Abstract: The present invention realizes strengthening of a ground of a lower-surface ground electrode of an upper semiconductor chip and miniaturization in a semiconductor module on which two semiconductor chips are mounted in a stacked manner. A lower semiconductor chip is fixed to a bottom of a recess formed in an upper surface of a module board, and an upper semiconductor chip is fixed to an upper surface of a support body made of conductor which is formed over the upper surface of the module board around the recess. External electrode terminals and a heat radiation pad are formed over a lower surface of the module board.

Abstract: A semiconductor device comprises a module board having a top surface and a backside surface, a lower chip having a first circuit operated by a first frequency and a second circuit operated by a second frequency, an upper chip disposed so as to overlie over the lower chip, having the first circuit and the second circuit, a plurality of wires electrically bonding the upper chip to the module board, and electrically bonding the lower chip to the module board, respectively, and a plurality of chip components on the module board, and the first circuit of the upper chip is disposed opposite to the second circuits of the lower chip while the second circuit of the upper chip is disposed opposite to the first circuits of the lower chip.

Abstract: A heat exchange system is provided that includes an evaporator (11) that carries out heat exchange between exhaust gas discharged from an exhaust port (16B) and water, exhaust gas passages (87, 88) on the upstream side in the direction of flow of the exhaust gas being disposed on the radially inner side, an exhaust gas passage (89) on the downstream side being disposed on the radially outer side, and an oxygen concentration sensor cooling portion (92) for cooling a mounting section of an oxygen concentration sensor (91) facing the exhaust gas passage (87) on the most upstream side being positioned on the radially outer side of the exhaust gas passage (87). Water is supplied separately to a water passage (W3) of the evaporator (11) and a water passage (W4) of the oxygen concentration sensor cooling portion (92), and the water passage (W3) of the evaporator (11) is arranged so that the direction of flow of the water is opposite to the direction of flow of the exhaust gas.

Abstract: A coupling structure for coupling a piston and a connecting rod has a protrusion formed on the rear surface of the crown of the piston and having a semi-spherical concavity and a threaded portion concentric to the concavity, a substantially spherical small end formed at one end of the connecting rod, a holder holding the spherical small end of the connecting rod slidably in the semi-spherical concavity of the protrusion and a fixing ring having a threaded portion engaging with the threaded portion of the protrusion for securing the holder to the protrusion of the piston.

Abstract: This invention relates to a cooling structure for cooling a cylinder liner by circulating coolant in a water jacket formed along an outer periphery of the cylinder liner. This cooling structure includes an annular first water reservoir for temporarily storing coolant. This first water reservoir allows the coolant to uniformly flow circumferentially of the cylinder liner. The cooling structure also includes a plurality of coolant passages provided radially for connecting the first water reservoir to the water jacket. The coolant is caused to strike a part of a wall defining the water jacket substantially vertically from the radial coolant passages, thereby to generate turbulent flow in the coolant to efficiently cool the cylinder liner.

Abstract: A rotary fluid machine is provided in which a rotating shaft (113) fixed to a rotor (41) is rotatably supported on a fixed shaft (102) fixed to a casing (11), sliding surfaces of the fixed shaft (102) and the rotating shaft (113) are lubricated by a first pressurized liquid-phase working medium, and sliding surfaces of the rotor (41) and a vane (48) are lubricated by a second pressurized liquid-phase working medium.

Abstract: A piston for an internal combustion engine includes a crown, tubular walls extending from the edge of the crown, and a cup portion protruding from the rear surface of the crown and having a concave spherical surface for forming a spherical joint with a spherical small end on a connecting rod. The tubular walls and the cup portion are joined together by radially extending ribs.

Abstract: The present invention realizes the miniaturization of a semiconductor module. The semiconductor module includes a module board having external electrode terminals and a heat radiation pad over a lower surface thereof, a first semiconductor chip incorporating an initial-stage transistor of a high frequency power amplifying device therein, a second semiconductor chip incorporating a next-stage transistor and a final-stage transistor therein, and an integrated passive device which constitutes a matching circuit. At least one of the first semiconductor chip and the second semiconductor chip and the integrated passive device are mounted over an upper surface of the module board in an overlapped manner.

Abstract: A rotating fluid machine is provided with a rotor chamber, a rotor accommodated in the rotor chamber, and vanes guided by vane grooves formed in the rotor. A U-shaped vane seal is held by a seal holding groove formed in the end face of each of the vanes. The opposite ends of the vane seal are fitted into slits in seal ancillary members which are fitted into engaging holes formed in the end faces of each of the vanes. The seal ancillary members are pressed by springs toward the inner circumferential face of the rotor chamber. The pressure of a gaseous phase working medium introduced into the bottom parts of the seal holding grooves is restrained from leaking out of the ends of the vane seal by the seal ancillary members. Thus, sealing performance can be secured by pressing the vane seal against the inner circumferential face of the rotor chamber.

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu etc. and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract: In an electronic device which realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a bonding portion between a semiconductor device and a substrate is formed of metal balls made of Cu, or the like, and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.

Abstract: An internal combustion engine is provided in which an exhaust port communicating with a combustion chamber formed in a cylinder head is formed from independent exhaust ports, which are positioned on the upstream side, and a grouped exhaust port, in which the plurality of independent exhaust ports are combined. Water supplied from a supply pump passes through a water passage of the grouped exhaust port and a water passage of the independent exhaust ports while cooling the exhaust port, and a valve seat and valve guide on the periphery of the exhaust port, which have high temperatures, thus heating the water itself and thereby recovering waste heat of the internal combustion engine. The heated water carries out heat exchange with exhaust gas in an evaporator provided in an exhaust passage and turns into high temperature, high pressure steam, which drives an expander of a Rankine cycle system.

