Patents by Inventor Tsuneo Endoh

Tsuneo Endoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050029666
    Abstract: A semiconductor device, in which a solder layer bonding chip parts and wiring members are enclosed with the resin layer, and the solder layer is comprised of a compound body in which metal powder is distributed in the matrix metal, is disclosed. When a semiconductor device in which the chip parts are installed in the wiring member with the solders, the soldering part is sealed with the resin is mounted secondly on the external wiring member, the outflow of the solders and the short circuit due to the outflow, the disconnections, and the displacement of the chip parts can be prevented.
    Type: Application
    Filed: August 27, 2002
    Publication date: February 10, 2005
    Inventors: Yasutoshi Kurihara, Yoshimasa Takahashi, Tsuneo Endoh, Mikio Negishi, Masashi Yamaura, Hirokazu Nakajima, Yosuke Sakurai, Hironori Kodama
  • Publication number: 20050031479
    Abstract: A rotary fluid machine is provided that includes a rotor chamber (14) formed in a casing, a rotor (41) rotatably housed within the rotor chamber (14), a plurality of vane channels (49) formed radially in the rotor (41), a plurality of vanes (48) slidably supported in the respective vane channels (49), vane chambers (75) defined between adjacent vanes (48), and an intake port (90) and an exhaust port (91) for supplying and discharging a gas-phase working medium to and from the vane chambers (75). A labyrinth (43g) provided on the outer peripheral face of the rotor (41) prevents the gas-phase working medium from leaking in a region in which there is a large difference in pressure between adjacent vane chambers (75) that are in between the trailing edge of the exhaust port (91) and the leading edge of the intake port (90).
    Type: Application
    Filed: September 20, 2002
    Publication date: February 10, 2005
    Inventors: Tsutomu Takahashi, Tsuneo Endoh, Hiroshi Ichikawa, Yasunari Kimura
  • Publication number: 20050025653
    Abstract: A rotary fluid machine is provided in which a rotating shaft (113) fixed to a rotor (41) is rotatably supported on a fixed shaft (102) fixed to a casing (11), sliding surfaces of the fixed shaft (102) and the rotating shaft (113) are lubricated by a first pressurized liquid-phase working medium, and sliding surfaces of the rotor (41) and a vane (48) are lubricated by a second pressurized liquid-phase working medium.
    Type: Application
    Filed: September 20, 2002
    Publication date: February 3, 2005
    Inventors: Yasunari Kimura, Tsuneo Endoh, Tsutomu Takahashi
  • Publication number: 20050025633
    Abstract: A rotating fluid machine has first energy converting means including cylinders and pistons, and second energy converting means including vanes emerging from and submerging into a rotor in the radial direction. A gaseous phase working medium having leaked out of the higher pressure first energy converting means to a reservoir is effectively utilized instead of being discarded wastefully by feeding the leaked gaseous phase working medium to the lower pressure second energy converting means via a one-way valve and a junction chamber. Moreover, when the pressure in the reservoir is lower than that in the junction chamber, the one-way valve obstructs the gaseous phase working medium from flowing back, thereby preventing the efficiency of the second energy converting means from deteriorating.
    Type: Application
    Filed: December 19, 2003
    Publication date: February 3, 2005
    Inventors: Hiroshi Ichikawa, Tsutomu Takahashi, Yasunari Kimura, Tsuneo Endoh
  • Publication number: 20050019161
    Abstract: A rotary fluid machine is provided that includes a rotor rotatably housed within a casing, a hollow rotating shaft (113) that rotates integrally with the rotor, and a fixed shaft (102) that is relatively rotatably fitted into the inner periphery of the rotating shaft (113); wherein the fixed shaft (102) is floatingly supported in the casing via a fixed shaft support spring (95) having an alignment action. When rotational runout of the rotor is transmitted to the fixed shaft (102) via the rotating shaft (113), the alignment action of the fixed shaft support spring (95) suppresses the rotational runout of the rotor, and any increase in the frictional resistance in a sliding section between the rotating shaft (113) and the fixed shaft (102) and the occurrence of abnormal wear can be prevented effectively, and the leakage of steam from a rotary valve (V) provided on the sliding surfaces of the rotating shaft (113) and the fixed shaft (102) can be reduced.
