Abstract: In the solid-state laser apparatus 1, a main pipe 11 for circulating a coolant through a solid-state laser medium 3 is provided with a heat exchanger 14, whereby the laser medium 3 is prevented from raising its temperature. When the coolant becomes acidic or alkaline, a controller 24 controls a flow regulating valve 23, so as to increase the flow rate of the coolant flowing into a bypass pipe 21 provided with a deionizing filter 22, whereby the acidity or alkalinity of the coolant can be weakened. This can prevent the coolant from deteriorating a predetermined part of the laser apparatus 3, and thus can improve the durability of the solid-state laser apparatus 1. Also, since the bypass pipe 21 connected in parallel to a part of the main pipe 11 is provided with the deionizing filter 22, the flow rate of the coolant circulating through the main pipe 11 can be restrained from decreasing, and the cooling efficiency of the laser medium 3 can be prevented from lowering.

Abstract: A solid-state laser apparatus which can cool a solid-state laser medium such that the solid-state laser medium attains a uniform temperature along the propagating direction of light to be amplified is provided. In a solid-state laser apparatus 1, a coolant circulating through flow paths 12a, 12b comes into direct contact with a pair of reflecting end faces 5a, 5b of a solid-state laser medium 3, whereby the laser medium 3 heated by pumping light emitted from semiconductor lasers 9 can efficiently be cooled. Since the coolant circulates through the flow paths 12a, 12b in a direction substantially perpendicular to a propagating surface P of light to be amplified L, the solid-state laser medium 3 can be cooled such as to attain a uniform temperature along a propagating direction of the light L. This can lower the thermal lens effect and thermal birefringence effect in the solid-state laser medium 3.

Abstract: The present invention provides a method of manufacturing a wiring board, including the steps of preparing a composite sheet having an adherent sheet containing a thermosetting resin adhered to a porous film or impregnated with at least a part thereof, laminating at least the composite sheet on a wiring layer having a wiring pattern formed on an insulating layer, and heating and pressurizing the laminated product thus obtained or heating and pressurizing it after the pressurization to integrate the laminated product.

Abstract: A method of manufacturing a multilayer wiring board according to the present invention comprises the step of heating and pressurizing a stacked product to be integrated in a state in which a plurality of double-sided wiring boards (10) having a wiring pattern (12) formed on both surfaces of an insulating layer (11) are laminated through a prepreg (1) obtained by impregnating a resin porous film with a thermosetting resin. The present invention is advantageous to mass production because a gap for forming an insulating layer can easily be controlled, and furthermore, can provide thinner layers of the whole board and is also advantageous to the flattening of the surface of the board.

Abstract: A method and apparatus for performing autoconvergence is described. An image having a first aspect ratio and a plurality of sides is received. The image is displayed on a display having a second aspect ratio and at least one sensor corresponding to each side of the image. The image is moved so that each sensor can detect the corresponding side of the image.

Abstract: A method of forming a composite insulating layer in which a thin and uniform adhesive layer can be formed, and an adhesive strength between an adhesive layer and a porous layer is sufficient, a insulating layer obtained by the formation method, and a process of producing a wiring board, wherein an insulating layer is formed by the formation method, are disclosed. The method of forming a composite insulating layer includes a step of forming an adhesive layer 2 containing a partially imidated polyamic acid on a metallic foil 1; a step of applying a solution 3 containing a polyamic acid to the surface of the adhesive layer 2; a step of subjecting the coated solution 3 to phase separation to form a porous layer 4; and a step of subjecting the adhesive layer 2 and the porous layer 4 to imide conversion.

Abstract: The present invention provides a method of manufacturing a multilayer wiring board comprising the step of impregnating a raw material composition of a thermosetting resin in a porous laminated product including two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers and of half curing or curing them. Moreover, the present invention provides a multilayer wiring board having such a lamination structure that two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers are integrated through an impregnated and cured thermosetting resin.

Abstract: The present invention provides an apparatus for adjusting registration to correct distortion and color shift of images on a display screen which comprises RAMs (13) and (15) for storing correction data for deflection used to correct scanning positions of image signals for respective plural adjustment points arranged on the display screen along the horizontal direction and the vertical direction, and an Interpolation calculation block (18) for determining the number of interpolation scanning lines being the number of scanning lines which are scanned between the adjustment points corresponding to input image signals as well as for performing interpolation calculation based on the number of interpolation scanning lines for correction waveforms corresponding to display screen position induced from the correction data of the respective adjustment points to generate current signals to be applied to deflection yokes.

Abstract: The present invention relates to an optical mask at low cost and so on having a structure capable of reducing further a peak of beam intensity caused by diffraction. The optical mask is constructed by overlapping a first mask and a second mask. The first mask and second mask each are a serrated aperture mask. The schematic shapes of the respective apertures of the first mask and second mask are almost rectangular and identical to each other. The fringe defining the aperture of the first mask is machined in a serrated shape, and the fringe defining the aperture of the second mask also is machined in a serrated shape. In the optical mask, the first mask and second mask are overlapped so that the serrations of the fringes defining the respective apertures of the first mask and second mask are located alternately.

Abstract: A projecting image display device such as a rear projection type television receiver is provided that includes at least three image projecting sources for projecting images in a different color of light and a viewing screen on which the images are projected. The device also includes at least three lens assemblies each disposed in an optical path between one of the image projecting sources and the viewing screen. Each of the lens assemblies includes a plurality of lens elements. A shading element, which is affixed to at least one of the lens elements, has a shape and orientation on the lens element that causes an increase in color uniformity across the viewing screen.

