Abstract: The present invention provides a solid electrolyte switching device, which can maintain an on or off state when the power source is removed, the resistance of which in on the state is low, and which is capable of integration and re-programming, and FPGA and a memory device using the same, and a method of manufacturing the same.

Abstract: A switching element of the present invention utilizes electro-chemical reactions to operate, and comprises ion conductive layer 54 capable of conducting metal ions, first electrode 49 arranged in contact with the ion conductive layer, and second electrode 58 for supplying metal ions to the ion conductive layer, wherein an oxygen absorption layer 55 which contains a material more prone to oxidization than the second electrode is formed in contact with the second electrode.

Abstract: A typical switching device according to the present invention comprises first insulating layer 1003 having an opening and made of a material for preventing metal ions from being diffused, first electrode 104 disposed in the opening and including a material capable of supplying the metal ions, ion conduction layer 105 disposed in contact with an upper surface of the first electrode 104 and capable of conducting the metal ions, and second electrode 106 disposed in contact with an upper surface of the ion conduction layer 105 and including a region made of a material incapable of the metal ions. A voltage is applied between the first electrode 104 and the second electrode 106 for controlling a conduction state between the first electrode 104 and the second electrode 106.

Abstract: A switching element includes a first electrode, a second electrode, an ionic conductive portion and a buffer portion. The first electrode is configured to be available to feed metal ions. The ionic conductive portion is configured to contact the first electrode and the second electrode, and include an ionic conductor in which the metal ions are movable. The buffer portion is configured to have a smaller hardness than the ionic conductor, and be located between the first electrode and the second electrode along the ionic conductive portion. Electrical characteristics are switched by depositing or melting metal between said first electrode and said second electrode based on a potential difference between said first electrode and said second electrode.

Abstract: After a sample is previously separated into plural components in a channel formed in a microchip (353), the channel is irradiated along a separation direction with a laser beam from a laser oscillator (361) to sequentially ionize each fraction separated in the channel. The ionized fraction is detected by a mass spectrometry unit (363) and analyzed by an analytical result analyzing unit (371). The analytical result is stored in a memory (369) while associated with position information in a driver control unit (367) and information on laser beam irradiation condition in a laser control unit (373), and the analytical result is imaged by an imaging unit (375). The imaged analytical result is displayed on a display (377).

Abstract: Scale down design has posed problems in an increase in the resistance value of an interconnection structure and a decrease in the resistance to electromigration and stress migration. The present invention provides an interconnection structure of a high-reliability semiconductor device which has a low resistance value even in the case of scale down design and does not produce electromigration or stress migration, and a method of manufacturing the interconnection structure. Provided are a semiconductor device which has an interconnection or a connection plug, both of which are fabricated from a mixture of a metal and carbon nanotubes, in an interconnection trench or a via hole, both of which are formed on an insulating film on a substrate on which a semiconductor device element is formed, and a method of manufacturing this semiconductor device.

Abstract: There has been a problem that micromiaturization causes increase of the resistance of wiring structure and degradation of electron migration resistance and stress migration resistance. The present invention provides a wiring structure of a semiconductor device having a low resistance even when the semiconductor device is microminiaturized, free of electron migration and stress migration, and having a high reliability and a method for manufacturing the same. A semiconductor device having a wiring or a connection plug made of a mixture of a metal and carbon nanotubes berried in a wiring groove or a via hole made in an insulating film on a substrate where a semiconductor chip is fabricated, and its manufacturing method are provided.

Abstract: The switching element of the present invention is of a configuration that includes: a first electrode (14) and a second electrode (15) provided separated by a prescribed distance; a solid electrolyte layer (16) provided in contact with the first electrode (14) and the second electrode (15); a third electrode (18) that can supply metal ions and that is provided in contact with the solid electrolyte layer (16); and a metal diffusion prevention film (17) that covers points of the surface of the solid electrolyte layer (16) that are not in contact with the first electrode (14), the second electrode (15) or the third electrode (18). This configuration prevents the adverse effect of metal ions upon other elements.

Abstract: A switching element is of a configuration that includes: an ion conduction layer (40) for conducting metal ions, a first electrode (21) and a second electrode (31) provided in contact with the ion conduction layer, a third electrode (35) that can supply metal ions to the ion conduction layer, and a diffusion prevention layer (90) provided between the ion conduction layer (40) and the third electrode (35) for preventing the diffusion of metal ions from the third electrode (35) to the ion conduction layer (40). By adopting this configuration, the set state of a switch can be maintained with greater stability.

Abstract: The switching element of the present invention includes an ion conduction layer (40) capable of conducting metal ions, a first electrode (21) and a second electrode (31) provided in contact with the ion conduction layer (40), and a third electrode (35) provided in contact with the ion conduction layer (40) and capable of supplying metal ions, and is of a configuration in which the area over which the first electrode (21) contacts the ion conduction layer (40) is smaller than the area over which the second electrode (31) contacts the ion conduction layer (40). The use of this configuration decreases the leak current in the OFF state.

