Patents by Inventor Toshiyuki Kawashima

Toshiyuki Kawashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7599106
    Abstract: The present invention relates to an optical mask at low cost and so on having a structure capable of reducing further a peak of beam intensity caused by diffraction. The optical mask is constructed by overlapping a first mask and a second mask. The first mask and second mask each are a serrated aperture mask. The schematic shapes of the respective apertures of the first mask and second mask are almost rectangular and identical to each other. The fringe defining the aperture of the first mask is machined in a serrated shape, and the fringe defining the aperture of the second mask also is machined in a serrated shape. In the optical mask, the first mask and second mask are overlapped so that the serrations of the fringes defining the respective apertures of the first mask and second mask are located alternately.
    Type: Grant
    Filed: November 19, 2004
    Date of Patent: October 6, 2009
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Osamu Matsumoto, Toshiyuki Kawashima, Tadashi Kanabe
  • Publication number: 20090206236
    Abstract: An illumination device includes: a light emitting element to be a light source; a light amount detecting means for detecting the amount of light emitted by the light emitting element; a light emitting element drive means for controlling drive current supplied to the light emitting element so that the difference between the light mount detected by the light amount detecting means and a light amount target value becomes small; a junction temperature detecting means for calculating junction temperature of the light emitting element; and a setting means for setting the light amount target value in accordance with the junction temperature detected by the junction temperature detecting means.
    Type: Application
    Filed: February 11, 2009
    Publication date: August 20, 2009
    Applicant: Sony Corporation
    Inventors: Toshiyuki Kawashima, Shinji Ogawa, Takeshi Kodama
  • Patent number: 7502396
    Abstract: A solid-state laser apparatus which can improve its durability is provide. In the solid-state laser apparatus 1, a main pipe 11 for circulating a coolant through a solid-state laser medium 3 is provided with a heat exchanger 14, whereby the laser medium 3 is prevented from raising its temperature. When the coolant becomes acidic or alkaline, a controller 24 controls a flow regulating valve 23, so as to increase the flow rate of the coolant flowing into a bypass pipe 21 provided with a deionizing filter 22, whereby the acidity or alkalinity of the coolant can be weakened. This can prevent the coolant from deteriorating a predetermined part of the laser apparatus 3, and thus can improve the durability of the solid-state laser apparatus 1.
    Type: Grant
    Filed: August 23, 2004
    Date of Patent: March 10, 2009
    Assignees: Hamamatsu Photonics K.K.
    Inventors: Toshiyuki Kawashima, Tadashi Kanabe, Sadao Nakai, Hirofumi Kan
  • Publication number: 20080089372
    Abstract: A solid laser module etc. having a structure that enables to obtain a high-quality light output. The solid laser module has a vacuum container with a window, and a heat sink, a solid laser medium, and a pair of transparent members are received in an integrally assembled state in the container. The solid laser medium and the pair of transparent members are each formed in a disc shape, and the solid laser medium is sandwiched between the pair of transparent members. The thermal conductivity of each of the pair of transparent members is higher than the thermal conductivity of the solid laser medium. The heat sink is shaped to simultaneously hold portions of the pair of transparent members that hold the solid laser medium in between. A heat insulation region having a lower thermal conductivity than the solid laser medium is provided between the heat sink and the solid laser medium.
    Type: Application
    Filed: November 24, 2005
    Publication date: April 17, 2008
    Applicants: OSAKA UNIVERSITY, HAMAMATSU PHOTONICS K.K.
