Patents by Inventor Toshio Shiobara

Toshio Shiobara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10818618
    Abstract: An adhesive substrate includes a support base member and an adhesive layer provided on the support base member. The support base member contains electroconductive particles and an insulating resin, and has a recessed and projected pattern with two or more projected portions on one surface or both surfaces of the support base member. The adhesive layer is provided at least on upper surfaces of the projected portions in the recessed and projected pattern of the support base member. The adhesive layer on the upper surfaces of the projected portions has an upper surface with a curved surface. Thus, the present invention provides an adhesive substrate capable of selectively picking up and quickly transferring large amounts of fine chips and particles, a method for producing the adhesive substrate, and a transfer device.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: October 27, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki Iguchi, Toshio Shiobara, Tsutomu Kashiwagi
  • Patent number: 10763384
    Abstract: A concentrating solar cell module including; a base portion having a plurality of mounting regions for mounting solar cells and a plurality of lead electrodes for electrically connecting the solar cells with external electrodes; a support composed of a thermosetting resin, the support surrounding each of the mounting regions of the base portion; the solar cells mounted on the mounting regions; and a condensing lens molded above the mounting regions so as to encapsulate the solar cells, wherein a surface of the mounting regions of the base portion is plated, the condensing lens is molded with a transparent thermosetting silicone resin, and the support is joined to a surface of the base portion, the surface to which the support is joined is on the same side of the base portion as the surface on which the solar cells are mounted.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: September 1, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Wataru Goto, Toshio Shiobara
  • Patent number: 10743412
    Abstract: The present invention provides the substrate comprises a fiber film base material comprising a sheet of a surface-treated fiber film or a plural number of sheets of the surface-treated fiber films being laminated, wherein the surface-treated fiber film has a value of a conventional flexural rigidity measured by a method according to JIS R 3420 of 3-fold to 100-fold to a value of a conventional flexural rigidity of an untreated fiber film. There can be provided a substrate having a uniform and homogeneous insulating layer which does not generate unfastening or twisting of a fiber, and in addition to heat resistance, dimensional stability and impact resistance, having further excellent in bendability and flexibility.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: August 11, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Saiko Akahane, Yoshihira Hamamoto, Toshio Shiobara
  • Patent number: 10669197
    Abstract: The present invention provides a surface-modified glass fiber film having its surface modified by a silicon-containing compound, and a value of a common flexural rigidity of the surface-modified glass fiber film as measured by the method described in JIS R 3420 is in the range of 3 to 100 times as compared to a value of the common flexural rigidity of an unmodified glass fiber film. There can be provided a surface-modified glass fiber film having a high strength, a high heat resistance, a good dimensional stability, a good self-supporting property, a low average linear expansion coefficient, a high storage rigidity at high temperature, and an excellent surface uniformity.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: June 2, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Saiko Akahane, Yoshihira Hamamoto, Hideki Akiba, Shinsuke Yamaguchi, Toshio Shiobara
  • Publication number: 20200156291
    Abstract: This is to provide an anisotropic electro-conductive film having high reliability, which electrically connects circuit electrodes having a fine pattern. Provided is an anisotropic film containing an insulating resin and particle groups, wherein the particle groups are groups of particles in which a plurality of particles are bound together with a binder, and the particle groups are regularly arranged with an interval of 1 ?m to 1,000 ?m.
    Type: Application
    Filed: November 19, 2019
    Publication date: May 21, 2020
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki IGUCHI, Toshio SHIOBARA, Tsutomu KASHIWAGI
  • Publication number: 20200035627
    Abstract: An adhesive substrate includes a support base member and an adhesive layer provided on the support base member. The support base member contains electroconductive particles and an insulating resin, and has a recessed and projected pattern with two or more projected portions on one surface or both surfaces of the support base member. The adhesive layer is provided at least on upper surfaces of the projected portions in the recessed and projected pattern of the support base member. The adhesive layer on the upper surfaces of the projected portions has an upper surface with a curved surface. Thus, the present invention provides an adhesive substrate capable of selectively picking up and quickly transferring large amounts of fine chips and particles, a method for producing the adhesive substrate, and a transfer device.
