Abstract: A convertible information handling system in a clamshell configuration provides a maximum housing surface temperature at a predetermined portion, such as a fan exhaust, that is greater than a maximum temperature in a tablet configuration. Upon detection of transition to the tablet configuration, a burst application by a thermal rejection device reduces the temperature at the predetermined portion to aid in achieving the maximum temperature of the tablet configuration. For example, a burst application may include running a fan at full speed for a defined time or decreasing a pressure within a vapor chamber.

Abstract: A convertible information handling system in a clamshell configuration provides a maximum housing surface temperature at a predetermined portion, such as a fan exhaust, that is greater than a maximum temperature in a tablet configuration. Upon detection of transition to the tablet configuration, a burst application by a thermal rejection device reduces the temperature at the predetermined portion to aid in achieving the maximum temperature of the tablet configuration. For example, a burst application may include running a fan at full speed for a defined time or decreasing a pressure within a vapor chamber.

Abstract: A cooling assembly for an IOT wireless gateway device that includes a motherboard structure operatively coupled to one side of a first motherboard component, which is operatively coupled on the other side to one side of a first gap pad for conducting heat, an EMI shield operatively coupled to the other side of the first gap pad and surrounding the sides of the first motherboard component, the EMI shield also operatively coupled to the motherboard structure, the outside of the EMI shield operatively coupled to one side of a second gap pad for conducting heat, and a first heat sink operatively coupled to the other side of the second gap pad for conducting heat.

Abstract: Systems and methods are provided that that may be implemented to detect impeded flow of cooling air within a chassis enclosure of an information handling system based on sensed air pressure and/or air pressure changes occurring within the cooling air flow while the system is actively running. The systems and methods may be further implemented to take one or more thermal management actions based on sensed air pressure within the chassis enclosure together with other optional sensed parameters (e.g., such as sensed temperatures and/or sensed user operating mode based on accelerometer and/or gyroscope sensor input).

Abstract: A portable information handling system transfers thermal energy associated with operation of processing components in a first housing portion to a thermal exchanger in a second housing portion through a hinge that rotationally couples the first and second housing portions. The hinge has first and second axles that each define a channel. Fluid heated at the first housing portion passes through the channel to the thermal exchanger where thermal energy is rejected from the system. In one embodiment, a second hinge having first and second axles that each define a channel provides a return path for the fluid from the second housing portion to the first housing portion.

Abstract: A portable information handling system transfers thermal energy associated with operation of processing components in a main housing portion through a graphite torsion spring formed from a graphite sheet by cutting arms to extend out of opposing corners of a central portion and rolling the central portion about a central axis. The graphite torsion spring passes thermal energy between the housing portions with the spring releasing tension as the housing portions rotate from a closed to an open position and the central axis disposed about a hinge pin that couples the housing portions to each other.

Abstract: A portable information handling system transfers thermal energy associated with operation of processing components between rotationally coupled housing portions through a thermal spreader disposed between the housing portions, such as a sheet having one or more layers of graphite. A tensioning assembly engages the thermal sheet to manage excess material associated with varying rotational orientations of the housing portions.

Abstract: A portable information handling system transfers thermal energy associated with operation of a CPU to a location distal the CPU with a vapor chamber thermally interfaced with the CPU. A pressure adapter interfaced with the vapor chamber selectively changes the pressure within the vapor chamber to adjust the saturation point of a liquid in the vapor chamber that manages thermal transfer efficiency. For example, a controller interfaced with the pressure adapter modifies thermal transfer characteristics of the vapor chamber to control thermal conditions at the information handling system, such as in response to a temperature sensed at a housing surface, a battery, a display or at other locations of the information handling system.

Abstract: A portable information handling system transfers thermal energy associated with operation of processing components in a main housing portion to a vapor chamber integrated in a lid housing portion that distributes the thermal energy across the lid housing portion. A hinge protrusion formed in the lid housing portion defines a cylindrical opening that accepts a hinge pin to rotationally couple the housing portions to each other. The cylindrical wall defines a barrier with the vapor chamber so that a thermal conduit passing from the main housing portion to the hinge pin transfers thermal energy from the hinge pin through the cylindrical wall to the vapor chamber.

Abstract: A portable information handling system transfers thermal energy associated with operation of a CPU from a main housing portion to a lid housing portion with thermal conduction through a hinge assembly that rotationally couples the main and lid housing portions to each other. For example, thermal conduits insert into a hinge body and transfer thermal energy across the hinge body through a thermally conductive interface, such as the hinge body itself, thermal grease disposed in the hinge body, a liquid that fills a cavity of the hinge body shared by the thermal conduits, and a vapor chamber integrated in the hinge body.