    Inventors: Yasukazu Izawa, Masayuki Fujita, Shigeki Tokita, Tadashi Ikegawa, Toshiyuki Kawashima, Hirofumi Kan
  • Publication number: 20070297470
    Abstract: In the solid-state laser apparatus 1, a main pipe 11 for circulating a coolant through a solid-state laser medium 3 is provided with a heat exchanger 14, whereby the laser medium 3 is prevented from raising its temperature. When the coolant becomes acidic or alkaline, a controller 24 controls a flow regulating valve 23, so as to increase the flow rate of the coolant flowing into a bypass pipe 21 provided with a deionizing filter 22, whereby the acidity or alkalinity of the coolant can be weakened. This can prevent the coolant from deteriorating a predetermined part of the laser apparatus 3, and thus can improve the durability of the solid-state laser apparatus 1. Also, since the bypass pipe 21 connected in parallel to a part of the main pipe 11 is provided with the deionizing filter 22, the flow rate of the coolant circulating through the main pipe 11 can be restrained from decreasing, and the cooling efficiency of the laser medium 3 can be prevented from lowering.
    Type: Application
    Filed: August 23, 2004
    Publication date: December 27, 2007
    Inventors: Toshiyuki Kawashima, Tadashi Kanabe, Sadao Nakai, Hirofumi Kan
  • Publication number: 20070189346
    Abstract: A solid-state laser apparatus which can cool a solid-state laser medium such that the solid-state laser medium attains a uniform temperature along the propagating direction of light to be amplified is provided. In a solid-state laser apparatus 1, a coolant circulating through flow paths 12a, 12b comes into direct contact with a pair of reflecting end faces 5a, 5b of a solid-state laser medium 3, whereby the laser medium 3 heated by pumping light emitted from semiconductor lasers 9 can efficiently be cooled. Since the coolant circulates through the flow paths 12a, 12b in a direction substantially perpendicular to a propagating surface P of light to be amplified L, the solid-state laser medium 3 can be cooled such as to attain a uniform temperature along a propagating direction of the light L. This can lower the thermal lens effect and thermal birefringence effect in the solid-state laser medium 3.
    Type: Application
    Filed: August 23, 2004
    Publication date: August 16, 2007
    Inventors: Toshiyuki Kawashima, Tadashi Kanabe, Sadao Nakai, Hirofumi Kan
  • Patent number: 7237332
    Abstract: The present invention provides a method of manufacturing a wiring board, including the steps of preparing a composite sheet having an adherent sheet containing a thermosetting resin adhered to a porous film or impregnated with at least a part thereof, laminating at least the composite sheet on a wiring layer having a wiring pattern formed on an insulating layer, and heating and pressurizing the laminated product thus obtained or heating and pressurizing it after the pressurization to integrate the laminated product.
    Type: Grant
    Filed: April 7, 2004
    Date of Patent: July 3, 2007
    Assignee: Nitto Denko Corporation
    Inventors: Toshiyuki Kawashima, Nobuharu Tahara, Kenichi Ikeda
  • Patent number: 7121000
    Abstract: A method of manufacturing a multilayer wiring board according to the present invention comprises the step of heating and pressurizing a stacked product to be integrated in a state in which a plurality of double-sided wiring boards (10) having a wiring pattern (12) formed on both surfaces of an insulating layer (11) are laminated through a prepreg (1) obtained by impregnating a resin porous film with a thermosetting resin. The present invention is advantageous to mass production because a gap for forming an insulating layer can easily be controlled, and furthermore, can provide thinner layers of the whole board and is also advantageous to the flattening of the surface of the board.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: October 17, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Toshiyuki Kawashima, Nobuharu Tahara, Kenichi Ikeda
  • Patent number: 7061552
    Abstract: A method and apparatus for performing autoconvergence is described. An image having a first aspect ratio and a plurality of sides is received. The image is displayed on a display having a second aspect ratio and at least one sensor corresponding to each side of the image. The image is moved so that each sensor can detect the corresponding side of the image.
    Type: Grant
    Filed: January 28, 2000
    Date of Patent: June 13, 2006
    Assignees: Sony Corporation, Sony Electronics Inc.
