Abstract: A semiconductor device of the invention has a plurality of resistor elements formed on an element isolating oxide film in predetermined regions on a surface of a semiconductor substrate. Active regions are furnished close to the resistor elements. This allows the element isolating oxide film near the resistor elements to be divided into suitable strips, forestalling a concave formation at the center of the element isolating oxide film upon polishing of the film by CMP and thereby enhancing dimensional accuracy of the resistor elements upon fabrication.

Abstract: To eliminate the substrate voltage dependences of the respective resistance values of resistor elements, in the resistor elements coupled in series to each other over respective substrate regions, the ends of the resistor elements are coupled to the corresponding substrate regions by respective bias wires such that respective average potentials between the substrate regions of the resistor elements and the corresponding resistor elements have opposite polarities, and equal magnitudes.

Abstract: In an A/D converter including a switched capacitor integration circuit, to suppress an effect of a noise generated in the switched capacitor circuit while suppressing increase in a forming area of the circuit. A first-stage integrator of a differential input type A/D converter includes first and second switched capacitor circuits, and includes a noise cancel circuit for generating a noise cancel signal to cancel a kickback noise generated due to switching operation thereof.

Abstract: There is provided a technique for reducing the adverse effect of idle tones in the channels in a ??-type A/D converter including a plurality of channels for converting analog input signals into digital signals. The ??-type A/D converter includes an L channel for converting a left analog input signal into a digital signal and an R channel for converting a right analog input signal into a digital signal. Each of the L channel and the R channel includes a DC dither circuit for generating a DC addition voltage for shifting the frequency of an idle tone. In the L channel and the R channel, DC addition voltages generated by DC dither circuits are different from each other.

Abstract: A semiconductor device includes a semiconductor substrate including a main surface; a plurality of first interconnections formed in a capacitance forming region defined on the main surface and extending in a predetermined direction, a plurality of second interconnections each adjacent to the first interconnection located at an edge of the capacitance forming region, extending in the predetermined direction, and having a fixed potential; and an insulating layer formed on the main surface and filling in between each of the first interconnections and between the first interconnection and the second interconnection adjacent to each other. The first interconnections and the second interconnections are located at substantially equal intervals in a plane parallel to the main surface, and located to align in a direction substantially perpendicular to the predetermined direction.

Abstract: A semiconductor device includes a semiconductor substrate including a main surface; a plurality of first interconnections formed in a capacitance forming region defined on the main surface and extending in a predetermined direction; a plurality of second interconnections each adjacent to the first interconnection located at an edge of the capacitance forming region, extending in the predetermined direction, and having a fixed potential; and an insulating layer formed on the main surface and filling in between each of the first interconnections and between the first interconnection and the second interconnection adjacent to each other. The first interconnections and the second interconnections are located at substantially equal intervals in a plane parallel to the main surface, and located to align in a direction substantially perpendicular to the predetermined direction.

Abstract: It is an object of the present invention to surely protect a predetermined semiconductor element or a predetermined semiconductor element group in an analog block from a noise generated from a digital block. A semiconductor device according to the present invention includes a semiconductor substrate, a digital block to be a region in which a digital circuit is formed and an analog block to be a region in which an analog circuit is formed, arranged by separating an upper surface of the semiconductor substrate and a substrate potential fixing region provided on the semiconductor substrate so as to surround in a planar view the predetermined semiconductor element group in the analog block, and a pad connected to the substrate potential fixing region and receiving a predetermined potential from an external part.

Abstract: In an A/D converter including a switched capacitor integration circuit, to suppress an effect of a noise generated in the switched capacitor circuit while suppressing increase in a forming area of the circuit. A first-stage integrator of a differential input type A/D converter includes first and second switched capacitor circuits, and includes a noise cancel circuit for generating a noise cancel signal to cancel a kickback noise generated due to switching operation thereof.

Abstract: A semiconductor device includes a semiconductor substrate including a main surface; a plurality of first interconnections formed in a capacitance forming region defined on the main surface and extending in a predetermined direction; a plurality of second interconnections each adjacent to the first interconnection located at an edge of the capacitance forming region, extending in the predetermined direction, and having a fixed potential; and an insulating layer formed on the main surface and filling in between each of the first interconnections and between the first interconnection and the second interconnection adjacent to each other. The first interconnections and the second interconnections are located at substantially equal intervals in a plane parallel to the main surface, and located to align in a direction substantially perpendicular to the predetermined direction.

Abstract: A semiconductor device of the invention has a plurality of resistor elements formed on an element isolating oxide film in predetermined regions on a surface of a semiconductor substrate. Active regions are furnished close to the resistor elements. This allows the element isolating oxide film near the resistor elements to be divided into suitable strips, forestalling a concave formation at the center of the element isolating oxide film upon polishing of the film by CMP and thereby enhancing dimensional accuracy of the resistor elements upon fabrication.