    Type: Application
    Filed: September 20, 2002
    Publication date: January 27, 2005
    Inventors: Hiroshi Ichikawa, Tsuneo Endoh, Tsutomu Takahashi, Yasunari Kimura
  • Patent number: 6846163
    Abstract: In a rotary fluid machine including pistons (37) reciprocally received in cylinders (33) provided in a rotor (27), and vanes (44) fitted in vane grooves provided in the rotor (27) for reciprocal movement, the rotor (27) includes a rotor core (31) which is supported on a rotary shaft (21) and in which the cylinders (33) are accommodated, and twelve rotor segments (32) separated in a circumferential direction and fixed to surround an outer peripheral surface of the rotor core (31); and each of the vane grooves (43) is defined between the adjacent rotor segments (32). Thus, the dimensional accuracy of the vane grooves (43) can be enhanced without need for a special accurate working or processing.
    Type: Grant
    Filed: September 4, 2001
    Date of Patent: January 25, 2005
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Tsutomu Takahashi, Kensuke Honma, Naoki Itoh, Tsuneo Endoh
  • Patent number: 6843309
    Abstract: A condenser includes a cooling section having a plurality of vapor passages to convert vapor into water, a blower for drawing water produced in the vapor passages out of the vapor passages, and a recovery section for receiving the drawn-out water. Thus, the water produced in the vapor passages in the cooling section can be prevented from occluding the vapor passages.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: January 18, 2005
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Hiroyoshi Taniguchi, Tsuneo Endoh, Tsutomu Takahashi, Taizou Kitamura, Takashi Takazawa
  • Patent number: 6832475
    Abstract: A small capacity pre-catalytic system (34) is disposed immediately downstream of an exhaust port (18), and a large capacity main catalytic system (35) is disposed immediately downstream of the pre-catalytic system (34). The pre-catalytic system (34) includes finely divided catalyst supports (48), and a third stage heat exchanger (H3) is disposed between these catalyst supports (48) so that a heat transfer tube (49) is bent in a zigzag manner. Fourth stage and fifth stage heat exchangers (H4, H5) are disposed on the upstream side, in the flow of the exhaust gas, of the pre-catalytic system (34), and first and second stage heat exchangers (H1, H2) are disposed on the downstream side, in the flow of the exhaust gas, of the main catalytic system (35). Water is made to flow through the first stage heat exchanger (H1) to the fifth heat exchanger (H5) in a direction opposite to that in which the exhaust gas flows, thereby exchanging heat with the exhaust gas.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: December 21, 2004
    Assignee: Honda Giken Koygo Kabushi Kaisha
    Inventors: Hiroyuki Tanaka, Seiji Nishimoto, Haruhiko Komatsu, Tsuneo Endoh, Tsuyoshi Baba, Masashi Shinohara
  • Publication number: 20040250546
    Abstract: A trap chamber having an air intake port opening inside a rotor in the radial direction and an exhaust port opening outside in the radial direction is formed within each vane slidably fitted to a vane groove of the rotor. When the vane has shifted inward in the radial direction, only the air intake port communicates with a reservoir to suck a liquid phase working medium into the trap chamber, and when the vane has shifted outward in the radial direction, only the exhaust port communicates with the vane chamber in the exhaust stroke to discharge the liquid phase working medium in the trap chamber. Since the air intake port and the exhaust port do not communicate with the liquid reservoir and the vane chamber at the same time, a gaseous phase working medium in the liquid reservoir is obstructed from flowing out to the vane chamber via the trap chamber, so that the gaseous phase working medium having still usable pressure energy is prevented from being wastefully discarded.
    Type: Application
    Filed: December 19, 2003
    Publication date: December 16, 2004
    Inventors: Hiroshi Ichikawa, Tsutomu Takahashi, Yasunari Kimura, Tsuneo Endoh
  • Patent number: 6831360
    Abstract: A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting the chip parts and the substrate terminals of the module substrate by soldering, gold wires for connecting the pads of the semiconductor chips and corresponding substrate terminals of the module substrate, and a sealing portion formed with a low elasticity resin such as an insulative silicone resin or a low elasticity epoxy resin for covering the semiconductor chips, chip parts, solder connection portions and gold wires which prevents flow out of the solder in the solder connection portion by re-melting thereby preventing short-circuit.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: December 14, 2004
    Assignee: Renesas Technology Corp.