    Inventors: Chris Warren Patten, Toshiyuki Kawashima
  • Patent number: 7022373
    Abstract: A method of forming a composite insulating layer in which a thin and uniform adhesive layer can be formed, and an adhesive strength between an adhesive layer and a porous layer is sufficient, a insulating layer obtained by the formation method, and a process of producing a wiring board, wherein an insulating layer is formed by the formation method, are disclosed. The method of forming a composite insulating layer includes a step of forming an adhesive layer 2 containing a partially imidated polyamic acid on a metallic foil 1; a step of applying a solution 3 containing a polyamic acid to the surface of the adhesive layer 2; a step of subjecting the coated solution 3 to phase separation to form a porous layer 4; and a step of subjecting the adhesive layer 2 and the porous layer 4 to imide conversion.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: April 4, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Nobuharu Tahara, Toshiyuki Kawashima
  • Patent number: 7017264
    Abstract: The present invention provides a method of manufacturing a multilayer wiring board comprising the step of impregnating a raw material composition of a thermosetting resin in a porous laminated product including two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers and of half curing or curing them. Moreover, the present invention provides a multilayer wiring board having such a lamination structure that two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers are integrated through an impregnated and cured thermosetting resin.
    Type: Grant
    Filed: June 11, 2002
    Date of Patent: March 28, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Kenichi Ikeda, Toshiyuki Kawashima, Nobuharu Tahara, Kazuo Oouchi
  • Publication number: 20050117076
    Abstract: The present invention provides an apparatus for adjusting registration to correct distortion and color shift of images on a display screen which comprises RAMs (13) and (15) for storing correction data for deflection used to correct scanning positions of image signals for respective plural adjustment points arranged on the display screen along the horizontal direction and the vertical direction, and an Interpolation calculation block (18) for determining the number of interpolation scanning lines being the number of scanning lines which are scanned between the adjustment points corresponding to input image signals as well as for performing interpolation calculation based on the number of interpolation scanning lines for correction waveforms corresponding to display screen position induced from the correction data of the respective adjustment points to generate current signals to be applied to deflection yokes.
    Type: Application
    Filed: May 16, 2002
    Publication date: June 2, 2005
    Inventors: Yusuke Kawamura, Shigeyuki Sano, Mie Hirai, Toshiyuki Kawashima, Seiji Saito, Ayako Kuroda
  • Publication number: 20050111514
    Abstract: The present invention relates to an optical mask at low cost and so on having a structure capable of reducing further a peak of beam intensity caused by diffraction. The optical mask is constructed by overlapping a first mask and a second mask. The first mask and second mask each are a serrated aperture mask. The schematic shapes of the respective apertures of the first mask and second mask are almost rectangular and identical to each other. The fringe defining the aperture of the first mask is machined in a serrated shape, and the fringe defining the aperture of the second mask also is machined in a serrated shape. In the optical mask, the first mask and second mask are overlapped so that the serrations of the fringes defining the respective apertures of the first mask and second mask are located alternately.
    Type: Application
    Filed: November 19, 2004
    Publication date: May 26, 2005
    Inventors: Osamu Matsumoto, Toshiyuki Kawashima, Tadashi Kanabe
  • Publication number: 20050094037
    Abstract: A projecting image display device such as a rear projection type television receiver is provided that includes at least three image projecting sources for projecting images in a different color of light and a viewing screen on which the images are projected. The device also includes at least three lens assemblies each disposed in an optical path between one of the image projecting sources and the viewing screen. Each of the lens assemblies includes a plurality of lens elements. A shading element, which is affixed to at least one of the lens elements, has a shape and orientation on the lens element that causes an increase in color uniformity across the viewing screen.
