Patents by Inventor Travis C. North

Travis C. North has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11262822
    Abstract: A portable information handling system rejects excess thermal energy from within a housing by blowing a cooling airflow with a cooling fan across first and second sets of cooling fins and out an exhaust. The cooling fan has an upper and lower intake and moves vertically within the housing to adjust spacing at the upper intake. The cooling fan exhaust couples to one of the sets of cooling fins to exhaust across both sets of cooling fins when interleaved and the one set of cooling fins when spacing at the upper cooling fan intake increases.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: March 1, 2022
    Assignee: Dell Products L.P.
    Inventors: Travis C. North, Jace W. Files, John Trevor Morrison
  • Patent number: 11262807
    Abstract: A piezoelectric speaker fits in a cavity of a portable information handling system covered by a transparent cover that defines a speaker chamber within the cavity. The transparent cover integrates wirelines that align power pads with power contacts of the speaker to communicate audible information that generates sounds. In one embodiment, the transparent cover integrates a liquid crystal display that presents visual images associated with generated sound and backlit with illumination provided from the cavity.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: March 1, 2022
    Assignee: Dell Products L.P.
    Inventors: Travis C. North, Jace W. Files, John Trevor Morrison
  • Patent number: 11248852
    Abstract: A system may include a thermal source, a thermal sink and heat-rejecting media comprising a thermal cable, the thermal cable comprising a main length comprising a flexible graphite layer rolled into a cylindrical shape covered on the outside thereof by a thermally-insulating layer of the same cylindrical shape, a first termination at which the flexible graphite layer thermally couples to the thermal source, and a second termination at which the flexible graphite layer thermally couples to the thermal sink.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: February 15, 2022
    Assignee: Dell Products L.P.
    Inventors: Steven Embleton, Travis C. North
  • Publication number: 20220003511
    Abstract: A member may include a flexible material with thickness significantly smaller than that of other dimensions of the flexible material and at least one localized structure patterned within the flexible material, the at least one localized structure having a negative Poisson's ratio, such that when the member is mechanically coupled to a second structure using mechanical stress, the member conforms to features of the second structure.
    Type: Application
    Filed: July 6, 2020
    Publication date: January 6, 2022
    Applicant: Dell Products L.P.
    Inventors: Steven EMBLETON, Travis C. NORTH
  • Publication number: 20220007544
    Abstract: A system may include a thermal source, a thermal sink, and heat-rejecting media comprising flexible graphite thermally coupled between the thermal source and the thermal sink and configured to transfer heat from the thermal source to the thermal sink.
    Type: Application
    Filed: July 6, 2020
    Publication date: January 6, 2022
    Applicant: Dell Products L.P.
    Inventors: Steven EMBLETON, Travis C. NORTH
  • Publication number: 20220007545
    Abstract: A system may include a thermal source, a thermal sink and heat-rejecting media comprising a thermal cable, the thermal cable comprising a main length comprising a flexible graphite layer rolled into a cylindrical shape covered on the outside thereof by a thermally-insulating layer of the same cylindrical shape, a first termination at which the flexible graphite layer thermally couples to the thermal source, and a second termination at which the flexible graphite layer thermally couples to the thermal sink.
    Type: Application
    Filed: July 6, 2020
    Publication date: January 6, 2022
    Applicant: Dell Products L.P.
    Inventors: Steven EMBLETON, Travis C. NORTH
  • Publication number: 20210341976
    Abstract: Modular heat sinks are provided that support configurations using combinations of cooling and expansion card components, whereby the expansion card may support coupled devices. Heat sinks may include a fin set that is permanently fixed to the heat sink and a second fin set that can be decoupled from a location on the heat sink base. The second fin set can instead be replaced on the heat sink base by an expansion card connector, such as a M.2 expansion card connector. In some embodiments, an expansion card connector also includes a fin set, with the expansion card connector fastened on top of that fin set. The fin set to which the expansion card connector is fastened may include multiple tiers of fins of different heights that may conform to the space available to the heat sink, thus maximize cooling capabilities of the heat sink while also supporting an expansion card.
    Type: Application
    Filed: April 30, 2020
    Publication date: November 4, 2021
    Applicant: Dell Products, L.P.
    Inventors: Chris M. Helberg, Travis C. North
  • Patent number: 11147186
    Abstract: Airflow cooling is provided in an IHS (Information Handling System), where the airflow cooling may be adapted to reduce noise generated by the airflow cooling system and to provide cooling that is particularized to specific users. The operation of a software application by a user is detected. A workload profile associated with that application is determined and used to provide airflow cooling. The workload profile specifies parameters for providing cooling during use of applications associated with a first type of resource utilization. Upon detecting use of a different application, a different workload profile associated with applications of a second type of resource utilization may be determined and used to provide cooling. The user may provide noise feedback inputs specifying noise level preferences that are used in adapting the cooling provided by workload profiles. The workload profiles may be further adapted to reduce noise generated by the cooling system while still providing adequate cooling.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: October 12, 2021
    Assignee: Dell Products, L.P.
