Abstract: A method for producing a concentrating solar cell module having the steps of: preparing a base portion having a plurality of mounting regions for mounting solar cells and a plurality of lead electrodes for electrically connecting the solar cells with external electrodes, and a support composed of a thermosetting resin, the support surrounding each of the mounting regions of the base portion; mounting the solar cells on the mounting regions; molding a condensing lens above the mounting regions so as to encapsulate the solar cells, plating a surface of the mounting regions of the prepared base portion after the preparing step and before the mounting step; and joining the support to the base portion after the mounting step and before the molding step, wherein in the molding step, the condensing lens is molded with a transparent thermosetting silicone resin.

Abstract: The invention provides a silicone-organic resin composite laminate comprises a laminate in which an organic resin layer containing an inorganic fiber cloth into which a thermosetting organic resin has been impregnated, and a silicone resin layer containing an inorganic fiber cloth into which a curable silicone resin has been impregnated, being laminated with each one or more layers, and metal foils laminated at an uppermost surface and a lowermost surface of the laminate. There can be provided a silicone-organic resin composite laminate which has low linear expansion, good thermal dimensional stability, excellent mechanical characteristics, and excellent heat resistance and light resistance, and is suitable as a mounting substrate for an LED which corresponds to increase in luminance of the LED mounted substrate.

Abstract: The present invention provides a concentrating solar cell module comprising: a base portion having a plurality of mounting regions for mounting solar cells and a plurality of lead electrodes for electrically connecting the solar cells with external electrodes; a support molded with a thermosetting resin such that each of the mounting regions of the base portion is surrounded; the solar cells mounted on the mounting regions; and a condensing lens molded above the mounting regions so as to encapsulate the solar cells, wherein a surface of the mounting regions of the base portion is plated and the condensing lens is molded with a transparent thermosetting silicone resin. The concentrating solar cell module has high heat dissipation properties and a high photoelectric conversion efficiency.

Abstract: Silicone-laminated substrate, including glass cloth, and cured product of silicone resin composition—with which the glass cloth is filled and a surface of the glass cloth is coated. The silicone resin composition includes: (A) an organopolysiloxane having a resin structure of specific siloxane units, (B) an organohydrogenpolysiloxane having a resin structure of specific siloxane units, (C) a platinum group metal-based catalyst, and (D) a filler. The silicone-laminated substrate exhibits excellent mechanical properties, flexibility and workability, has minimal surface tack, and is easy to handle. The silicone-laminated substrate is produced by impregnating a glass cloth with the silicone resin composition dissolved or dispersed in a solvent, subsequently evaporating the solvent from the glass cloth, and subjecting the composition impregnated into the glass cloth to heat-curing under compression-molding conditions.

Abstract: Provided are a heat-curable silicone resin sheet capable of easily and uniformly dispersing phosphors on an LED element surface and reducing a brightness through a light-diffusing effect, a method of producing a light emitting device using the same and an encapsulated light emitting semiconductor device produced by the corresponding method. The heat-curable silicone resin sheet includes at least two layers that are: a phosphor-containing layer consisting essentially of a phosphor-containing heat-curable silicone resin composition that is in a plastic solid or plastic semi-solid state at room temperature; and a white-pigment-containing layer consisting essentially of a white pigment-containing heat-cured silicone resin composition.

Abstract: Disclosed is an addition reaction-curable organopolysilmethylenesiloxane copolymer composition including: (A) an organopolysilmethylenesiloxane copolymer represented by formula (a) shown below: which has in one molecule at least two alkenyl groups bonding to silicon atoms; (B) an organopolysiloxane represented by formula (b) shown below: R2aSiO(4-a)/2??(b) which has in one molecule at least two alkenyl groups bonding to silicon atoms; (C) an organohydrogenpolysilmethylenesiloxane and/or organohydrogenpolysiloxane; and (D) a platinum group metal-based catalyst. The copolymer composition excels in heat resistance, electrical insulation, mechanical strength, and optical properties, and exhibits good water resistance, hydrolysis resistance and gas barrier properties under severe use conditions without suffering gas permeability and poor chemical resistance inherent in silicone rubber.

Abstract: A fiber-containing resin substrate for collectively encapsulating a semiconductor-device-mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor-device-forming surface of a wafer on which a semiconductor device is formed, including a resin-impregnated fibrous base material which is obtained by impregnating a fibrous base material with a thermosetting resin and semi-curing or curing the thermosetting resin and has a linear expansion coefficient (ppm/° C.) in an X-Y direction of less than 3 ppm, and an uncured resin layer formed of an uncured thermosetting resin on one side of the resin-impregnated fibrous base material.

Abstract: The invention provides an encapsulant equipped with the supporting substrate which is an encapsulant for collectively encapsulating a semiconductor devices mounting surface of a substrate having semiconductor devices mounting thereon or a semiconductor devices forming surface of a wafer having semiconductor devices forming thereon, and the encapsulant equipped with the supporting substrate comprises a supporting substrate having a difference of a linear expansion coefficient from that of the substrate or the wafer of 5 ppm or less and a thermosetting resin layer being laminated, wherein the thermosetting resin layer has a shape having a height difference to a thickness direction.

Abstract: The present invention provides a thermosetting silicone resin sheet having a phosphor-containing thermosetting silicone resin layer formed in the form of an LED device and a method for producing the same, and a light-emitting apparatus using the thermosetting silicone resin sheet and a method for producing the same. The present invention was accomplished by the phosphor-containing thermosetting silicone resin sheet comprising a substrate film and a phosphor-containing thermosetting silicone resin layer that is a plastic solid or a semi-solid at room temperature composed of a single layer having no adhesive layer, formed by printing and molding a phosphor-containing thermosetting silicone resin composition on the substrate film in the form of an LED device.

