Abstract: A semiconductor device may include a source on a first side of a gate. The semiconductor device may include a drain on a second side of the gate, where the second side of the gate is opposite to the first side of the gate. The semiconductor device may include a first contact over the source. The semiconductor device may include a second contact over the drain. The semiconductor device may include an air gap over the gate between at least the first contact and the second contact. The semiconductor device may include at least two dielectric materials in each of a region between the air gap and the first contact and a region between the air gap and the second contact.

Abstract: A manufacturing method of a display device includes the following steps. A substrate is provided. The substrate has a pixel region, and a driving circuit is disposed on the pixel region. A light emitting element is placed in the pixel region. An electric field is applied to align the light emitting element. The aligned light emitting element is electrically connected to the driving circuit. The substrate carrying the aligned light emitting element is cut into multiple sub-substrates. The manufacturing method of the display device in the embodiment of the disclosure may reduce the processing time or have a better processing sequence.

Abstract: The disclosure provides a method for generating an image with uniform brightness. The method includes: providing a first sub-image having a first overlapping portion and a first non-overlapping portion; providing a second sub-image having a second overlapping portion and a second non-overlapping portion; and superimposing the first sub-image with the second sub-image through the first overlapping portion and the second overlapping portion. The brightness of the first overlapping portion of the first sub-image is complementary to the brightness of the second overlapping portion of the second sub-image.

Abstract: A smart grid system includes a current sensor, and plural power conversion devices coupled to an AC grid. The current sensor measures a total current flowed through the AC grid, thereby providing a measured current value. The power conversion devices include a master power conversion device and plural slave power conversion devices. The master power conversion device receives the measured current value, thereby controlling an output power of the master power conversion device and providing a first duty cycle signal according to the measured current value. A first one of the slave power conversion devices which is coupled to the master power conversion device receive the first duty cycle signal, thereby controlling an output power of the first one of the slave power conversion devices according to the first duty cycle signal. The master power conversion device and the slave power conversion devices are communicated via a daisy chain connection.

Abstract: An optical fingerprint identification system includes a base, a photo sensor, a light emitting layer and a cover. The photo sensor is disposed on the base. The light emitting layer is disposed above the photo sensor, and the light emitting layer includes a light emitting element. The cover is disposed above the light emitting layer. The optical fingerprint identification system further includes a condenser unit and a light receiving element between the photo sensor and the cover. The condenser unit is disposed above the photo sensor. The light receiving element is disposed above the condenser unit. The light emitting element is disposed away from the photo sensor, the condenser unit and the light receiving element in a sideway direction that is different from a stack direction of the optical fingerprint identification system.

Abstract: A method of manufacturing an electronic device includes the following steps. A substrate is provided, and the substrate has a first surface, a second surface opposite to the first surface and a side surface between the first surface and the second surface. A first circuit is formed on the first surface. A second circuit is formed on the second surface. The first circuit is made to electrically connect with the second circuit. A testing signal is applied to the first circuit and received from the second circuit to verify the electrical connection between the first circuit and the second circuit.

Abstract: A device is provided, which includes one or more antennas and a circuit. The circuit is configured to receive a packet from a transmitter device through the antennas, and obtain channel-state information from the received packet. The circuit includes one or more filters to filter out or recognize the received packet that complies with one or more preset conditions. The circuit uses the channel-state information of the received packet, which complies with the one or more preset conditions, to estimate a status of a channel between the transmitter device and the device.

Abstract: A display device includes a display panel and a support structure. The display panel has a rollable portion and a non-rollable portion. The support structure supports the display panel and has areas corresponding to the rollable portion and to the non-rollable portion. The support structure has a lower stiffiness in the area corresponding to the rollable portion than in the area corresponding to the non-rollable portion.

Abstract: An optical image capturing system includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first, the second and the third lens elements all have refractive power. The fourth lens element with refractive power has both surfaces being aspheric. The fifth lens element with refractive power has both surfaces being aspheric. The sixth lens element with refractive power has an image-side surface having at least one convex shape at a peripheral region thereof and both surfaces being aspheric. The seventh lens element with refractive power has an image-side surface having at least one convex shape at a peripheral region thereof, wherein both surfaces being aspheric, and at least one surface has at least one inflection point thereon.

Abstract: An optical fingerprint identification system includes a cover, a light emitting layer, an optical layer, an image sensor and a base that are sequentially disposed from top to bottom. The cover has a fingerprint contact surface on top. The image sensor has an image surface. The optical layer includes a first array layer and a second array layer, and the first array layer is stacked on top of the second array layer. The first array layer and the second array layer respectively include a plurality of first array lens elements and a plurality of second array lens elements respectively arranged at equal intervals in a first direction. Each of the first array lens elements and a corresponding second array lens element of the second array layer are coaxial along an optical axis and form an imaging unit.