Abstract: An oscillator circuit is formed of a differential LC resonant circuit formed of an L load differential circuit including inductance-variable portions and a capacitor element, and a positive feedback circuit formed of N-channel MOS transistors. The inductance-variable portion is configured to vary the inductance by selecting a plurality of switch circuits arranged between a plurality of arbitrary positions on a spiral interconnection layer and the input/output terminal, and thereby can control an oscillation frequency. The inductance-variable portions form an inductor pair when the switch circuit among the switch circuits coupled between the first input/output terminals is turned on together with the switch circuit.

Abstract: A semiconductor device includes a semiconductor substrate including a main surface; a plurality of first interconnections formed in a capacitance forming region defined on the main surface and extending in a predetermined direction; a plurality of second interconnections each adjacent to the first interconnection located at an edge of the capacitance forming region, extending in the predetermined direction, and having a fixed potential; and an insulating layer formed on the main surface and filling in between each of the first interconnections and between the first interconnection and the second interconnection adjacent to each other. The first interconnections and the second interconnections are located at substantially equal intervals in a plane parallel to the main surface, and located to align in a direction substantially perpendicular to the predetermined direction.

Abstract: A semiconductor device includes a semiconductor substrate including a main surface; a plurality of first interconnections formed in a capacitance forming region defined on the main surface and extending in a predetermined direction; a plurality of second interconnections each adjacent to the first interconnection located at an edge of the capacitance forming region, extending in the predetermined direction, and having a fixed potential; and an insulating layer formed on the main surface and filling in between each of the first interconnections and between the first interconnection and the second interconnection adjacent to each other. The first interconnections and the second interconnections are located at substantially equal intervals in a plane parallel to the main surface, and located to align in a direction substantially perpendicular to the predetermined direction.

Abstract: A semiconductor device includes a semiconductor substrate including a main surface; a plurality of first interconnections formed in a capacitance forming region defined on the main surface and extending in a predetermined direction; a plurality of second interconnections each adjacent to the first interconnection located at an edge of the capacitance forming region, extending in the predetermined direction, and having a fixed potential; and an insulating layer formed on the main surface and filling in between each of the first interconnections and between the first interconnection and the second interconnection adjacent to each other. The first interconnections and the second interconnections are located at substantially equal intervals in a plane parallel to the main surface, and located to align in a direction substantially perpendicular to the predetermined direction.

Abstract: An oscillator circuit is formed of a differential LC resonant circuit formed of an L load differential circuit including inductance-variable portions and a capacitor element, and a positive feedback circuit formed of N-channel MOS transistors. The inductance-variable portion is configured to vary the inductance by selecting a plurality of switch circuits arranged between a plurality of arbitrary positions on a spiral interconnection layer and the input/output terminal, and thereby can control an oscillation frequency. The inductance-variable portions form an inductor pair when the switch circuit among the switch circuits coupled between the first input/output terminals is turned on together with the switch circuit.

Abstract: An oscillator circuit is formed of a differential LC resonant circuit formed of an L load differential circuit including inductance-variable portions and a capacitive element, and a positive feedback circuit formed of N-channel MOS transistors. The inductance-variable portion is configured to vary the inductance by selecting a plurality of switch circuits arranged between a plurality of arbitrary positions on a spiral interconnection layer and the input/output terminal, and thereby can control an oscillation frequency. The inductance-variable portions form an inductor pair when the switch circuit among the switch circuits coupled between the first input/output terminals is turned on together with the switch circuit.

Abstract: A semiconductor device of the invention has a plurality of resistor elements formed on an element isolating oxide film in predetermined regions on a surface of a semiconductor substrate. Active regions are furnished close to the resistor elements. This allows the element isolating oxide film near the resistor elements to be divided into suitable strips, forestalling a concave formation at the center of the element isolating oxide film upon polishing of the film by CMP and thereby enhancing dimensional accuracy of the resistor elements upon fabrication.

Abstract: A semiconductor device of the invention has a plurality of resistor elements formed on an element isolating oxide film in predetermined regions on a surface of a semiconductor substrate. Active regions are furnished close to the resistor elements. This allows the element isolating oxide film near the resistor elements to be divided into suitable strips, forestalling a concave formation at the center of the element isolating oxide film upon polishing of the film by CMP and thereby enhancing dimensional accuracy of the resistor elements upon fabrication.

Abstract: An oscillator circuit is formed of a differential LC resonant circuit formed of an L load differential circuit including inductance-variable portions and a capacitive element, and a positive feedback circuit formed of N-channel MOS transistors. The inductance-variable portion is configured to vary the inductance by selecting a plurality of switch circuits arranged between a plurality of arbitrary positions on a spiral interconnection layer and the input/output terminal, and thereby can control an oscillation frequency. The inductance-variable portions form an inductor pair when the switch circuit among the switch circuits coupled between the first input/output terminals is turned on together with the switch circuit.

Abstract: A ?? modulator modulates only an error component separated by a component separating portion. Therefore, even if the number of order of the ?? modulator increases, an amplitude of an output of an integrator in the final stage does not excessively increase, and the stability of the modulator can be achieved. Since the signal component separated by the component separating portion does not pass through the ?? modulator, an intensity of an input signal can be maintained as it is, and the modulator can have high precision.