    Type: Application
    Filed: October 31, 2003
    Publication date: May 5, 2005
    Inventors: Toshiyuki Kawashima, Masanori Takenaka, Christopher Palassis, Keiichi Yoneyama
  • Patent number: 6807729
    Abstract: The present invention provides a method of manufacturing a metal foil laminated product including the steps of forming a bonding layer containing a thermosetting resin on a lower wiring layer, a metal layer or an insulating layer, provisionally bonding a porous layer having a releasing film attached thereto onto a surface of the bonding layer, peeling the releasing film from the porous layer, laminating a metal foil on the porous layer obtained after the peeling, and heating and pressurizing the laminated product to transfer the bonding layer to the metal foil and thereby integrating them. Furthermore, the present invention provides a method of manufacturing a wiring board comprising the steps of manufacturing a metal foil laminated product by the above manufacturing methods, and providing a pattern on the metal foil of the metal foil laminated product, thereby forming a wiring layer.
    Type: Grant
    Filed: June 11, 2002
    Date of Patent: October 26, 2004
    Assignee: Nitto Denko Corporation
    Inventors: Toshiyuki Kawashima, Nobuharu Tahara, Kenichi Ikeda
  • Publication number: 20040187305
    Abstract: The present invention provides a method of manufacturing a wiring board, including the steps of preparing a composite sheet having an adherent sheet containing a thermosetting resin adhered to a porous film or impregnated with at least a part thereof, laminating at least the composite sheet on a wiring layer having a wiring pattern formed on an insulating layer, and heating and pressurizing the laminated product thus obtained or heating and pressurizing it after the pressurization to integrate the laminated product.
    Type: Application
    Filed: April 7, 2004
    Publication date: September 30, 2004
    Inventors: Toshiyuki Kawashima, Nobuharu Tahara, Kenichi Ikeda
  • Publication number: 20040194132
    Abstract: A method and apparatus for optimizing picture quality of a video signal. The method includes displaying a user menu having a plurality of choices of video labels; receiving a choice of video label from the plurality via an input from a user; translating the video label into a label code; receiving at least a first video processing parameter from a look-up table corresponding to the label code; and configuring a video processor according to the first video processing parameter.
    Type: Application
    Filed: March 31, 2003
    Publication date: September 30, 2004
    Applicant: Sony Corporation/Sony Electronics Inc.
    Inventors: Toshiyuki Kawashima, Frank L. Medeiros
  • Publication number: 20040170754
    Abstract: A method of forming a composite insulating layer in which a thin and uniform adhesive layer can be formed, and an adhesive strength between an adhesive layer and a porous layer is sufficient, a insulating layer obtained by the formation method, and a process of producing a wiring board, wherein an insulating layer is formed by the formation method, are disclosed. The method of forming a composite insulating layer includes a step of forming an adhesive layer 2 containing a partially imidated polyamic acid on a metallic foil 1; a step of applying a solution 3 containing a polyamic acid to the surface of the adhesive layer 2; a step of subjecting the coated solution 3 to phase separation to form a porous layer 4; and a step of subjecting the adhesive layer 2 and the porous layer 4 to imide conversion.
    Type: Application
    Filed: February 19, 2004
    Publication date: September 2, 2004
    Applicant: NITTO DENKO CORPORATION
    Inventors: Nobuharu Tahara, Toshiyuki Kawashima
  • Patent number: 6773572
    Abstract: A method of metal layer formation which can satisfactorily eliminate the problems caused by plating solution infiltration and is sufficiently effective in reducing the permittivity of an insulating layer; and a metal foil-based layered product obtainable by the method. The method is for forming a metal layer on a surface of a porous resin layer and includes: a step in which a porous resin layer having a dense layer as a surface part thereof is used as the porous resin layer and a thin metal film is formed on the surface of the dense layer by a dry process; and a step in which a metal film is formed on the surface of the thin metal film by plating.
    Type: Grant
    Filed: December 30, 2002
    Date of Patent: August 10, 2004
    Assignee: Nitto Denko Corporation
    Inventors: Toshiyuki Kawashima, Nobuharu Tahara, Kenichi Ikeda
  • Patent number: 6761790
    Abstract: The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90 &mgr;m and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: July 13, 2004
    Assignee: Nitto Denko Corporation
    Inventors: Toshiyuki Kawashima, Nobuharu Tahara, Kenichi Ikeda