Abstract: A method of detecting a condensing spot position in a laser beam processing apparatus, including: a detection position setting step of setting a plurality of Z-axis directional positions in a range from a starting point to an ending point of detection positions into which the condenser is positioned; a laser beam processed groove forming step of sequentially positioning the condenser into the detection positions in the range from the starting point to the ending point, performing a predetermined interval indexing feeding by operating indexing feeding means each time the detection position for the condenser is changed, and forming a laser beam processed groove of a predetermined length in the plate-shaped body at each of the detection positions for the condenser; and a laser beam processed groove imaging step of imaging the laser beam processed grooves formed in the plate-shaped body by imaging means.

Abstract: The present invention relates to a crosslinked gelatin support, in which a surface of a crosslinked gelatin is negatively charged and has a zeta potential in ethanol of from ?3 to ?50 mV, and a support for controlled release of a physiologically active substance, including: the crosslinked gelatin support; and a physiologically active substance adsorbed and retained on and/or inside the crosslinked gelatin support.

Abstract: A method of manufacturing a rotating electrical machine has steps of a preparation step that accommodates the cap in a jig space while bringing the jig and the pulley in contact in an up-and-down direction so that an operation space is sealed, and a main step that decompresses the operation space to pressure lower than atmospheric pressure, moves the cap to an upper side in the decompressed operation space, and press-fits the cap into the pulley. By this, an inclination and a misalignment in the axial direction of the cap by the action of the reaction force can be suppressed since the reaction force acting downwardly on the cap can be weakened compared with the case where the cap is press-fit under atmospheric pressure. Therefore, the press-fit-state of the cap can be stabilized.

Abstract: The present invention relates to a gelatin particle, which is a thermally crosslinked non-porous spherical gelatin particle having a circularity of 0.8 or more and a dry particle diameter of 20 to 1,600 ?m. The average volume swelling ratio of the gelatin particle in a case where the gelatin particle is immersed in physiological saline at 23° C. is from 200 to 2,000% relative to an average volume of the gelatin particle in a dried state. As for a swollen gelatin particle, it is preferable that the gelatin used has a jelly strength of 80 to 120 g and the swollen gelatin particle has a particle diameter of 50 to 2,000 ?m. The gelatin particle can be used for blood vessel embolization and also for controlled release of physiologically active substance.

Abstract: A method of detecting a condensing spot position in a laser beam processing apparatus, including: a detection position setting step of setting a plurality of Z-axis directional positions in a range from a starting point to an ending point of detection positions into which the condenser is positioned; a laser beam processed groove forming step of sequentially positioning the condenser into the detection positions in the range from the starting point to the ending point, performing a predetermined interval indexing feeding by operating indexing feeding means each time the detection position for the condenser is changed, and forming a laser beam processed groove of a predetermined length in the plate-shaped body at each of the detection positions for the condenser; and a laser beam processed groove imaging step of imaging the laser beam processed grooves formed in the plate-shaped body by imaging means.

Abstract: A method of manufacturing a rotating electrical machine has steps of a preparation step that accommodates the cap in a jig space while bringing the jig and the pulley in contact in an up-and-down direction so that an operation space is sealed, and a main step that decompresses the operation space to pressure lower than atmospheric pressure, moves the cap to an upper side in the decompressed operation space, and press-fits the cap into the pulley. By this, an inclination and a misalignment in the axial direction of the cap by the action of the reaction force can be suppressed since the reaction force acting downwardly on the cap can be weakened compared with the case where the cap is press-fit under atmospheric pressure. Therefore, the press-fit-state of the cap can be stabilized.

Abstract: A medical pressure-sensitive adhesive tape according to an embodiment of the present invention includes, a film base material; a first pressure-sensitive adhesive layer; and a release liner releasably laminated to cover the first pressure-sensitive adhesive layer in the stated order, wherein: the release liner is divided into a first divided piece and a second divided piece; the first divided piece is placed at a widthwise-direction end on one side of the first pressure-sensitive adhesive layer to cover part of the first pressure-sensitive adhesive layer; the second divided piece is placed to cover a portion of the first pressure-sensitive adhesive layer that is not covered with the first divided piece; and the second divided piece has a folding portion extending toward a widthwise-direction end.

Abstract: A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent is coated on a surface of a wafer, which is to be processed, and is then dried to form a protective film. Laser dicing through the protective film produces chips from the wafer. As a result, deposition of debris can be effectively prevented on the entire face of the chips, including their peripheral edge portions.

Abstract: A method of dividing a wafer having a plurality of areas defined by the plurality of streets formed in a lattice on the front surface, devices formed in the defined areas and an adhesive film for die bonding on the rear surface and put on a dicing tape affixed to an annular frame along the streets, the method comprising the steps of: forming a groove along the streets in the wafer by applying a first laser beam whose elliptic focal spot has a ratio of the long axis of the short axis of 15 to 20:1 along the streets formed on the wafer; and dividing the adhesive film along the grooves by applying a second laser beam whose elliptical focal spot has a ratio of the long axis to the short axis of 60 to 70:1 to the adhesive film through the grooves formed by the wafer dividing step.

