Abstract: A floor member is formed in an isosceles trapezoidal shape in which an upper base is shorter than a lower base, by a plate-like member, and is attached to a body of a vehicle with the upper base facing in a vehicle front direction. Respective interlocking shapes are formed at an upper base side portion of the floor member and an upper base matching part. Respective inclined shapes are formed at a lower base side portion of the floor member and a lower base matching part, such that when a force acts on the floor member from the vehicle front side, the lower base of the floor member is pushed up toward the vehicle upper rear side. A plurality of rib shapes that project upward or downward are formed at the floor member with a vehicle front-rear direction as a longitudinal direction of the plurality of rib shapes.

Abstract: An ECU performs a process including: when a vehicle establishes a Ready-On state, selecting a CD mode; when discharging power is uncompleted and a scheduled time to return the vehicle is a time within a discharging period, setting a second target SOC as a mode switching value; and when the vehicle's power storage device has an SOC reaching the mode switching value and a surcharge imposed on a rental fee is unaccepted, switching the current control mode from the CD mode to a CS mode.

Abstract: A floor member is formed in an isosceles trapezoidal shape in which an upper base is shorter than a lower base, by a plate-like member, and is attached to a body of a vehicle with the upper base facing in a vehicle front direction. Respective interlocking shapes are formed at an upper base side portion of the floor member and an upper base matching part. Respective inclined shapes are formed at a lower base side portion of the floor member and a lower base matching part, such that when a force acts on the floor member from the vehicle front side, the lower base of the floor member is pushed up toward the vehicle upper rear side. A plurality of rib shapes that project upward or downward are formed at the floor member with a vehicle front-rear direction as a longitudinal direction of the plurality of rib shapes.

Abstract: A carbonaceous member contains graphene aggregates formed by deposition of a single layer or multiple layers of graphene, and flat graphite particles, and has a structure in which the flat graphite particles are laminated with the graphene aggregate as a binder so that basal surfaces of the graphite particles overlap with one another, and the basal surfaces of the flat graphite particles are oriented in one direction. A metal layer includes a metal plating layer directly formed on a surface (edge lamination surface) to which edge surfaces of the graphite particles laminated in the carbonaceous member are directed, and the metal plating layer is made of a metal having a thermal conductivity of 50 W/(m·k) or greater.

Abstract: An ECU performs a process including: when a vehicle establishes a Ready-On state, selecting a CD mode; when discharging power is uncompleted and a scheduled time to return the vehicle is a time within a discharging period, setting a second target SOC as a mode switching value; and when the vehicle's power storage device has an SOC reaching the mode switching value and a surcharge imposed on a rental fee is unaccepted, switching the current control mode from the CD mode to a CS mode.

Abstract: The present invention provides a ceramic-aluminum bonded body in which Mg-containing oxide having a spinel crystal structure are dispersed in an aluminum member within a range of 2 ?m in a thickness direction from a bonded interface with a ceramic member, a segregated portion in which Mg, Si, and O is segregated is formed in the aluminum member in the vicinity of the bonded interface with the ceramic member, mass ratios of Mg, Si, and O between the segregated portion and a position spaced by 10 ?m from the bonded interface toward an aluminum member side are within predetermined ranges, and the amount of Mg at the position spaced by 10 ?m from the bonded interface toward the aluminum member side is 0.8 mass % or less.

Abstract: A thermoelectric conversion module in which a plurality of P-type thermoelectric conversion elements and N-type thermoelectric conversion elements, which are combined in pairs, are connected in series between a pair of opposing wiring substrates via the wiring substrates: electrode parts to which the thermoelectric conversion elements are connected, are formed on surfaces of ceramic substrates of the wiring substrates: among the thermoelectric conversion elements, the thermoelectric conversion element having a larger thermal expansion coefficient has the length, in a direction in which the wiring substrates face each other, that is smaller than the length, in a direction in which the wiring substrates face each other, of the thermoelectric conversion element having a smaller thermal expansion coefficient: an electrically conductive spacer is interposed between at least one of the two ends of the thermoelectric conversion element having a larger thermal expansion coefficient and the ceramic substrate of the wi

Abstract: An ultrasound probe includes: a plurality of transducer elements each configured to perform at least one selected from between transmission of an ultrasound wave and reception of an ultrasound wave; first circuitry that is arranged on a rear face side of the transducer elements, is provided with electronic circuitry corresponding to two or more of the transducer elements organized in a first group, and is provided with a through silicon via corresponding to two or more of the transducer elements organized in a second group; and second circuitry that is arranged on a rear face side of the first circuitry, is provided with a through silicon via corresponding to the two or more of the transducer elements organized in the first group, and is provided with electronic circuitry corresponding to the two or more of the transducer elements organized in the second group.

Abstract: A thermoelectric conversion module in which a plurality of P-type thermoelectric conversion elements and N-type thermoelectric conversion elements, which are combined in pairs, are connected in series between a pair of opposing wiring substrates via the wiring substrates: electrode parts to which the thermoelectric conversion elements are connected, are formed on surfaces of ceramic substrates of the wiring substrates: among the thermoelectric conversion elements, the thermoelectric conversion element having a larger thermal expansion coefficient has the length, in a direction in which the wiring substrates face each other, that is smaller than the length, in a direction in which the wiring substrates face each other, of the thermoelectric conversion element having a smaller thermal expansion coefficient: an electrically conductive spacer is interposed between at least one of the two ends of the thermoelectric conversion element having a larger thermal expansion coefficient and the ceramic substrate of the wi

Abstract: The present invention provides a ceramic-aluminum bonded body in which Mg-containing oxide having a spinel crystal structure are dispersed in an aluminum member within a range of 2 ?m in a thickness direction from a bonded interface with a ceramic member, a segregated portion in which Mg, Si, and O is segregated is formed in the aluminum member in the vicinity of the bonded interface with the ceramic member, mass ratios of Mg, Si, and O between the segregated portion and a position spaced by 10 ?m from the bonded interface toward an aluminum member side are within predetermined ranges, and the amount of Mg at the position spaced by 10 ?m from the bonded interface toward the aluminum member side is 0.8 mass % or less.