Abstract: A method of manufacturing a semiconductor apparatus includes: a charging step of charging the thermosetting resin in excess of an amount necessary for forming the sealing layer to fill the inside of the first cavity with the thermosetting resin and discharging an excess of the thermosetting resin from the first cavity; an integrating step of integrating the substrate on which the semiconductor device is mounted, the substrate on which no semiconductor device is mounted and the sealing layer by molding the thermosetting resin while pressurizing the upper mold and the lower mold; and a dicing step of extracting the integrated substrates from the molding mold and dicing the integrated substrates to obtain an individual semiconductor apparatus.

Abstract: A resin composition containing a silica-based filler which differs in refractive index by ±0.03 from the curable base resin and has a thermal conductivity no lower than 0.5 W/m·K, and a light-emitting diode encapsulated with said resin composition. The resin composition is preferably prepared from a curable silicone resin which imparts a cured product having a refractive index of 1.45 to 1.55 and cristobalite powder dispersed therein.

Abstract: A surface-mount light emitting device is provided comprising a light emitting element (2), a reflector (1) which is molded integral with a leadframe (11, 12) having the light emitting element mounted thereon, and an encapsulating resin composition (4). The reflector is molded from a heat curable resin composition to define a recess with bottom and side walls. The resin side wall has a thickness of 50-500 ?m. The encapsulating resin composition is a heat curable resin composition having a hardness of 30-70 Shore D units in the cured state.

Abstract: A thermosetting silicone resin composition for an LED reflector has: a thermosetting resin; at least one kind of white pigment selected from titanium oxide, zinc oxide, zirconium oxide, magnesium oxide, barium carbonate, magnesium silicate, zinc sulfate, and barium sulfate; and an inorganic filler other than the pigment, which contains at least one kind of inorganic filler that has an average particle diameter of 30 ?m to 100 ?m and a refraction index that is different from a refraction index of a cured material of the thermosetting resin by 0.05 or more, and at least one kind of inorganic filler that has an average particle diameter of less than 30 ?m. The thermosetting resin composition provides a cured material that has excellent heat and light resisting properties and hardly leaks light, a reflector for an LED obtained by molding using the composition, and an optical semiconductor apparatus using the reflector.

Abstract: A thermosetting silicone resin composition for reflector of LED has an organopolysiloxane represented by the following average compositional formula, and has at least two alkenyl groups in one molecule, a linear organohydrogen polysiloxane represented by the following formula and/or a branched organohydrogenpolysiloxane represented by the following formula, an addition reaction catalyst, a white pigment selected from titanium oxide, zinc oxide, magnesium oxide, barium carbonate, magnesium silicate, zinc sulfate and barium sulfate, and an inorganic filler other than Component, R1aR2bR3c(OR0)dSiO(4-a-b-c)/2??(1) R7eR8fHgSiO(4-e-f-g)/2??(3). There can be a thermosetting silicone resin composition which provides a cured product excellent in heat resistance and light resistance, less leakage of light to outside, and particularly suitable for a matrix array reflector.

Abstract: A method for producing a semiconductor apparatus with a mold including an upper mold half and a lower mold half, includes: an arranging step of arranging on one of the upper mold half and the lower mold half of the mold a substrate on which a semiconductor device is mounted, the mold being kept at a room temperature or heated to a temperature up to 200° C., and arranging on the other of the upper mold half and the lower mold half a substrate on which no semiconductor device is mounted; an integrating step of integrating the substrate on which the semiconductor device is mounted and the substrate on which no semiconductor device is mounted by molding a thermosetting resin with the mold on which the substrates are arranged; and a step of dicing the integrated substrates taken out of the mold to obtain an individualized semiconductor apparatus.

Abstract: Organopolysilmethylene-siloxane of the formula (1): wherein each R1 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, and a halogen atom; each R2 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, a halogen atom, and (R1)3SiCH2—, wherein each R3 is, independently of one another, a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; k is an integer of 1 to 100; and n is an integer of 1 to 1000; said organopolysilmethylene-siloxane having, in a molecule, at least two out of alkoxy groups, hydroxy groups, and halogen atoms bonded to one or more silicon atoms.

Abstract: Organopolysilmethylene-siloxane of the formula (1): wherein each R1 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, and a halogen atom; each R2 is, independently of one another, an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, a halogen atom, and (R1)3SiCH2—, wherein each R3 is, independently of one another, a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; k is an integer of 1 to 100; and n is an integer of 1 to 1000; said organopolysilmethylene-siloxane having, in a molecule, at least two out of alkoxy groups, hydroxy groups, and halogen atoms bonded to one or more silicon atoms.

Abstract: Disclosed herein is a resin composition including 100 parts by weight of an organic resin and 50 to 1,000 parts by weight of an inorganic filler, wherein 10 to 100% of the inorganic filler is composed of an oxide of a rare earth element.

Abstract: Silicone resin compositions comprising (A) an organopolysiloxane containing at least two aliphatic unsaturated bonds and having a viscosity of 100-1,000,000 mPa·s at 25° C., (B) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms (SiH groups) in the form of HR62SiO—, and (C) a platinum group metal base catalyst cure into colorless transparent parts which are useful lenses.

Abstract: A surface-mount light emitting device is provided comprising a light emitting element (2), a reflector (1) which is molded integral with a leadframe (11, 12) having the light emitting element mounted thereon, and an encapsulating resin composition (4). The reflector is molded from a heat curable resin composition to define a recess with bottom and side walls. The resin side wall has a thickness of 50-500 ?m. The encapsulating resin composition is a heat curable resin composition having a hardness of 30-70 Shore D units in the cured state.