Abstract: The present invention realizes strengthening of a ground of a lower-surface ground electrode of an upper semiconductor chip and miniaturization in a semiconductor module on which two semiconductor chips are mounted in a stacked manner. A lower semiconductor chip is fixed to a bottom of a recess formed in an upper surface of a module board, and an upper semiconductor chip is fixed to an upper surface of a support body made of conductor which is formed over the upper surface of the module board around the recess. External electrode terminals and a heat radiation pad are formed over a lower surface of the module board. A plurality of vias which are connected to the heat radiation pad are formed in the bottom of the recess. The support body is formed over the vias connected to the heat radiation pad. The heat radiation pad assumes a ground potential. On the upper surface of the module board, chip-like electronic parts such as chip resistances, chip capacitors and chip fixed coils are mounted.

Abstract: There is provided a semiconductor device with enhanced reliability having a heat sink mounting a plurality of semiconductor chips, a plurality of inner leads connected electrically to the semiconductor chips, a molding body for resin molding the plurality of semiconductor chips and the plurality of inner leads, a plurality of wires for providing electrical connections between the respective electrodes of the semiconductor chips and the inner leads corresponding thereto, and wide outer leads connecting to the inner leads and exposed outside the molding body. A plurality of slits are formed in the respective portions of the outer leads located outside the molding body to extend lengthwise in directions in which the outer leads are extracted. This achieves a reduction in lead stress which is placed on the outer leads by thermal stress or the like after the mounting of a MOSFET and thereby enhances the reliability of the MOSFET.

Abstract: A Rankine cycle system is provided in which, with regard to a given relationship between the pressure (Pevp) and the temperature (Tevp) of a vapor that is taken into an expander (4) that includes a cylinder chamber in a first stage and a vane chamber in a second stage, the chambers being disposed in line, the expansion ratio of the vapor that the expander (4) takes in and discharges is set at a predetermined expansion ratio (v) according to the given relationship so that the pressure (Pexp2) and the temperature (Texp2) of the vapor that is discharged from the expander (4) coincide with target values, thereby making the expander (4) and the condenser (5) exhibit maximum performance. Since the vapor within the cylinder chamber in the first stage is in a superheated vapor region and contains no water, the phenomenon of water hammer will not be caused in the cylinder chamber.

Abstract: A waste heat recovery system for an internal combustion engine. The internal combustion engine includes first and second raised temperature portions. The raised temperature is higher at the first portion than at the second portion. A first evaporating portion generates a first vapor from the first raised temperature portion. A second evaporating portion generates a second vapor from the second raised temperature portion and with a lower pressure than the first vapor. First and second energy converting portions of a displacement type expander converts expansion energy of the first and second vapor into mechanical energy. A condenser and a supply pump are also provided.

Abstract: In a drive system, there is provided a waste heat recovering device forming a Rankine cycle by an evaporator for heating water with waste heat of an internal combustion engine to generate high-pressure vapor, the internal combustion engine being connected to a transmission, a displacement-type expander for converting high-pressure vapor generated by the evaporator to an output with constant torque, a condenser for liquefying low-pressure vapor discharged from the expander, and a feed pump for supplying water liquefied by the condenser to the evaporator. The expander is connected to a power generator/motor via a planetary gear mechanism, and the expander is connected to an output shaft of the internal combustion engine via the planetary gear mechanism and a belt-type continuously variable transmission.

Abstract: In a semiconductor device, the likely occurrence of cracking of a ceramic substrate, and the consequential disconnection of internal layer wiring, due to thermal changes suffered when the semiconductor device is mounted on external wiring boards having different thermal expansion is prevented. The semiconductor device has a ceramic substrate, a wiring pattern formed on a first principal plane and having mounted semiconductor components, an external electrode portion formed on a second principal plane and connected to an external circuit, internal layer wiring formed inside said ceramic substrate to electrically connect said wiring pattern and said external electrode portion via through-hole wiring, and semiconductor components and a resin layer covering said semiconductor components, wherein the internal layer wiring is formed internally with respect to the side of said ceramic substrate with a clearance of at least 0.05 mm.