Abstract: The present invention provides a pressure-sensitive adhesive tape or sheet for application to skin, which contains: a stretch fabric, and a pressure-sensitive adhesive layer provided on one surface of the stretch fabric, in which the pressure-sensitive adhesive layer contains: an acrylic copolymer obtained from a monomer mixture including an alkyl(meth)acrylate of from 40 to 80% by weight, an alkoxy (meth)acrylate of from 10 to 50% by weight and a (meth)acrylic acid of from 1 to 10% by weight; a long-chain fatty acid glycerin ester in an amount of from 20 to 100 parts by weight relative to 100 parts by weight of the acrylic copolymer, and a crosslinking agent, the pressure-sensitive adhesive layer being crosslinked with the crosslinking agent; and also provides a process for producing the tape or sheet.

Abstract: The present invention relates to a film base material for an adhesive skin patch, which includes an elastomer film unevenly having unevenness on at least one surface thereof, in which, in one unevenness in which the distance perpendicular to the surface of the elastomer film between the top of the unevenness and the bottom thereof is the longest among the plurality of unevenness, the distance is within the range of from 1 to 5 ?m; in another unevenness in which the distance perpendicular to the surface of the elastomer film between the top of the unevenness and the bottom thereof is the shortest among the plurality of unevenness, the distance is within the range of from 0.1 to 0.9 ?m; and the 10-point average roughness of the surface is within the range of from 0.5 ?m to 3 ?m, and which is decreased in glossy texture on the surface thereof and inconspicuous when it is applied to the skin or the like; and the adhesive skin patch including the film base material.

Abstract: A method for producing many semiconductor chips, each having a semiconductor circuit disposed on the face thereof and a die bonding film stuck to the back thereof, from a semiconductor wafer in which many rectangular regions are defined on its face by streets arranged in a lattice pattern, and the semiconductor circuit is disposed in each of the rectangular regions.

Abstract: A semiconductor wafer treatment method for dividing an adhesive tape, which has been stuck to the entire back of a semiconductor wafer, along divided streets of the semiconductor wafer. Before division of the adhesive tape by application of laser beams, the state of the divided streets is detected, and laser beams are applied to the adhesive tape based on such detection.

Abstract: A wafer laser processing method for forming a groove in a wafer having a protective film on the processing surface of a substrate along a predetermined processing line, comprising a first step for forming a first groove in the protective film along the dividing lines by applying a first pulse laser beam set to an output at which the protective film can be processed but the substrate can not be processed, to the protective film along the processing lines; and a second step for forming a second groove in the substrate along the first grooves by applying a second pulse laser beam set to an output at which the substrate can be processed, along the first grooves.

Abstract: A backlight device for a liquid crystal display comprising a light diffuser, a light source disposed behind the light diffuser, and a reflector for reflecting light from the light source, in which a liquid crystal panel is disposed in front of the light diffuser and irradiated, from the back side, with the direct light from the light source and the light reflected by the reflector and diffused by and passed through the light diffuser. The light source is of a type which radiates UV-rays and heat along with visible light. The warp and yellowing of the diffuser are suppressed even if the quantity of UV-rays is increased with an increase in the quantity of light from the light source. In a direct-under type backlight device for a liquid crystal display employing the light diffuser, the color difference (?E) defined in JIS K 7105 after exposed for 500 hours to artificial light employed for artificial light source test defined in JIS h7350-2 is 2.

Abstract: The present invention relates to a film base material for an adhesive skin patch, which includes an elastomer film unevenly having unevenness on at least one surface thereof, in which, in one unevenness in which the distance perpendicular to the surface of the elastomer film between the top of the unevenness and the bottom thereof is the longest among the plurality of unevenness, the distance is within the range of from 1 to 5 ?m; in another unevenness in which the distance perpendicular to the surface of the elastomer film between the top of the unevenness and the bottom thereof is the shortest among the plurality of unevenness, the distance is within the range of from 0.1 to 0.9 ?m; and the 10-point average roughness of the surface is within the range of from 0.5 ?m to 3 ?m, and which is decreased in glossy texture on the surface thereof and inconspicuous when it is applied to the skin or the like; and the adhesive skin patch including the film base material.

Abstract: A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined inclination angle to the normal line of a processing surface of the wafer while the wafer is processing-fed along a street from one end to the other end on the side of the laser beam application at an acute angle to the processing surface of the wafer.

Abstract: A method of dividing a wafer having a plurality of areas defined by the plurality of streets formed in a lattice on the front surface, devices formed in the defined areas and an adhesive film for die bonding on the rear surface and put on a dicing tape affixed to an annular frame along the streets, the method comprising the steps of: forming a groove along the streets in the wafer by applying a first laser beam whose elliptic focal spot has a ratio of the long axis of the short axis of 15 to 20:1 along the streets formed on the wafer; and dividing the adhesive film along the grooves by applying a second laser beam whose elliptical focal spot has a ratio of the long axis to the short axis of 60 to 70:1 to the adhesive film through the grooves formed by the wafer dividing step.