is stored in the memory unit, can be rewritten.
    Type: Application
    Filed: March 11, 2014
    Publication date: February 11, 2016
    Applicant: NIPPON SEIKI CO., LTD.
    Inventor: Toshio HAYAKAWA
  • Publication number: 20120166557
    Abstract: A user can search information about products or services, its description, its price or price range and any other information by sending electronic mails or short message service, where user identifiers are replaced with search words that each search word is connected by underscore character or other distinctive character to data servers.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 28, 2012
    Inventor: Toshio Hayakawa
  • Publication number: 20120117136
    Abstract: Sending a set of two data, having actual data and calculated data by using the actual data, to a communication device using RF signal works as a virtual check sum function.
    Type: Application
    Filed: November 4, 2010
    Publication date: May 10, 2012
    Inventor: Toshio Hayakawa
  • Patent number: 8159132
    Abstract: An organic EL display apparatus includes a display unit having a plurality of organic EL elements two-dimensionally arranged on a substrate, where the organic EL elements provide pixels, a sealing plate configured to be adhered to the substrate with an adhesive to cover the display unit, and a plurality of lead wires disposed on the substrate such that the lead wires are drawn outward from the display unit to the outside of the sealing plate. A linear bank is formed along an adhesion zone defined on the substrate to extend across the lead wires in a region where these lead wires are disposed. The sealing plate has its periphery adhered to the adhesion zone on the substrate along the adhesion zone on the substrate.
    Type: Grant
    Filed: May 25, 2010
    Date of Patent: April 17, 2012
    Assignee: TDK Corporation
    Inventors: Mitsufumi Kodama, Toshiaki Maruoka, Shigeyuki Ishiguro, Toshio Hayakawa, Yosuke Mizutani
  • Publication number: 20100301743
    Abstract: An organic EL display apparatus comprises a display unit including a plurality of organic EL elements two-dimensionally arranged on a substrate, where the organic EL elements provide pixels, a sealing plate configured to be adhered to the substrate with an adhesive to cover the display unit, and a plurality of lead wires disposed on the substrate such that the lead wires are drawn outward from the display unit to the outside of the sealing plate. A linear bank is formed along an adhesion zone defined on the substrate to extend across the lead wires in a region where these lead wires are disposed. The sealing plate has its periphery adhered to the adhesion zone on the substrate along the adhesion zone on the substrate.
    Type: Application
    Filed: May 25, 2010
    Publication date: December 2, 2010
    Applicant: TDK CORPORATION
    Inventors: Mitsufumi KODAMA, Toshiaki Maruoka, Shigeyuki Ishiguro, Toshio Hayakawa, Yosuke Mizutani
  • Publication number: 20060031421
    Abstract: A local community Internet service is provided through use of specialized hardware that allows a local provider to securely deliver unique community oriented services. The services that are provided include commercial services such as sales and special events at local retailers as well as telephone book-like services. Special services such as parent-teacher communication and health and vital signs monitoring can also be provided. Advertising and similar commercially derived revenue underwrites the cost of the service so that it can be provided at no cost or at a nominal cost.
    Type: Application
    Filed: August 12, 2005
    Publication date: February 9, 2006
    Inventor: Toshio Hayakawa
  • Patent number: 6972685
    Abstract: A liquid level detecting apparatus resistant to the deterioration and corrosion thereof is provided while holding down an increase in the manufacturing cost thereof. This apparatus 1 has fixed electrodes 3 on which a sliding contact point 5 is slidingly moved in accordance with a fluctuation of a float, and a first resistor 4 connected to the fixed electrodes 3, the fixed electrodes 3 being made of at least silver (Ag), palladium (Pd) and a glass component, a weight ratio of the silver (Ag) to palladium (Pd) being not lower than 75 wt. % to not higher than 25 wt. %, a sliding portion 7 of the fixed electrodes 3 on which the sliding contact point 5 is slidingly moved being covered with second resistors 8 a resistance value of which is lower than that of the first resistor 4.
    Type: Grant
    Filed: November 8, 2002
    Date of Patent: December 6, 2005
    Assignee: Nippon Seiki Co., Ltd.
    Inventors: Tetsuya Sato, Koichi Sato, Tadao Nakagawa, Kiyoshi Enomoto, Toshio Hayakawa, Yoshiyuki Shimazaki
  • Patent number: 6791019
    Abstract: The purposes of this staff sheet printer (100) is to translate played acoustic sound into music notes as music staff sheets (60) by having a plurality of sensors attached on an acoustical musical instrument. Conventionally, a music teacher listens while a musical instrument player plays. Checking the skill of novice players requires well-trained music teachers. The newly invented staff sheet printer (100) can ascertain musical instrument players' skills easily since it can print out played notes as exactly as the players play acoustic musical instruments. The musical instrument players can visually check for themselves whether correct keys have been played or not, by comparing the output staff sheets (60) and the original music sheets.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: September 14, 2004
    Inventor: Toshio Hayakawa