    Inventors: Masashi Yamaura, Hirokazu Nakajima, Nobuyoshi Maejima, Mikio Negishi, Tomio Yamada, Tomomichi Koizumi, Tsuneo Endoh
  • Patent number: 6823668
    Abstract: An internal combustion engine waste heat recovery system is provided in which a second heat exchanger, a fifth heat exchanger, a fourth heat exchanger, a third heat exchanger, and a first heat exchanger are disposed sequentially from the upstream side to the downstream side of the flow of exhaust gas in an engine exhaust passage. Water, used as a working medium, is supplied sequentially to the first, second, third, fourth and the fifth heat exchangers. Water having the lowest temperature can be supplied to the first heat exchanger on the most downstream side of the gas flow, to which exhaust gas having a comparatively low temperature is supplied. Water having a comparatively low temperature, which has passed only through the first heat exchanger, can be supplied to the second heat exchanger on the most upstream side.
    Type: Grant
    Filed: August 13, 2003
    Date of Patent: November 30, 2004
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Tsuneo Endoh, Masashi Shinohara, Hiroyuki Tanaka
  • Publication number: 20040231330
    Abstract: A hybrid vehicle is equipped with an internal combustion engine, a motor/generator, and a Rankine cycle system for recovering thermal energy of exhaust gas. The output of the Rankine cycle system is input into a transmission or, alternatively, converted into electric power and used for charging a battery. The Rankine cycle system has temperature setter that sets the temperature of steam at the outlet of an evaporator. A pressure setter is provided for setting steam pressure at the inlet of an expander. A pressure controller is provided for controlling the steam pressure at the inlet of the expander. The evaporator generates steam to be supplied at a pressure that is optimum for the expansion ratio of the expander. The Rankine cycle system is operated when the vehicle is accelerating or cruising and efficiently recovers thermal energy of the exhaust gas and reduces the fuel consumption of the internal combustion engine.
    Type: Application
    Filed: April 9, 2004
    Publication date: November 25, 2004
    Inventors: Shigeru Ibaraki, Takeo Kiuchi, Tsuneo Endoh, Akihisa Sato
  • Publication number: 20040234406
    Abstract: A rotating fluid machine is provided with a rotor chamber, a rotor accommodated in the rotor chamber, and vanes guided by vane grooves formed in the rotor. A U-shaped vane seal is held by a seal holding groove formed in the end face of each of the vanes. The opposite ends of the vane seal are fitted into slits in seal ancillary members which are fitted into engaging holes formed in the end faces of each of the vanes. The seal ancillary members are pressed by springs toward the inner circumferential face of the rotor chamber. The pressure of a gaseous phase working medium introduced into the bottom parts of the seal holding grooves is restrained from leaking out of the ends of the vane seal by the seal ancillary members. Thus, sealing performance can be secured by pressing the vane seal against the inner circumferential face of the rotor chamber.
    Type: Application
    Filed: December 19, 2003
    Publication date: November 25, 2004
    Inventors: Hiroshi Ichikawa, Tsutomu Takahashi, Yasunari Kimura, Tsuneo Endoh
  • Publication number: 20040188854
    Abstract: The size of a power amplifier module is reduced. The power amplifier module includes a module substrate, a lower chip flip-connected to the module substrate, an upper chip stacked face up onto the lower chip, a common electrode disposed on a back surface of the upper chip, plural wires for connecting the upper chip and the module substrate with each other, plural wires for connecting the common electrode and the module substrate with each other, plural chip parts mounted on the module substrate, and a sealing portion formed on the main surface of the module substrate. The common electrode is connected to the module substrate through wires to strengthen the GND of the upper chip. Since the lower chip is flip-connected to the module substrate, the difference in size between the upper and lower chips is diminished to attain a reduction in size of the power amplifier module.
    Type: Application
    Filed: March 26, 2004
    Publication date: September 30, 2004
    Inventors: Satoru Konishi, Tsuneo Endoh, Hirokazu Nakajima
  • Publication number: 20040188834
    Abstract: A semiconductor device includes a module board having a top surface and a backside surface, a lower chip having a first circuit operated at a first frequency and a second circuit operated at a second frequency, an upper chip disposed so as to overlie lower chip and having a first circuit and a second circuit, a plurality of wires electrically bonding the upper chip to the module board, and electrically bonding the lower chip to the module board, respectively, and a plurality of chip components on the module board. The first circuit of the upper chip is disposed opposite to the second circuits of the lower chip, while the second circuit of the upper chip is disposed opposite to the first circuits of the lower chip. As a result, interference by high frequencies will hardly occur between the wires bonded to the upper and lower chips.
