Abstract: A fixing device includes a belt member that cyclically moves, a pressing unit that comes into contact with the belt member and presses a recording medium moving between the belt member and the pressing unit, and a heat source that includes a base material, a resistance heating element disposed on a surface of the base material along a longitudinal direction of the base material, and an insulator covering the resistance heating element and that comes into contact with the pressing unit via the belt member to heat an inner surface of the belt member, in which the insulator is formed to cover a corner portion of the base material in a direction of movement of the belt member.

Abstract: A method for detecting a metal residue present in an electric-resistance-welded steel pipe includes a first step of inserting the electric-resistance-welded steel pipe into an exciting coil while relatively moving the electric-resistance-welded steel pipe in a longitudinal direction and magnetizing the electric-resistance-welded steel pipe using a direct current at a field intensity capable of magnetizing the electric-resistance-welded steel pipe and the metal residue up to a magnetic saturation state by the exciting coil and a second step of inserting the electric-resistance-welded steel pipe into a detecting coil while relatively moving the electric-resistance-welded steel pipe in the longitudinal direction, detecting an induced electromotive force generated in the detecting coil by a change in a magnetic flux caused by the direct-current magnetization by the exciting coil in the first step as an output signal of the detecting coil, and detecting the metal residue present in the electric-resistance-welded s

Abstract: A motor drive device is a device that controls torque generated by a motor, based on a d-axis current and a q-axis current, to drive the motor. The motor drive device includes a d-axis current instruction generating unit that calculates a first d-axis current instruction, a current instruction correcting unit that generates a positive correction quantity that is added to the first d-axis current instruction when a voltage across terminals of the motor is equal to or larger than a given value, and a voltage feedback control unit that generates a negative correction quantity that is added to the first d-axis current instruction to prevent the voltage across the terminals of the motor from exceeding a given maximum output voltage. The motor drive device controls the torque, based on a second d-axis current instruction created by adding the positive correction quantity and the negative correction quantity to the first d-axis current instruction and on a q-axis current instruction.

Abstract: A physiological information processing method executed by a computer. The physiological information processing method includes obtaining a plurality of electroencephalogram signals indicating an electroencephalogram of a subject, using a plurality of electrodes attached to a head of the subject, each of the plurality of electroencephalogram signals being associated with a respective one of the plurality of electrodes, obtaining, from each of the plurality of electroencephalogram signals, a plurality of artifact component signals indicating different types of artifacts, calculating effective values of the plurality of artifact component signals of each of the electroencephalogram signals, determining whether the effective value of each of the artifact component signals of the electroencephalogram signal satisfies a predetermined condition, and visually presenting information related to the artifact associated with the artifact component signal of which the effective value satisfies the predetermined condition.

Abstract: A quartz glass crucible (1) includes: a crucible body (10) made of silica glass; and a crystallization-accelerator-containing layer (13) formed on an outer surface of the crucible body (10). A concentration of a crystallization accelerator contained in the crystallization-accelerator-containing layer (13) is 1.0×1013 atoms/cm2 or more and 4.8×1015 atoms/cm2 or less. The quarts glass crucible is intended to be capable of not only enduring a single crystal pulling-up process that takes a very long time, such as multi-pulling, but also stably controlling the oxygen concentration and crystal diameter of a silicon single crystal by eliminating a gap between the carbon susceptor and the crucible as much as possible.

Abstract: A method including inspecting, using an X-ray transmission image, internal defects in a TSV formed in a semiconductor wafer, and detecting the X-rays, and processing an X-ray transmission image. Therein, the detection of X-rays is configured such that: the detection azimuth of the X-rays, and the detection elevation angle of the X-rays relative to the X-ray source are determined on the basis of information on the arrangement interval, depth, and planar shape of structures formed in the sample. The angle of rotation of a rotating stage on which the sample is mounted is adjusted in accordance with the detection azimuth which has been determined, and the X-rays that have been transmitted through the sample are detected with the position of the detector set to the detection elevation angle which has been determined.

Abstract: A defect inspecting method and apparatus for inspecting a surface state including a defect on a wafer surface, in which a polarization state of a laser beam irradiated onto the wafer surface is connected into a specified polarization state, the converted laser beam having the specified polarization state is inserted onto the wafer surface, and a scattering light occurring from an irradiated region where the laser beam having the specified polarization state is irradiated, is separated into a first scattering light occurring due to a defect on the wafer and a second scattering light occurring due to a surface roughness on the wafer. An optical element for optical path division separates the first and second scattering lights approximately at the same time.

Abstract: The present invention provides an X-ray inspection device that detects a defect not on the basis of a change of an X-ray irradiation angle but on uniform determining criteria. As one embodiment for achieving the purpose, proposed below is an X-ray inspection device that is provided with: a detection element that detects a transmission X-ray, which has been emitted from an X-ray source and passed through a sample; and an arithmetic device, which forms a profile on the basis of output signals transmitted from the detection element, and which detects, using the profile, a defect included in the sample. The arithmetic device detects the defect on the basis of threshold setting corresponding to the visual field positions of the transmission X-ray.

Abstract: A defect inspecting method and apparatus for inspecting a surface state including a defect on a wafer surface, in which a polarization state of a laser beam irradiated onto the wafer surface is connected into a specified polarization state, the converted laser beam having the specified polarization state is inserted onto the wafer surface, and a scattering light occurring from an irradiated region where the laser beam having the specified polarization state is irradiated, is separated into a first scattering light occurring due to a defect on the wafer and a second scattering light occurring due to a surface roughness on the wafer. An optical element for optical path division separates the first and second scattering lights approximately at the same time.