Abstract: The present invention provides a method of manufacturing a metal foil laminated product including the steps of forming a bonding layer containing a thermosetting resin on a lower wiring layer, a metal layer or an insulating layer, provisionally bonding a porous layer having a releasing film attached thereto onto a surface of the bonding layer, peeling the releasing film from the porous layer, laminating a metal foil on the porous layer obtained after the peeling, and heating and pressurizing the laminated product to transfer the bonding layer to the metal foil and thereby integrating them. Furthermore, the present invention provides a method of manufacturing a wiring board comprising the steps of manufacturing a metal foil laminated product by the above manufacturing methods, and providing a pattern on the metal foil of the metal foil laminated product, thereby forming a wiring layer.

Abstract: The present invention provides a method of manufacturing a wiring board, including the steps of preparing a composite sheet having an adherent sheet containing a thermosetting resin adhered to a porous film or impregnated with at least a part thereof, laminating at least the composite sheet on a wiring layer having a wiring pattern formed on an insulating layer, and heating and pressurizing the laminated product thus obtained or heating and pressurizing it after the pressurization to integrate the laminated product.

Abstract: A method and apparatus for optimizing picture quality of a video signal. The method includes displaying a user menu having a plurality of choices of video labels; receiving a choice of video label from the plurality via an input from a user; translating the video label into a label code; receiving at least a first video processing parameter from a look-up table corresponding to the label code; and configuring a video processor according to the first video processing parameter.

Abstract: A method of forming a composite insulating layer in which a thin and uniform adhesive layer can be formed, and an adhesive strength between an adhesive layer and a porous layer is sufficient, a insulating layer obtained by the formation method, and a process of producing a wiring board, wherein an insulating layer is formed by the formation method, are disclosed. The method of forming a composite insulating layer includes a step of forming an adhesive layer 2 containing a partially imidated polyamic acid on a metallic foil 1; a step of applying a solution 3 containing a polyamic acid to the surface of the adhesive layer 2; a step of subjecting the coated solution 3 to phase separation to form a porous layer 4; and a step of subjecting the adhesive layer 2 and the porous layer 4 to imide conversion.

Abstract: A method of metal layer formation which can satisfactorily eliminate the problems caused by plating solution infiltration and is sufficiently effective in reducing the permittivity of an insulating layer; and a metal foil-based layered product obtainable by the method. The method is for forming a metal layer on a surface of a porous resin layer and includes: a step in which a porous resin layer having a dense layer as a surface part thereof is used as the porous resin layer and a thin metal film is formed on the surface of the dense layer by a dry process; and a step in which a metal film is formed on the surface of the thin metal film by plating.

Abstract: The present invention provides a method of manufacturing a wiring board, including the steps of forming a through hole on a prepreg having a releasing resin film on at least one of its surfaces, the prepreg being obtained by impregnating a porous film having a thickness of 5 to 90 &mgr;m and a porosity of 30 to 98% with a half cured thermosetting resin, filling the through hole with a conductive paste containing a conductive filler, peeling the resin film, laminating a metal foil on a surface from which the resin film is peeled, and heating and pressurizing the laminated product.

Abstract: The present invention provides a method of manufacturing a metal foil laminated plate comprising the step of forming and attaching a resin porous layer onto a metal foil by a wet coagulating method, wherein a metal foil including a conductive bump having an almost equal height on a film forming side surface is used. The present invention provides a metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height and a resin porous layer laminated integrally, the conductive bump being exposed. The present invention provides another metal foil laminated plate comprising a metal foil including a conductive bump having an almost equal height, a resin porous layer laminated integrally, and a thermosetting resin impregnated in a hole of the resin porous layer, in which the conductive bump is exposed from the resin porous layer.

Abstract: A method of manufacturing a multilayer wiring board according to the present invention comprises the step of heating and pressurizing a stacked product to be integrated in a state in which a plurality of double-sided wiring boards (10) having a wiring pattern (12) formed on both surfaces of an insulating layer (11) are laminated through a prepreg (1) obtained by impregnating a resin porous film with a thermosetting resin. The present invention is advantageous to mass production because a gap for forming an insulating layer can easily be controlled, and furthermore, can provide thinner layers of the whole board and is also advantageous to the flattening of the surface of the board.

Abstract: A metal foil-based layered product which can eliminate the problems caused by etchant infiltration, can be produced easily, and is sufficiently effective in reducing the permittivity of the whole insulating layer; and a process for producing the same. The process for producing the metal foil-based layered product includes the steps of: forming on a metal foil an undercoat film layer made of a poly(amic acid) which has been imidized at least partly; forming a porous precursor layer on the undercoat film layer by a wet film-forming method using a solution containing a poly(amic acid); and imidizing at least the porous precursor layer.

Abstract: A wiring board prepreg manufacturing method of the present invention includes the step of depositing and adhering a porous layer made of aromatic polyamide or polyimide onto a heat resistant base material sheet according to a wet gelation process, and the step of impregnating at least one portion of a raw material composition of thermoset resin with insides of pores of the porous layer adhered to the heat resistant base material sheet. Moreover, it is preferable that the step of impregnating the base material composition of the thermoset resin includes the step of applying a raw material liquid of the thermoset resin containing a solvent to a surface of a base material, the step of removing the solvent from the applied raw material liquid so as to obtain a solid coating film, and the step of while heating the solid coating film, laminating and pressurizing the film together with the base material onto the porous layer so as to impregnate at least one portion of the solid coating film.