    Type: Application
    Filed: June 18, 2019
    Publication date: January 30, 2020
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki IGUCHI, Toshio SHIOBARA, Tsutomu KASHIWAGI
  • Publication number: 20190225762
    Abstract: The present invention is a quartz glass fiber-containing prepreg including: (A) a quartz glass fiber; and (B) a curable resin composition, wherein at least one condition of conditions: (1) a dose of ?-ray contained in the quartz glass fiber is 0.005 c/cm2·hour or smaller, and, each of metal ion contents of Na+, Li+ and K+ is 1 ppm or lower; (2) the quartz glass fiber contains the number of foams of 10 foams/m2 or smaller a unit area; and (3) the quartz glass fiber-containing prepreg has the common bending stiffness in the range of a thickness of 100 to 200 ?m measured by a method described in JIS R 3420:2013 of 500 N·m2 or larger is satisfied. This provides a quartz glass fiber-containing prepreg that has particularly excellent dielectric characteristics, has excellent dielectric characteristics and the heat resistance, and/or has high handling property because of high bending stiffness characteristics.
    Type: Application
    Filed: January 2, 2019
    Publication date: July 25, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro TSUTSUMI, Yoshihira HAMAMOTO, Toshio SHIOBARA, Akihiko OSAKI
  • Patent number: 10308803
    Abstract: A silicone-modified epoxy resin composition that offers a cured product excellent in low permeability to gas, mechanical strength, and heat resistance and transparency and further offers an optical semiconductor sealing material excellent in heat cycle resistance, and a cured epoxy resin product obtained by curing the composition. The epoxy resin composition comprises the following components (A) to (C): (A) a silicone-modified epoxy resin having a cyclic siloxane structure, (B) a silicone-modified epoxy resin having a branched siloxane structure, and (C) an epoxy resin curing agent containing a polyvalent carboxylic acid having a tricyclodecane structure and a carboxylic anhydride compound.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: June 4, 2019
    Assignees: Shin-Etsu Chemical Co., Ltd., Nippon Kayaku Kabuhiki Kaisha
    Inventors: Toshio Shiobara, Junichi Sawada, Miyuki Wakao, Tsutomu Kashiwagi, Naofusa Miyagawa, Yoshihiro Kawada, Chie Sasaki
  • Publication number: 20190100663
    Abstract: The present invention is an anisotropic conductive film including: a peelable substrate, a base layer containing an insulating resin on the peelable substrate, bumps of electroconductive nanoparticle assemblies disposed on the base layer at intervals of 1 ?m to 100 ?m, and a coating layer containing an insulating resin formed on the base layer so as to coat the bumps, wherein the peelable substrate is peelable to the base layer. This provides an anisotropic conductive film for connecting circuit electrodes having fine patterns.
    Type: Application
    Filed: September 10, 2018
    Publication date: April 4, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hiroyuki IGUCHI, Toshio SHIOBARA, Tsutomu KASHIWAGI
  • Patent number: 10242924
    Abstract: A base-attached encapsulant for semiconductor encapsulation is used for collectively encapsulating a device-mounted surface of the semiconductor device-mounted substrate having semiconductor devices mounted thereon or a device-formed surface of a semiconductor device-formed wafer having semiconductor devices formed thereon. The base-attached encapsulant has a base and an encapsulating resin layer containing an uncured or semi-cured thermosetting resin component formed onto one of the surfaces of the base, and a linear expansion coefficient ?1 of the semiconductor device to be encapsulated by the base-attached encapsulant, a linear expansion coefficient ?2 of a cured product of the encapsulating resin layer, and a linear expansion coefficient ?3 of the base satisfy both of the following formula (1) and (2); ?1<?3<?2??(1) ?2<?1+?2?2?3<2??(2) wherein the unit of the linear expansion coefficient is ppm/K.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: March 26, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tomoaki Nakamura, Hideki Akiba, Toshio Shiobara
  • Patent number: 10177059
    Abstract: A base-attached encapsulant for semiconductor encapsulation is used for collectively encapsulating a device-mounted surface of the semiconductor device-mounted substrate having semiconductor devices mounted thereon or a device-formed surface of a semiconductor device-formed wafer having semiconductor devices formed thereon. The base-attached encapsulant has a base and an encapsulating resin layer containing an uncured or semi-cured thermosetting resin component formed onto one of the surfaces of the base, and a linear expansion coefficient ?1 of the semiconductor device to be encapsulated by the base-attached encapsulant, a linear expansion coefficient ?2 of a cured product of the encapsulating resin layer, and a linear expansion coefficient ?3 of the base satisfy both of the following formula (1) and (2); ?1<?3<?2??(1) ?2<?1+?2?2?3<2??(2) wherein the unit of the linear expansion coefficient is ppm/K.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: January 8, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tomoaki Nakamura, Hideki Akiba, Toshio Shiobara
  • Patent number: 10134934
    Abstract: A method for producing a concentrating solar cell module having the steps of: preparing a base portion having a plurality of mounting regions for mounting solar cells and a plurality of lead electrodes for electrically connecting the solar cells with external electrodes, and a support composed of a thermosetting resin, the support surrounding each of the mounting regions of the base portion; mounting the solar cells on the mounting regions; molding a condensing lens above the mounting regions so as to encapsulate the solar cells, plating a surface of the mounting regions of the prepared base portion after the preparing step and before the mounting step; and joining the support to the base portion after the mounting step and before the molding step, wherein in the molding step, the condensing lens is molded with a transparent thermosetting silicone resin.