Abstract: A defect inspecting method and apparatus for inspecting a surface state including a defect on a wafer surface, in which a polarization state of a laser beam irradiated onto the wafer surface is connected into a specified polarization state, the converted laser beam having the specified polarization state is inserted onto the wafer surface, and a scattering light occurring from an irradiated region where the laser beam having the specified polarization state is irradiated, is separated into a first scattering light occurring due to a defect on the wafer and a second scattering light occurring due to a surface roughness on the wafer. An optical element for optical path division separates the first and second scattering lights approximately at the same time.

Abstract: A method including inspecting, using an X-ray transmission image, internal defects in a TSV formed in a semiconductor wafer, and detecting the X-rays, and processing an X-ray transmission image. Therein, the detection of X-rays is configured such that: the detection azimuth of the X-rays, and the detection elevation angle of the X-rays relative to the X-ray source are determined on the basis of information on the arrangement interval, depth, and planar shape of structures formed in the sample. The angle of rotation of a rotating stage on which the sample is mounted is adjusted in accordance with the detection azimuth which has been determined, and the X-rays that have been transmitted through the sample are detected with the position of the detector set to the detection elevation angle which has been determined.

Abstract: An inspection method and apparatus for detecting defects or haze of a sample, includes illuminating light to the sample from an oblique direction relative to a surface of the sample with an illuminator, detecting first scattered light at a forward position relative to an illuminating direction from the sample with a first detector, detecting second scattered light at a sideward or backward position relative to the illuminating direction from the sample with a second detection, and processing a first signal of the first scattered light and a second signal of the second scattered light with different weighting for the first signal and for the second signal with a processor.

Abstract: A defect reviewing apparatus includes an illumination optical system that irradiates a sample with laser, a detection optical system that detects reflected light or scattered light from the sample, a processing portion that calculates coordinates of a defect based on the reflected light or scattered light detected, and an electron microscope that reviews the defect based on the coordinates of the defect calculated by the processing portion. In the illumination optical system, inspection modes are switched over based on defect information acquired in another inspection equipment.

Abstract: A defect inspecting method and apparatus for inspecting a surface state including a defect on a wafer surface, in which a polarization state of a laser beam irradiated onto the wafer surface is connected into a specified polarization state, the converted laser beam having the specified polarization state is inserted onto the wafer surface, and a scattering light occurring from an irradiated region where the laser beam having the specified polarization state is irradiated, is separated into a first scattering light occurring due to a defect on the wafer and a second scattering light occurring due to a surface roughness on the wafer. An optical element for optical path division separates the first and second scattering lights approximately at the same time.

Abstract: A defect inspecting method and apparatus for inspecting a surface state including a defect on a wafer surface, in which a polarization state of a laser beam irradiated onto the wafer surface is connected into a specified polarization state, the converted laser beam having the specified polarization state is inserted onto the wafer surface, and a scattering light occurring from an irradiated region where the laser beam having the specified polarization state is irradiated, is separated into a first scattering light occurring due to a defect on the wafer and a second scattering light occurring due to a surface roughness on the wafer. An optical element for optical path division separates the first and second scattering lights approximately at the same time.

Abstract: A defect inspection device has: an illumination optical system which irradiates a predetermined region of an inspection target with illumination light; a detection optical system which has a detector provided with a plurality of pixels by which scattered light from the predetermined region of the inspection target due to illumination light from the illumination optical system can be detected; and a signal processing portion which is provided with a correction portion which corrects pixel displacement caused by change in a direction perpendicular to a surface of the inspection target with respect to a detection signal based on the scattered light detected by the detector of the detection optical system, and a defect determination portion which determines a defect on the surface of the inspection target based on the detection signal corrected by the correction portion.

Abstract: In order to enable inspections to be conducted at a sampling rate higher than the pulse oscillation frequency of a pulsed laser beam emitted from a laser light source, without damaging samples, a defect inspection method is disclosed, wherein: a single pulse of a pulsed laser beam emitted from the laser light source is split into a plurality of pulses; a sample is irradiated with this pulse-split pulsed laser beam; scattered light produced by the sample due to the irradiation is focused and detected; and defects on the sample are detected by using information obtained by focusing and detecting the scattered light from the sample. Said defect inspection method is configured such that the splitting a single pulse of the pulsed laser beam into a plurality of pulses is controlled in such a manner that the peak values of the split pulses are substantially uniform.

Abstract: A surface defect inspection apparatus and method for irradiating a beam multiple times to a same region on a surface of an inspection sample, detecting each scattered light from the same region by detection optical systems individually to produce plural signals, and wherein irradiating the beam includes performing a line illumination of the beam on a line illumination region of the sample surface. The line illumination region is moved in a longitudinal direction at a pitch shorter than a length of the line illumination region in the longitudinal direction.

Abstract: Proposed is a defect inspection method whereby: illuminating light having a substantially uniform illumination intensity distribution in one direction of a sample surface irradiated on the sample surface; multiple scattered light components, which are output in multiple independent directions, are detected among the scattered light from the sample surface and multiple corresponding scattered light detection signals are obtained; at least one of the multiple scattered light detection signals is processed and the presence of defects is determined; at least one of the multiple scattered light detection signals that correspond to each of the points determined by the processing as a defect is processed and the dimensions of the defect are determined; and the position and dimensions of the defect on the sample surface, at each of the points determined as a defect, are displayed.

Abstract: An inspection method and apparatus for detecting defects or haze of a sample, includes illuminating light to the sample from an oblique direction relative to a surface of the sample with an illuminator, detecting first scattered light at a forward position relative to an illuminating direction from the sample with a first detector, detecting second scattered light at a sideward or backward position relative to the illuminating direction from the sample with a second detection, and processing a first signal of the first scattered light and a second signal of the second scattered light with different weighting for the first signal and for the second signal with a processor.