    Inventors: Travis C. North, Mitchell Anthony Markow, Richard C. Thompson
  • Patent number: 11145287
    Abstract: An information handling system may include an air mover configured to cause movement of gaseous fluid within the information handling system in order to thermally cool one or more components of the information handling system and a dynamic noise generation system configured to receive an indication of expected acoustical energy generated by the air mover and generate sound in accordance with an output noise signal based on noise generated by the air mover.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: October 12, 2021
    Assignee: Dell Products L.P.
    Inventors: Claire H. Hsu, Travis C. North, Robert E. Freehill, Douglas J. Peeler
  • Publication number: 20210311535
    Abstract: In IHSs (Information Handling Systems), cooling is provided by increasing the airflow generated by cooling fans. However, unnecessary airflow cooling results in noise and wasted energy. An IHS processor may support faster operating frequencies when cooled below an upper threshold, but these operating frequencies drop at temperatures below a lower threshold. Embodiments provide techniques for calibrating the cooling of an IHS to the thermal characteristics of a specific processor since manufacturing variances result in processors having differing responses to cooling. A turbo frequency supported by a processor is measured at a series of temperature margins that are progressively lower than the processor's specification temperature. A rate of increase in the measured turbo frequencies is determined at each of the temperature margins. A first temperature margin is identified at which the rate of increase in turbo frequencies falls below a threshold. This margin is used in providing airflow cooling.
    Type: Application
    Filed: April 2, 2020
    Publication date: October 7, 2021
    Applicant: Dell Products, L.P.
    Inventors: Yuan David Ma, Travis C. North
  • Patent number: 11079816
    Abstract: An integrated heat dissipation system for a haptic piezoelectric keyboard of an information handling system comprising a base chassis formed of a C-cover affixed to a D-cover to house the haptic piezoelectric keyboard assembly, a processor, and a heat dissipating layer and the heat dissipating layer thermally coupled to a haptic piezoelectric keyboard assembly and the processor to direct heat away from the keys of the piezoelectric keyboard of the C-cover and toward a vertical edge of the base chassis, where the piezoelectric keyboard assembly comprises a plurality of piezoelectric sensors disposed across a support plate, and a contact foil layer, for detecting deformation of one of the plurality of piezoelectric sensors and registering a keystroke, affixed to the plurality of piezoelectric sensors and the support plate and provide a haptic feedback control signal to generate a haptic response to the keys of the piezoelectric keyboard.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: August 3, 2021
    Assignee: Dell Products, LP
    Inventors: Travis C. North, Michiel Knoppert, Priyank Gajiwala
  • Patent number: 10985086
    Abstract: Information handling system thermal rejection of thermal energy generated by one or more components, such as a central processing unit and graphics processing unit, is enhanced by disposing boron arsenide between the one or more components and a heat transfer structure that directs thermal energy from the one or more components to a heat rejection region, such as cooling fan exhaust. For instance, the boron arsenide is a layer formed with chemical vapor deposition on a copper heat pipe or a layer of thermal grease infused with the boron arsenide.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: April 20, 2021
    Assignee: Dell Products L.P.
    Inventors: Travis C. North, Deeder M. Aurongzeb, Claire Hao Wen Hsu
  • Patent number: 10969841
    Abstract: A portable information handling system transfers thermal energy associated with operation of processing components in a main housing portion to a vapor chamber integrated in a lid housing portion that distributes the thermal energy across the lid housing portion. A hinge protrusion formed in the lid housing portion defines a cylindrical opening that accepts a hinge pin to rotationally couple the housing portions to each other. The cylindrical wall defines a barrier with the vapor chamber so that a thermal conduit passing from the main housing portion to the hinge pin transfers thermal energy from the hinge pin through the cylindrical wall to the vapor chamber.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: April 6, 2021
    Assignee: Dell Products L.P.
    Inventors: Travis C. North, Mark A. Schwager, Austin M. Shelnutt, John T. Morrison
  • Publication number: 20210082385
    Abstract: An information handling system may include an air mover configured to cause movement of gaseous fluid within the information handling system in order to thermally cool one or more components of the information handling system and a dynamic noise generation system configured to receive an indication of expected acoustical energy generated by the air mover and generate sound in accordance with an output noise signal based on noise generated by the air mover.
    Type: Application
    Filed: September 17, 2019
    Publication date: March 18, 2021
    Applicant: Dell Products L.P.