Abstract: A method for cooling components of an information handling system (IHS) includes detecting, via a thermal control system, at least one pressure reading, at least one temperature reading and at least one current cooling device setting of the IHS. At least one new cooling device setting is calculated based on the pressure reading and the temperature reading. The new cooling device setting is compared to the current cooling device setting associated with one or more cooling devices of the IHS. In response to the new cooling device setting being different from the current cooling device setting, one or more of the corresponding cooling devices are triggered to adjust its/their current cooling device setting to the new cooling device setting corresponding to the respective cooling device.

Abstract: Vapor chamber and impeller apparatus and systems for cooling information handling systems and which may be implemented to enable increase in system level airflow and to achieve increased cooling surface for cooling heat generating or heat source components of such systems. In one example, an integrated rotating radial impeller may be mounted to and supported by the vapor chamber, and the vapor chamber apparatus may be coupled to one or more heat pipe extensions and corresponding fin stacks.

Abstract: An assembly for cooling a heat dissipating device reducing the thermal contact/interface resistance between a heatsink and a heat dissipating device includes: a heat dissipating device having a heat releasing surface; a heatsink having a heat absorbing surface; a gasket extending between the heat releasing surface and the heat absorbing surface to provide a sealed interstitial cavity; and a working fluid provided within the cavity. The working fluid has specific thermal properties that cause the fluid to (i) absorb latent heat and evaporate from a liquid to a vapor at the liquid surface in contact with the heat releasing surface during operation of the heat dissipating device and (ii) condense from the vapor back to the liquid when the vapor contacts the heat absorbing surface of the heatsink, thus releasing the latent heat from the vapor to the heatsink.

Abstract: A portable information handling system transfers thermal energy associated with operation of processing components in a main housing portion through a graphite cable to a lid housing portion that rejects the thermal energy to the external environment. The graphite cable has plural graphite elements vertically stacked with adhesive and exposed at each end as plural coupling points that each independently couple to a thermal device in the main and lid housing portions, such as a heat sink or vapor chamber.

Abstract: An information handling system comprising a storage device for receiving a first infrared image and a second infrared image of a temperature observation area captured from a first infrared camera, each infrared image having a segmented field of view, wherein the segmented field of view of the first infrared image overlaps at least in part the segmented field of view of the second infrared image and wherein the network adapter receives temperature recording data from a first remote point source temperature probe located within at least one of the segmented fields of view and processor is operatively coupled to the memory and network adapter and executes code instructions of an image-stitching module for calibrating the first infrared image based on temperature values from the temperature recording data received from the first remote point source temperature probe and stitches the first infrared image together with the second infrared image to create a first combined infrared image by detecting one or more shar

Abstract: Systems and methods are provided that may be implemented to detect impaired flow of cooling air within a chassis enclosure of an information handling system during system operation, and to implement a diagnostic or system boot mode to reverse direction of cooling air flow through the chassis enclosure after such detection of impeded cooling air flow so as to remove any dust or other accumulated debris that is causing the impeded cooling air flow.

Abstract: Systems and methods are provided that that may be implemented to detect impeded flow of cooling air within a chassis enclosure of an information handling system based on sensed air pressure and/or air pressure changes occurring within the cooling air flow while the system is actively running. The systems and methods may be further implemented to take one or more thermal management actions based on sensed air pressure within the chassis enclosure together with other optional sensed parameters (e.g., such as sensed temperatures and/or sensed user operating mode based on accelerometer and/or gyroscope sensor input).

Abstract: Systems and methods are provided that may be implemented to detect impaired flow of cooling air within a chassis enclosure of an information handling system during system operation, and to implement a diagnostic or system boot mode to reverse direction of cooling air flow through the chassis enclosure after such detection of impeded cooling air flow so as to remove any dust or other accumulated debris that is causing the impeded cooling air flow.

Abstract: In some examples, a computing device may include a set of components (e.g., processor, memory, and the like) and a conductive sheet (or cable). The conductive sheet (or cable) may include a first graphene layer to dissipate at least a portion of heat generated by a component (e.g., the processor) of the first set of components and a second graphene layer that is used as an electrical ground by signals communicated between a first component and a second component of the set of components. The computing device may include a single housing or a first housing (with a first display device) attached to a second housing (with a second display device) by one or more hinges.

Abstract: Thermal energy exposed at the outer surface of an information handling system housing is managed by spreading the thermal energy across the housing X and Y axes while restricting heat transfer from the housing at the Z axis. For example, a graphene outer surface couples to an aerogel substrate strengthened by a carbon fiber laminate. The graphene spreads thermal energy that escapes through the housing across the housing outer surface to limit the impact of thermal energy at any particular location, such as proximate to the location of a processor.