Abstract: The switching element of the present invention includes: an ion conduction layer (4) in which metal ions can move freely; a first electrode (1) that contacts the ion conduction layer (4); and a second electrode (2) that contacts the ion conduction layer (4), that is formed such that the ion conduction layer (4) is interposed between the first electrode (1) and the second electrode (2), and that supplies metal ions to the ion conduction layer (4) or that receives metal ions from the ion conduction layer (4) to cause precipitation of the metal that corresponds to the metal ions. An introduction path (5) composed of the metal and of a prescribed width is further provided on the ion conduction layer (4) for electrically connecting the first electrode (1) and the second electrode (2).

Abstract: The switching element of the present invention is of a configuration that includes: an ion conduction layer (40) that includes an oxide, a first electrode (21) and a second electrode (31) that are provided in contact with the ion conduction layer (40) and that are connected by the precipitate of metal that is supplied from the outside or for which electrical properties change due to the dissolution of precipitated metal, and a third electrode (35) provided in contact with the ion conduction layer (40) and that can supply metal ions. The use of this configuration allows the switching voltage to be set higher than in the related art.

Abstract: A switching element with a switching voltage set higher than conventional, which includes an ion conduction layer including tantalum oxide, a first electrode provided in contact with the ion conduction layer, and a second electrode provided in contact with the ion conduction layer and capable of supplying the ion conduction layer with metal ions.

Abstract: A switching element has an ion conductor capable of conducting metal ions for use in an electrochemical reaction therein, a first electrode and a second electrode which are disposed in contact with said ion conductor and spaced a predetermined distance from each other, and a third electrode disposed in contact with the ion conductor. When a voltage for causing the switching element to transit to an on state is applied to the third electrode, metal is precipitated between the first electrode and the second electrode by metal ions, electrically interconnecting the first electrode and the second electrode. When a voltage for causing the switching element to transit to an off state is applied to the third electrode, the precipitated metal is dissolved to electrically disconnect the first electrode and the second electrode from each other.

Abstract: After a sample is previously separated into plural components in a channel formed in a microchip (353), the channel is irradiated along a separation direction with a laser beam from a laser oscillator (361) to sequentially ionize each fraction separated in the channel. The ionized fraction is detected by a mass spectrometry unit (363) and analyzed by an analytical result analyzing unit (371). The analytical result is stored in a memory (369) while associated with position information in a driver control unit (367) and information on laser beam irradiation condition in a laser control unit (373), and the analytical result is imaged by an imaging unit (375). The imaged analytical result is displayed on a display (377).

Abstract: A switching element has an ion conductor capable of conducting metal ions for use in an electrochemical reaction therein, a first electrode and a second electrode which are disposed in contact with said ion conductor and spaced a predetermined distance from each other, and a third electrode disposed in contact with the ion conductor. When a voltage for causing the switching element to transit to an on state is applied to the third electrode, metal is precipitated between the first electrode and the second electrode by metal ions, electrically interconnecting the first electrode and the second electrode, When a voltage for causing the switching element to transit to an off state is applied to the third electrode, the precipitated metal is dissolved to electrically disconnect the first electrode and the second electrode from each other.

Abstract: The present invention relates to a transistor for selecting a storage cell and a switch using a solid electrolyte. In a storage cell, a metal is stacked on a drain diffusion layer of a field-effect transistor formed on a semiconductor substrate surface. The solid electrolyte using the metal as a carrier is stacked on the metal. The solid electrolyte contacts with the metal via a gap, and the metal is connected to a common grounding conductor. A source of the field-effect transistor is connected to a column address line, and a gate of the field-effect transistor is connected to a row address line.

Abstract: There has been a problem that micromiaturization causes increase of the resistance of wiring structure and degradation of electron migration resistance and stress migration resistance. The present invention provides a wiring structure of a semiconductor device having a low resistance even when the semiconductor device is microminiaturized, free of electron migration and stress migration, and having a high reliability and a method for manufacturing the same. A semiconductor device having a wiring or a connection plug made of a mixture of a metal and carbon nanotubes berried in a wiring groove or a via hole made in an insulating film on a substrate where a semiconductor chip is fabricated, and its manufacturing method are provided.

Abstract: A separation apparatus (100) has a separation channel (112), a partition wall (301a) and a partition wall (301b), wherein each of the partition wall (301a) and the partition wall (301b) has a capture portion (300) formed thereon. Molecules having a size acceptable by the capture portions (300) provided on the partition wall (301a) and the partition wall (301b) are captured by the capture portion (300) and reduced in the travel speed through the separation channel (112), and this makes it possible to precisely separate the sample depending on the molecular size.

Abstract: The present invention provides a solid electrolyte switching device, which can maintain an on or off state when the power source is removed, the resistance of which in on the state is low, and which is capable of integration and re-programming, and FPGA and a memory device using the same, and a method of manufacturing the same.