    Inventors: Claire H. Hsu, Travis C. North, Robert E. Freehill, Douglas J. Peeler
  • Publication number: 20210068302
    Abstract: Airflow cooling is provided in an IHS (Information Handling System), where the airflow cooling may be adapted to reduce noise generated by the airflow cooling system and to provide cooling that is particularized to specific users. The operation of a software application by a user is detected. A workload profile associated with that application is determined and used to provide airflow cooling. The workload profile specifies parameters for providing cooling during use of applications associated with a first type of resource utilization. Upon detecting use of a different application, a different workload profile associated with applications of a second type of resource utilization may be determined and used to provide cooling. The user may provide noise feedback inputs specifying noise level preferences that are used in adapting the cooling provided by workload profiles. The workload profiles may be further adapted to reduce noise generated by the cooling system while still providing adequate cooling.
    Type: Application
    Filed: September 3, 2019
    Publication date: March 4, 2021
    Applicant: Dell Products, L.P.
    Inventors: Travis C. North, Mitchell Anthony Markow, Richard C. Thompson
  • Patent number: 10936031
    Abstract: A portable information handling system transfers thermal energy associated with operation of a CPU to a location distal the CPU with a vapor chamber thermally interfaced with the CPU. A pressure adapter interfaced with the vapor chamber selectively changes the pressure within the vapor chamber to adjust the saturation point of a liquid in the vapor chamber that manages thermal transfer efficiency. For example, a controller interfaced with the pressure adapter modifies thermal transfer characteristics of the vapor chamber to control thermal conditions at the information handling system, such as in response to a temperature sensed at a housing surface, a battery, a display or at other locations of the information handling system.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: March 2, 2021
    Assignee: Dell Products L.P.
    Inventors: Travis C. North, Mark A. Schwager, Austin M. Shelnutt, John T. Morrison
  • Patent number: 10921785
    Abstract: An information handling system may include a processor, a proximity sensor configured to determine whether a user of the information handling system is proximate to the information handling system, an air mover configured to cause movement of gaseous fluid within the information handling system in order to thermally cool one or more components of the information handling system, and an air mover control system configured to receive a signal from the proximity sensor indicative of whether the user is proximate to the information handling system and control a speed of a motor of the air mover based on whether the user is proximate to the information handling system.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: February 16, 2021
    Assignee: Dell Products L.P.
    Inventors: Claire H. Hsu, Travis C. North
  • Patent number: 10917998
    Abstract: A liquid cooled information handling system (LC_IHS) includes a first liquid cooled node coupled to a first chassis. The LC_IHS further includes a supply conduit in fluid communication with the first chassis to cool a first liquid cooled node. The supply conduit includes a plurality of fluid paths configured such that when a first fluid path of the plurality of fluid paths is interrupted, cooling of the first liquid cooled node continues.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: February 9, 2021
    Assignee: Dell Products, L.P.
    Inventors: Austin Michael Shelnutt, Travis C. North, Christopher M. Helberg, Steven Embleton, Edmond I. Bailey, James D. Curlee
  • Publication number: 20210013125
    Abstract: Information handling system thermal rejection of thermal energy generated by one or more components, such as a central processing unit and graphics processing unit, is enhanced by disposing boron arsenide between the one or more components and a heat transfer structure that directs thermal energy from the one or more components to a heat rejection region, such as cooling fan exhaust. For instance, the boron arsenide is a layer formed with chemical vapor deposition on a copper heat pipe or a layer of thermal grease infused with the boron arsenide.
    Type: Application
    Filed: July 8, 2019
    Publication date: January 14, 2021
    Applicant: Dell Products L.P.
    Inventors: Travis C. North, Deeder M. Aurongzeb, Claire Hao Wen Hsu
  • Publication number: 20200401090
    Abstract: An information handling system may include an information handling resource, a heat-rejecting media thermally coupled to the information handling resource, the heat rejecting media comprising and a heatpipe structure comprising a plurality of heatpipes. The plurality of heatpipes may include a generally-cylindrical first pipe mechanically coupled at a location proximate the information handling resource and having a first cross-sectional area, a generally-cylindrical second pipe mechanically coupled to the first pipe having a second cross-sectional area less than the first cross-sectional area, and a generally-cylindrical third pipe mechanically coupled to the second pipe having a third cross-sectional area less than the second cross-sectional area, such that the second pipe is coupled between the first pipe and the third pipe and the first pipe, second pipe, and third pipe form a closed plenum, and a finstack structure comprising a plurality of fins mechanically and thermally coupled to the third pipe.
    Type: Application
    Filed: June 20, 2019
    Publication date: December 24, 2020
    Applicant: Dell Products L.P.
    Inventors: Travis C. NORTH, Christopher M. HELBERG, Austin M. SHELNUTT