    Type: Grant
    Filed: December 31, 2013
    Date of Patent: November 20, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Wataru Goto, Toshio Shiobara
  • Publication number: 20180309007
    Abstract: A concentrating solar cell module including; a base portion having a plurality of mounting regions for mounting solar cells and a plurality of lead electrodes for electrically connecting the solar cells with external electrodes; a support composed of a thermosetting resin, the support surrounding each of the mounting regions of the base portion; the solar cells mounted on the mounting regions; and a condensing lens molded above the mounting regions so as to encapsulate the solar cells, wherein a surface of the mounting regions of the base portion is plated, the condensing lens is molded with a transparent thermosetting silicone resin, and the support is joined to a surface of the base portion, the surface to which the support is joined is on the same side of the base portion as the surface on which the solar cells are mounted.
    Type: Application
    Filed: June 25, 2018
    Publication date: October 25, 2018
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Wataru GOTO, Toshio SHIOBARA
  • Publication number: 20180247834
    Abstract: This is to provide a method for manufacturing a semiconductor apparatus which can shorten the manufacturing process of a semiconductor device, particularly a fan-out package without causing sealing defects such as voids or warpage, and can accomplish reduction in the manufacturing cost or improve in yield. There is provided a method for manufacturing a semiconductor apparatus which comprises preparing a semiconductor device-mounted substrate onto which a plurality of flip chip type semiconductor devices have been mounted onto a wiring layer formed on the substrate, collectively sealing a device-mounted surface of the semiconductor device-mounted substrate with a sealing material attached with a base material for sealing a semiconductor having a base material and a sealing resin layer containing an uncured or semi-cured thermosetting resin component formed on one surface of the base material, and removing the substrate from the collectively sealed semiconductor device-mounted substrate.
    Type: Application
    Filed: February 13, 2018
    Publication date: August 30, 2018
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Koichi TSUDA, Shuichi FUJII, Kazuaki SUMITA, Akihiko OSAKI, Toshio SHIOBARA
  • Publication number: 20180190890
    Abstract: The invention provides a silicone-organic resin composite laminate comprising a laminate in which an organic resin layer containing an inorganic fiber cloth into which a thermosetting organic resin has been impregnated, and a silicone resin layer containing an inorganic fiber cloth into which a curable silicone resin has been impregnated, being laminated with each one or more layers, and metal foils laminated at an uppermost surface and a lowermost surface of the laminate. There can be provided a silicone-organic resin composite laminate which has low linear expansion, good thermal dimensional stability, excellent mechanical characteristics, and excellent heat resistance and light resistance, and is suitable as a mounting substrate for an LED which corresponds to increase in luminance of the LED mounted substrate.