Abstract: In a rotary fluid machine including pistons (37) reciprocally received in cylinders (33) provided in a rotor (27), and vanes (44) fitted in vane grooves provided in the rotor (27) for reciprocal movement, the rotor (27) includes a rotor core (31) which is supported on a rotary shaft (21) and in which the cylinders (33) are accommodated, and twelve rotor segments (32) separated in a circumferential direction and fixed to surround an outer peripheral surface of the rotor core (31); and each of the vane grooves (43) is defined between the adjacent rotor segments (32). Thus, the dimensional accuracy of the vane grooves (43) can be enhanced without need for a special accurate working or processing.

Abstract: Pistons (41) are slidably received in a plurality of cylinders (39) disposed radially in a rotor (31), and a plurality of vanes (42) cooperating with the pistons (41) are disposed radially in the rotor (31), so that a vane chamber (54) is defined between a pair of the adjacent vanes (42). The radial movements of each of the pistons (41) and each of the vanes (42) are substantially stopped, so that the volumes of each of the cylinders (39) and each of the vane chambers (54) are not changed, for a period from the end of an exhaust stroke at which a gas-phase working medium is discharged from the cylinder (39) and the vane chamber (54) to the start of an intake stroke at which the supplying of the gas-phase working medium is started. Thus, it is possible to prevent the generation of a water hammer phenomenon due to a liquid-phase working medium confined in the cylinder (39) and the vane chamber (54).

Abstract: In a rotary fluid machine for converting the reciprocal movement of pistons (41) and the rotational movement of a rotor (31) from one into another by the engagement of rollers (59) and annular grooves (60) with each other, a value in a positive peak region of a pressure load of pistons (41) received by the rollers (59) engaged in the annular grooves (60) and a value of a positive peak region of a centrifugal force load received by the rollers (59) are set, so that they are substantially equal to each other, and phases of the two peak regions are deviated from each other. In addition, the phase of a negative peak region of a vane (42) pushing-down load received by the rollers (59) and the phase of the positive peak region of the pressure load of the pistons (41) received by said rollers (59) are established, so that they are overlapped at least partially on each other.

Abstract: An internal combustion engine waste heat recovery system is provided in which a second heat exchanger (H2), a fifth heat exchanger (H5), a fourth heat exchanger (H4), a third heat exchanger (H3), and a first heat exchanger (H1) are disposed sequentially from the upstream side to the downstream side of the flow of exhaust gas in an exhaust passage (33) of an internal combustion engine, and water as a working medium is supplied sequentially to the first heat exchanger (H1), the second heat exchanger (H2), the third heat exchanger (H3), the fourth heat exchanger (H4), and the fifth heat exchanger (H5).

Abstract: Rotary type fluid machine includes a casing 7, a rotor 31 and a plurality of vane-piston units U1-U12 which are disposed in a radiate arrangement on the rotor 31. Each of the vane-piston units U1-U12 has a vane 42 sliding in a rotor chamber 14 and a piston 41 placed in abutment against an on-slide side of the vane 42. When it functions as an expanding machine 4, the expansion of a high pressure gas is used to operate the pistons 41 thereby to rotate the rotor 31 via vanes 42 and the expansion of a low pressure gas caused by a pressure reduction in the high pressure gas is used to rotate the rotor 31 via the vanes 41. On the other hand, when it functions as a compressing machine, the rotation of rotor 31 is used to supply a low pressure air to the side of pistons 41 via vanes 42 and further, the pistons 41 are operated by the vanes 42 to convert the low pressure air to the high pressure air.

Abstract: In an electronic device which realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a bonding portion between a semiconductor device and a substrate is formed of metal balls made of Cu, or the like, and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.

Abstract: Rotary type fluid machine includes a casing 7, a rotor 31 and a plurality of vane-piston units U1-U12 which are disposed in a radiate arrangement on the rotor 31. Each of the vane-piston units U1-U12 has a vane 42 sliding in a rotor chamber 14 and a piston 41 placed in abutment against a non-slide side of the vane 42. When it functions as an expanding machine 4, the expansion of a high pressure gas is used to operate the pistons 41 thereby to rotate the rotor 31 via vanes 42 and the expansion of a low pressure gas caused by a pressure reduction in the high pressure gas is used to rotate the rotor 31 via the vanes 41. On the other hand, when it functions as a compressing machine, the rotation of rotor 31 is used to supply a low pressure air to the side of pistons 41 via vanes 42 and further, the pistons 41 are operated by the vanes 42 to convert the low pressure air to the high pressure air.