Abstract: First heat exchangers (H4, H3, H2) are disposed within an exhaust port (18), within a pre-catalytic device (34), and on the downstream of a main catalytic device (35); the exhaust port (18), the pre-catalytic device (34), and the main catalytic device (35) being provided in each exhaust passage (33) of a multicylinder internal combustion engine. These first heat exchangers (H4, H3, H2) are independently provided for each of the exhaust passages (33), and a second heat exchanger (H1) is disposed in a section where these exhaust passages (33) are combined. Since the first heat exchangers (H4, H3, H2) are disposed on the upstream side of the exhaust passage (33), high heat exchange efficiency can be obtained by high temperature exhaust gas, and, moreover, the occurrence of exhaust interference can be avoided, thereby preventing any decrease in the output of the internal combustion engine.

Abstract: Pistons (41) are slidably received in a plurality of cylinders (39) disposed radially in a rotor (31), and a plurality of vanes (42) cooperating with the pistons (41) are disposed radially in the rotor (31), so that a vane chamber (54) is defined between a pair of the adjacent vanes (42). The radial movements of each of the pistons (41) and each of the vanes (42) are substantially stopped, so that the volumes of each of the cylinders (39) and each of the vane chambers (54) are not changed, for a period from the end of an exhaust stroke at which a gas-phase working medium is discharged from the cylinder (39) and the vane chamber (54) to the start of an intake stroke at which the supplying of the gas-phase working medium is started. Thus, it is possible to prevent the generation of a water hammer phenomenon due to a liquid-phase working medium confined in the cylinder (39) and the vane chamber (54).

Abstract: A semiconductor device capable of attaining the reduction of size is disclosed. The semiconductor device comprises a module substrate having a surface and a back surface, a control chip mounted on the surface of the module substrate, plural chip parts mounted on the surface in adjacency to the control chip, first and second output chips mounted on the back surface of the module substrate, plural lands formed on the back surface of the module substrate, and a seal portion formed of resin to seal the control chip and the plural chip parts, wherein the first and second output chips are larger in the amount of heat generated than the control chip, the heat from the first and second output ships is radiated to a mother board, and packaging parts on the surface side of the module substrate are sealed with only a sealing resin without using a metallic case or the like to attain the reduction in size of the module.

Abstract: A heat exchange system is provided in which low temperature water from a supply pump (15) is split and supplied to an auxiliary evaporator (17) provided so as to cover an exhaust port (16) extending from a combustion chamber of an internal combustion chamber (E) and to a main evaporator (11) provided downstream of the exhaust port (16). The direction of water flowing through the auxiliary evaporator (17) is parallel to the direction of flow of exhaust gas, and as a result an upstream section of the exhaust port (16), which has a high temperature, can be cooled effectively with low temperature water, and the escape of heat from the upstream section of the exhaust port (16) can be suppressed.

Abstract: A Rankine cycle system is provided in which, with regard to a given relationship between the pressure (Pevp) and the temperature (Tevp) of a vapor that is taken into an expander (4) that includes a cylinder chamber in a first stage and a vane chamber in a second stage, the chambers being disposed in line, the expansion ratio of the vapor that the expander (4) takes in and discharges is set at a predetermined expansion ratio (?) according to the given relationship so that the pressure (Pexp2) and the temperature (Texp2) of the vapor that is discharged from the expander (4) coincide with target values, thereby making the expander (4) and the condenser (5) exhibit maximum performance. Since the vapor within the cylinder chamber in the first stage is in a superheated vapor region and contains no water, the phenomenon of water hammer will not be caused in the cylinder chamber.

Abstract: A waste heat recovering device for an internal combustion engine includes: an internal combustion engine; and an evaporator into which an exhaust gas of the internal combustion engine is introduced as a high temperature fluid. An exhaust gas inlet of the evaporator is placed adjacent to an exhaust valve of the internal combustion engine. Thus, there can be provided a waste heat recovering device having a high waste heat recovery rate.

Abstract: There is provided a semiconductor device with enhanced reliability having a heat sink mounting a plurality of semiconductor chips, a plurality of inner leads connected electrically to the semiconductor chips, a molding body for resin molding the plurality of semiconductor chips and the plurality of inner leads, a plurality of wires for providing electrical connections between the respective electrodes of the semiconductor chips and the inner leads corresponding thereto, and wide outer leads connecting to the inner leads and exposed outside the molding body. A plurality of slits are formed in the respective portions of the outer leads located outside the molding body to extend lengthwise in directions in which the outer leads are extracted. This achieves a reduction in lead stress which is placed on the outer leads by thermal stress or the like after the mounting of a MOSFET and thereby enhances the reliability of the MOSFET.

Abstract: Joint section is provided in a connection between a journal section and one of two arms supporting a crankpin and between the crankpin and the other of the arms. In each of the joint sections, a plurality of bolts are arranged along an imaginary circle substantially concentric to the axis of the journal section or crankpin, for fastening together the components. Radius of at least one of the journal section and crankpin is greater than a distance between axis lines of the journal section and crankpin. Blanks of shaft components are worked to provide thereon positioning sections, and the components are provisionally attached together to provide a crankshaft blank. The crankshaft blank is worked and then diassembled to attach thereto float bearings and a connecting rod integrally having a big end. Then, the crankshaft is re-assembled to make a crankshaft assembly.