    Type: Application
    Filed: February 28, 2018
    Publication date: July 5, 2018
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shigeo YAMAGUCHI, Saiko AKAHANE, Toshio SHIOBARA
  • Patent number: 9963542
    Abstract: A silicone-modified epoxy resin which yields a cured product having low gas permeability and excellent strength; a composition of the silicone-modified epoxy resin; and an epoxy resin cured product obtainable by curing the composition, are provided. An epoxy resin represented by the following Formula (1): wherein R1 represents a hydrocarbon group having 1 to 6 carbon atoms; X represents an organic group having a norbornane epoxy structure, or a hydrocarbon group having 1 to 6 carbon atoms; n represents an integer from 1 to 3; plural R1s and plural Xs present in the formula may be respectively identical or different; and two or more of plural Xs represent an organic group having a norbornane epoxy structure.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: May 8, 2018
    Assignees: Shin-Etsu Chemical Co., Ltd., Nippon Kayaku Kabushiki Kaisha
    Inventors: Toshio Shiobara, Junichi Sawada, Miyuki Wakao, Tsutomu Kashiwagi, Naofusa Miyagawa, Yoshihiro Kawada, Chie Sasaki, Naosuke Taniguchi
  • Patent number: 9944760
    Abstract: The purpose of the present invention is to provide a silicone-modified epoxy resin which produces a cured product having excellent low gas permeability and strength; a composition of the resin; and an epoxy resin cured product obtainable by curing the composition. Disclosed is an epoxy resin represented by the following Formula (1): wherein R1 independently represents a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R2 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms; R3 independently represents a monovalent aliphatic hydrocarbon group having 1 to 12 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; R4 represents an oxygen atom or a divalent hydrocarbon group having an aliphatic cyclic structure; R5 represents silicone chain having a norbornane epoxy structure at either end; and X represents an organic group having a norbornane epoxy group.
    Type: Grant
    Filed: February 18, 2015
    Date of Patent: April 17, 2018
    Assignees: Shin-Etsu Chemical Co., Ltd., Nippon Kayaku Kabushiki Kaisha
    Inventors: Toshio Shiobara, Junichi Sawada, Miyuki Wakao, Tsutomu Kashiwagi, Naofusa Miyagawa, Yoshihiro Kawada, Chie Sasaki, Naosuke Taniguchi
  • Patent number: 9902649
    Abstract: The present invention provides a method for producing a surface-treated glass fiber film comprising steps of: preparing a treatment solution consisting of a mixture of a hydrolysable silane compound and a partially hydrolyzed condensate thereof; coating a glass fiber film with the treatment solution so that the attached amount of the mixture is 2% by mass or more and 90% by mass or less, relative to 100% by mass of the surface-treated glass fiber film and drying the same; and heat-treating the glass fiber film coated. There can be provided a method for producing a surface-treated glass fiber film having high strength, a low average coefficient of linear expansion, a high storage rigidity at high temperature and excellent in heat resistance, flexibility, electric insulation, dimensional stability, and surface homogeneity, with less environmental impact.
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: February 27, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihira Hamamoto, Saiko Akahane, Toshio Shiobara
  • Publication number: 20180025958
    Abstract: A base-attached encapsulant for semiconductor encapsulation is used for collectively encapsulating a device-mounted surface of the semiconductor device-mounted substrate having semiconductor devices mounted thereon or a device-formed surface of a semiconductor device-formed wafer having semiconductor devices formed thereon. The base-attached encapsulant has a base and an encapsulating resin layer containing an uncured or semi-cured thermosetting resin component formed onto one of the surfaces of the base, and a linear expansion coefficient ?1 of the semiconductor device to be encapsulated by the base-attached encapsulant, a linear expansion coefficient ?2 of a cured product of the encapsulating resin layer, and a linear expansion coefficient ?3 of the base satisfy both of the following formula (1) and (2); ?1<?3<?2 ??(1) ?2<?1+?2?2?3<2 ??(2) wherein the unit of the linear expansion coefficient is ppm/K.
    Type: Application
    Filed: September 26, 2017
    Publication date: January 25, 2018
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Tomoaki NAKAMURA, Hideki AKIBA, Toshio SHIOBARA
  • Patent number: 9865518
    Abstract: The present invention provides an electromagnetic wave shielding support base-attached encapsulant for collectively encapsulating a semiconductor device mounting surface of a substrate having semiconductor devices mounted thereon or a semiconductor device forming surface of a wafer having semiconductor devices formed thereon, the support base-attached encapsulant including a support base having an electromagnetic wave shielding property of 20 dB or more within a range of 100 MHz to 1,000 MHz, and an encapsulant composed of a thermosetting resin layer laminated on the support base.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: January 9, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Hideki Akiba, Tomoaki Nakamura, Toshio Shiobara, Shinsuke Yamaguchi