Abstract: Rotary type fluid machine includes a casing 7, a rotor 31 and a plurality of vane-piston units U1-U12 which are disposed in a radiate arrangement on the rotor 31. Each of the vane-piston units U1-U12 has a vane 42 sliding in a rotor chamber 14 and a piston 41 placed in abutment against a non-slide side of the vane 42. When it functions as an expanding machine 4, the expansion of a high pressure gas is used to operate the pistons 41 thereby to rotate the rotor 31 via vanes 42 and the expansion of a low pressure gas caused by a pressure reduction in the high pressure gas is used to rotate the rotor 31 via the vanes 41. On the other hand, when it functions as a compressing machine, the rotation of rotor 31 is used to supply a low pressure air to the side of pistons 41 via vanes 42 and further, the pistons 41 are operated by the vanes 42 to convert the low pressure air to the high pressure air.

Abstract: In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.

Abstract: First heat exchangers (H4, H3, H2) are disposed within an exhaust port (18), within a pre-catalytic device (34), and on the downstream of a main catalytic device (35); the exhaust port (18), the pre-catalytic device (34), and the main catalytic device (35) being provided in each exhaust passage (33) of a multicylinder internal combustion engine. These first heat exchangers (H4, H3, H2) are independently provided for each of the exhaust passages (33), and a second heat exchanger (H1) is disposed in a section where these exhaust passages (33) are combined. Since the first heat exchangers (H4, H3, H2) are disposed on the upstream side of the exhaust passage (33), high heat exchange efficiency can be obtained by high temperature exhaust gas, and, moreover, the occurrence of exhaust interference can be avoided, thereby preventing any decrease in the output of the internal combustion engine.

Abstract: In an exhaust port structure in an internal combustion engine, a cylinder head has a cylinder head body and a cylindrical exhaust port liner. The exhaust port liner is partially supported at a plurality of points on the cylinder head body, and a heat-insulating layer exists around the exhaust port liner. Thus, it is possible to inhibit the propagation of heat from the exhaust port liner to the cylinder head body as much as possible.

Abstract: An outer periphery of an output shaft (23) integral with a rotor (31) of an expander of a vane-type operated by a high-pressure vapor is supported at its opposite ends by a static-pressure bearing (25) mounted at one end thereof in a floated state provided by a liquid film of a pressurized liquid-phase fluid supplied from a pressurized liquid-phase fluid feed bore (129) through a pressurized liquid-phase fluid passage (W5), and by a static-pressure bearing (25) mounted at the other end thereof in a floated state provided by a liquid film of a pressurized liquid-phase fluid supplied from a pressurized liquid-phase fluid feed bore (129) through pressurized liquid-phase fluid passages (W6, W7, W9, W10. W11 and W12). Vanes (42) supported radially in the rotor (31) for reciprocal movement are supported in floated states by a liquid film of a pressurized liquid-phase fluid supplied through pressurized liquid-phase fluid passages (W14) extending radially outwards within the rotor (31).

Abstract: A semiconductor device capable of attaining the reduction of size is disclosed. The semiconductor device comprises a module substrate having a surface and a back surface, a control chip mounted on the surface of the module substrate, plural chip parts mounted on the surface in adjacency to the control chip, first and second output chips mounted on the back surface of the module substrate, plural lands formed on the back surface of the module substrate, and a seal portion formed of resin to seal the control chip and the plural chip parts, wherein the first and second output chips are larger in the amount of heat generated than the control chip, the heat from the first and second output ships is radiated to a mother board, and packaging parts on the surface side of the module substrate are sealed with only a sealing resin without using a metallic case or the like to attain the reduction in size of the module.

Abstract: A small capacity pre-catalytic system (34) is disposed immediately downstream of an exhaust port (18), and a large capacity main catalytic system (35) is disposed immediately downstream of the pre-catalytic system (34). The pre-catalytic system (34) includes finely divided catalyst supports (48), and a third stage heat exchanger (H3) is disposed between these catalyst supports (48) so that a heat transfer tube (49) is bent in a zigzag manner. Fourth stage and fifth stage heat exchangers (H4, H5) are disposed on the upstream side, in the flow of the exhaust gas, of the pre-catalytic system (34), and first and second stage heat exchangers (H1, H2) are disposed on the downstream side, in the flow of the exhaust gas, of the main catalytic system (35). Water is made to flow through the first stage heat exchanger (H1) to the fifth heat exchanger (H5) in a direction opposite to that in which the exhaust gas flows, thereby exchanging heat with the exhaust gas.