Abstract: The resistor includes a chip resistive element which includes a resistive element and metal electrodes and which is formed on first surface of a ceramic substrate, metal terminals electrically joined to the metal electrodes, and an Al member formed on the second surface side of the ceramic substrate, wherein the ceramic substrate and the Al member are joined using an Al—Si-based brazing filler metal, the metal electrodes and the metal terminals are joined to each other using a solder, and a degree of bending of an opposite surface of the Al member opposite to a surface on the ceramic substrate side is in a range of ?30 ?m/50 mm to 700 ?m/50 mm.

Abstract: A light-emitting module with a cooler of the present invention includes a circuit layer which is formed on one surface side of an insulating layer and in which a light-emitting element is mounted, and a metal layer and a cooler which are laminated in order on the other surface side of the insulating layer. The circuit layer is formed of Cu, Al, or an alloy thereof and has a thickness of 0.1 mm or less. The metal layer and the cooler are formed of Al or an Al alloy. The metal layer and the cooler are directly bonded to each other. The ratio of the area of the light-emitting element to the area of the one surface of the insulating layer is within a range from 1:20 to 1:400.

Abstract: A light-emitting module substrate of the present invention includes a circuit layer which is formed on one surface of an insulating layer and in which a light-emitting element is mounted, and a metal layer formed of Al or an Al alloy and a heat sink which are laminated in order on the other surface side of the insulating layer. In the heat sink, Cu is present on at least a bonding surface with respect to the metal layer. The metal layer and the heat sink are subjected to solid-phase diffusion bonding on the bonding surface. The thickness of the circuit layer is 0.1 mm or less.

Abstract: In this resistor, a heat sink (Al member) (23) and the other surface (11b) of a ceramic substrate (11) are joined together using an Al—Si-based brazing filler material. The Al—Si-based brazing filler material has a melting point in a range of approximately 600° C. to 700° C. When the heat sink (23) and the ceramic substrate (11) are joined together using the Al—Si-based brazing filler material, it is possible to prevent the derogation of the heat resistance and thermal deterioration during joining at the same time.

Abstract: The resistor includes a chip resistive element which includes a resistive element and metal electrodes and which is formed on first surface of a ceramic substrate, metal terminals electrically joined to the metal electrodes, and an Al member formed on the second surface side of the ceramic substrate, wherein the ceramic substrate and the Al member are joined using an Al—Si-based brazing filler metal, the metal electrodes and the metal terminals are joined to each other using a solder, and a degree of bending of an opposite surface of the Al member opposite to a surface on the ceramic substrate side is in a range of ?30 ?m/50 mm to 700 ?m/50 mm.

Abstract: To provide a power-module substrate and a manufacturing method thereof in which small voids are reduced at a bonded part and separation can be prevented. Bonding a metal plate of aluminum or aluminum alloy to at least one surface of a ceramic substrate by brazing, when a cross section of the metal plate is observed by a scanning electron microscope in a field of 3000 magnifications in a depth extent of 5 ?m from a bonded interface between the metal plate and the ceramic substrate in a width area of 200 ?m from a side edge of the metal plate, residual-continuous oxide existing continuously by 2 ?m or more along the bonded interface has total length of 70% or less with respect to a length of the field.

Abstract: The power module substrate includes a circuit layer that is formed on a first surface of a ceramic substrate, and a metal layer that is formed on a second surface of the ceramic substrate, in which the metal layer has a first aluminum layer that is bonded to the second surface of the ceramic substrate and a first copper layer that is bonded to the first aluminum layer by solid-phase diffusion bonding.

Abstract: A BMC processing circuit, a USB power delivery controller, a BMC reception method, and a program capable of achieving stable BMC reception processing with low power consumption are provided. A BMC processing circuit 1100 includes an edge detection unit 1102 that detects change edges of a reception signal encoded by a Biphase Mark Code (BMC) method; an interval measuring unit 1103 that measures an interval value, the interval value being a period between the change edges; a threshold determination unit 1105 that corrects a first threshold using a plurality of interval values to generate a second threshold; and a BMC decoding unit 1107 that decodes the reception signal using the second threshold.

Abstract: A power module has a copper layer composed of copper or a copper alloy on a surface of a circuit layer to which a semiconductor device is bonded, and a solder layer that is formed by using a solder material is formed between the circuit layer and the semiconductor device. An average crystal grain size which is measured by EBSD measurement in a region having a thickness of up to 30 ?m from the surface of the circuit layer in the solder layer is 10 ?m or less, the solder layer has a composition that contains Sn as a main component, 0.01 to 1.0% by mass of Ni, and 0.1 to 5.0% by mass of Cu, and a thermal resistance increase rate when a power cycle is loaded 100,000 times is less than 10% in a power cycle test.

Abstract: In this resistor, a heat sink (Al member) (23) and the other surface (11b) of a ceramic substrate (11) are joined together using an Al—Si-based brazing filler material. The Al—Si-based brazing filler material has a melting point in a range of approximately 600° C. to 700° C. When the heat sink (23) and the ceramic substrate (11) are joined together using the Al—Si-based brazing filler material, it is possible to prevent the derogation of the heat resistance and thermal deterioration during joining at the same time.