Abstract: An electronic device is provided. The electronic device includes a first electronic device unit and a second electronic device unit. The first electronic device unit includes a first substrate and a second substrate disposed opposite to the first substrate, and a portion of the first substrate protrudes outward a boundary of the second substrate in a first protruding direction perpendicular to a normal direction of the first substrate. The second electronic device unit is connected to the first electronic device unit and includes a third substrate and a fourth substrate disposed opposite to the third substrate, and a portion of the fourth substrate protrudes outward a boundary of the third substrate in a second protruding direction perpendicular to a normal direction of the third substrate. In addition, the portion of the first substrate and the portion of the fourth substrate each includes a grinded portion.

Abstract: Systems and methods here may be used for a setup of fluorescence image capturing of a gemstone, such as a diamond placed on a flat stage. Some examples utilize a setup that both sends light and captures the image from the table side of the gemstone by passing ultraviolet (UV) light between 10 nm and 400 nm to the gemstone and capturing the excited fluorescence image for analysis through a dichroic beam splitter. In some examples, the cutoff is 300 nm. The dichroic beam splitter arrangement allows for the camera to focus on the same interface of the stage and gemstone over and over for ease of use and without moving, changing, or adjusting the equipment for different samples.

Abstract: An optical system including a self-emitting display and an optical element is provided. The self-emitting display emits a collimated light from a surface. The optical element is disposed on a moving path of the collimated light. A head-up display is further provided.

Abstract: An electronic modulating device is provided. The electronic modulating device includes a first modulating unit. The first modulating unit includes a first transistor including a channel arranged in an extending direction. The first modulating unit also includes a first modulating electrode electrically connected to the first transistor and arranged in a first longitudinal direction. The electronic modulating device also includes a second modulating unit. The second modulating unit includes a second transistor including a channel arranged in the extending direction. The second modulating unit also includes a second modulating electrode electrically connected to the second transistor and arranged in a second longitudinal direction that is different from the first longitudinal direction. The first included angle between the extending direction and the first longitudinal direction is different from a second included angle between the extending direction and the second longitudinal direction.

Abstract: This disclosure provides for robust isolation across the SOI structure. In contrast to forming a charge trap layer in specific areas on the structure, a charge trap layer may be built across the insulating/substrate interface. The charge trap layer may be an implantation layer formed throughout and below the insulation layer. Devices built on this SOI structure have reduced cross-talk between the devices. Due to the uniform structure, isolation is robust across the structure and not confined to certain areas. Additionally, deep trench implantation is not required to form the structure, eliminating cost. The semiconductor-on-insulator substrate may include an active silicon layer over an oxide layer. The oxide layer may be over a charge trap layer. The charge trap layer may be over a silicon substrate.

Abstract: A display device is provided. The display device includes a display unit, a transparency controlling unit, and a driving circuit. The driving circuit is coupled to the display unit and the transparency controlling unit. The driving circuit drives the display unit and the transparency controlling unit in different modes. Therefore, the display device may provide a transparent display function.

Abstract: A touch panel and a touch panel operation method are disposed. The touch panel includes an active region and a non-active region in an operating state, and the touch panel includes a plurality of sensing electrodes and a controller. The plurality of sensing electrodes are disposed in the active region and the non-active region. The controller receives an active touch signal from the plurality of sensing electrodes located in the active region and a non-active touch signal from the plurality of the sensing electrodes located in the non-active region. The controller manages the active touch signal and the non-active touch signal, so that only the active touch signal is subjected to a subsequent process.

Abstract: A display device is disclosed, wherein the display device includes a light emitting unit, including: a first semiconductor layer; an active layer disposed on the first semiconductor layer; a second semiconductor layer disposed on the active layer; and a protecting layer disposed on the second semiconductor layer, wherein the protecting layer has a region in which oxygen atomic percentages decrease toward the second semiconductor layer.

Abstract: A method of manufacturing an electronic device includes the following steps. A substrate is provided, and the substrate has a first surface, a second surface opposite to the first surface and a side surface between the first surface and the second surface. A first circuit is formed on the first surface. A first protection layer is formed on the first circuit, and a portion of the first circuit is exposed. A second circuit is formed on the second surface. The second circuit is made to be electrically connected with the exposed portion of the first circuit.

Abstract: A method of manufacturing an electronic device includes the following steps. A substrate is provided, and the substrate has a first surface, a second surface opposite to the first surface and a side surface between the first surface and the second surface. A first circuit is formed on the first surface. A second circuit is formed on the second surface. The first circuit is made to electrically connect with the second circuit. A testing signal is applied to the first circuit and received from the second circuit to verify the electrical connection between the first circuit and the second circuit.