    Type: Application
    Filed: March 25, 2004
    Publication date: September 30, 2004
    Inventors: Satoru Konishi, Tsuneo Endoh, Hirokazu Nakajima
  • Patent number: 6776128
    Abstract: In an internal combustion engine, a combustion chamber is provided in a cylinder head on one side of a partition wall, and a heat-insulating layer is provided in the cylinder head on the other side of the partition wall. Cooling passages are provided in a plurality of regions provided with different heat loads in the partition wall, respectively. The flow rate of a cooling medium is set, so that the flow rate in the cooling passage existing in the region of the larger heat load is larger than that in the cooling passage existing in the region of the smaller heat load. Thus, the temperature of an exhaust gas can be maintained at a high level by maintaining the combustion chamber at a high temperature.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: August 17, 2004
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Atsushi Baba, Tatsuya Nakagawa, Masahiko Minemi, Tsuneo Endoh, Taizou Kitamura
  • Publication number: 20040134648
    Abstract: A working medium supply control system in a heat exchanger is provided. The heat exchanger (14) carries out heat exchange between an exhaust gas flowing through an exhaust passage of an internal combustion engine (11) and water flowing through a heat transfer tube (13), and the exhaust gas thereby heats the water to generate steam at a target temperature. The system is provided with a plurality of flow control valves (17a to 17j) that can individually regulate the amount of water supplied to a plurality of headers provided in the heat transfer tube (13), and control means (21) individually controls the amounts of water supplied via the respective flow control valves (17a to 17j) based on the rotational speed and the load of the internal combustion engine (11).
    Type: Application
    Filed: January 14, 2004
    Publication date: July 15, 2004
    Inventors: Tsuyoshi Baba, Masashi Shinohara, Tsuneo Endoh
  • Patent number: 6761030
    Abstract: A waste heat recovering device for a multi-cylinder internal combustion engine, wherein among a plurality of exhaust pipes extending from cylinders of a multi-cylinder internal combustion engine, a plurality of exhaust pipes unlikely to cause exhaust interference are collected to form one or more collecting pipes. A heat exchanger for recovering heat of exhaust gas is provided in the one or more collecting pipes. Therefore, a waste heat recovering device can be provided, in which the number of heat exchangers is reduced compared to the number of cylinders of the multi-cylinder internal combustion engine to reduce rest periods of the heat exchanger and reduce spaces occupied by the heat exchanger.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: July 13, 2004
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Hiroyuki Niikura, Tsuneo Endoh, Yuichi Itoh, Naoki Ohta
  • Patent number: 6761143
    Abstract: An expansion unit (4) for converting an expansion energy of pressure-increased steam into a rotation energy of an output shaft, wherein a cover member (26) is provided on the casing outer surface of the expansion unit (4). The cover member (26) has a function of sealing the end section of an output shaft (23) protruding beyond the casing outer surface against the outside and a function of recovering steam led out from the casing and has its pressured reduced after the conversion. The end section of the output shaft (23) provided inside the cover member (26) and a driven-side transmission shaft (119) disposed outside the cover member (26) are coupled with each other via a magnet type shaft coupling (120) so as to be able to transmit power, whereby the output shaft (23) and the driven-side transmission shaft (119) can be coupled without steam in the expansion unit leaking outside.
    Type: Grant
    Filed: September 18, 2002
    Date of Patent: July 13, 2004
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Naoki Itoh, Tsuneo Endoh, Yasunobu Kawakami, Ryuji Sano
  • Publication number: 20040125579
    Abstract: The present invention realizes the miniaturization of a semiconductor module. The semiconductor module includes a module board having external electrode terminals and a heat radiation pad over a lower surface thereof, a first semiconductor chip incorporating an initial-stage transistor of a high frequency power amplifying device therein, a second semiconductor chip incorporating a next-stage transistor and a final-stage transistor therein, and an integrated passive device which constitutes a matching circuit. At least one of the first semiconductor chip and the second semiconductor chip and the integrated passive device are mounted over an upper surface of the module board in an overlapped manner. The second semiconductor chip is mounted over a bottom of a recess formed in the upper surface of the module board.
    Type: Application
    Filed: December 12, 2003
    Publication date: July 1, 2004
    Inventors: Satoru Konishi, Tsuneo Endoh, Hirokazu Nakajima, Masaaki Tsuchiya