Abstract: An optical photographing lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has refractive power. The second lens element has positive refractive power. The third lens element with positive refractive power has an image-side surface being concave in a paraxial region thereof. The fourth lens element has refractive power. The fifth lens element with refractive power has an image-side surface being concave in a paraxial region thereof, wherein an object-side surface and the image-side surface of the fifth lens element are aspheric, and at least one of the surfaces of the fifth lens element has at least one inflection point. The optical photographing lens assembly has a total of five lens elements with refractive power.

Abstract: A liquid crystal display, a display panel and a manufacturing method of a display device are disclosed. The liquid crystal display includes a backlight module and a display panel including a first region and a second region with different curvatures. The display panel receives a light from the backlight module, outputs a first light in the first region and outputs a second light in the second region. The first light and the second light respectively have a first normal brightness and a second normal brightness in a normal view angle, and respectively have a first oblique brightness and a second oblique brightness in an oblique view angle. A ratio of a difference between the first normal brightness and the second normal brightness to the first normal brightness is less than a ratio of a difference between the first oblique brightness and the second oblique brightness to the first oblique brightness.

Abstract: The present disclosure provides a display device including a cathode electrode, a first anode electrode, a second anode electrode, a first light emitting layer, a first light conversion layer, a second light emitting layer, a second light conversion layer and an auxiliary electrode. The first light emitting layer is disposed between the cathode electrode and the first anode electrode. The first light conversion layer is disposed above the first light emitting layer. The second light emitting layer is disposed between the cathode electrode and the second anode electrode. The second light conversion layer is disposed above the second light emitting layer. The auxiliary electrode is electrically connected to the cathode electrode, and a portion of the auxiliary electrode is between the first light conversion layer and the second light conversion layer in a top view direction of the display device.

Abstract: An optical fingerprint identification system includes a cover, a light emitting layer, an optical layer, an image sensor and a base that are sequentially disposed from top to bottom. The cover has a fingerprint contact surface on top. The image sensor has an image surface. The optical layer includes a first array layer and a second array layer, and the first array layer is stacked on top of the second array layer. The first array layer and the second array layer respectively include a plurality of first array lens elements and a plurality of second array lens elements respectively arranged at equal intervals in a first direction. Each of the first array lens elements and a corresponding second array lens element of the second array layer are coaxial along an optical axis and form an imaging unit.

Abstract: A transparent touch display device is provided. The transparent touch display device includes a display unit and a touch electrode. The display unit includes a circuit area and a transparent area. The circuit area includes a plurality of signal lines, a plurality of pixel circuits and a plurality of light-emitting elements. The pixel circuits are electrically connected to the signal lines. The light-emitting elements are driven by the pixel circuits. The touch electrode overlaps the circuit area.

Abstract: A display device is provided and includes a supporting substrate, a first flexible substrate, an oxide layer, a first insulating layer, a light emitting unit, and a protective layer. The first flexible substrate is disposed on the supporting substrate, and the oxide layer is disposed on the first flexible substrate. The first insulating layer is disposed on the oxide layer, and in a cross-sectional view, the first insulating layer has at least one opening. The light emitting unit is disposed on the first insulating layer, the protective layer is disposed on the light emitting unit, and at least a portion of the protective layer is disposed in the at least one opening.

Abstract: An electronic device is provided. The electronic device includes a substrate, a plurality of signal lines and a plurality of units. The signal lines are disposed on the substrate. The units are disposed on the substrate. At least one of the units includes a first main pad, a first redundant pad, and an electronic component including a first electrode. In addition, one of the signal lines is electrically connected to the first electrode of the electronic component, the first main pad and the first redundant pad.

Abstract: A TOI Lidar System generates an image of an object based on the distance of various point measurements to the object. The TOI Lidar System detects the envelope of an electrical signal created from an interference light signal. The interference light signal is produced from the back-reflected light resulting from a sampling arm light emission to the object combined with a reference light emission. The reference light emission is created by splitting a pulse-modulated coherent light source's emission signal and passing the reference light emission through a reference arm. The optical interference signal is transferred to a balanced photodetector to convert to an electrical signal converted to digital data. The digital data is evaluated to determine the rising edges or falling edges of a digitized electrical interference signal to determine a time delay between the reference light emission and back-reflected light used to calculate the distance.

Abstract: A method for manufacturing an electronic device is provided by the disclosure. A flexible substrate is provided, in which the flexible substrate has two surfaces opposite to each other. A circuit is formed on one of the surfaces of the flexible substrate. A through hole is formed in the flexible substrate. A conductive bridge is formed in the through hole. A supporting substrate is attached to the other surface of the flexible substrate. An opening penetrating the supporting substrate is formed, and the opening corresponds to the through hole in the flexible substrate. An electronic component is mounted on the supporting substrate, and the electronic component is allowed to be electrically connected to the circuit through the conductive bridge.

Abstract: A method for manufacturing an electronic device includes the steps of providing a flexible substrate, forming an electric circuit layer on the flexible substrate at an elevated temperature, and enhancing a transmittance of the flexible substrate after forming the electric circuit layer.

Abstract: An electronic device is provided. The electronic device includes a first substrate, a second substrate, a third substrate and a fourth substrate. The first substrate includes a first portion. The second substrate is disposed on the first substrate, and the first portion protrudes outward a boundary of the second substrate. The third substrate is disposed adjacent to the first substrate. The fourth substrate is disposed on the third substrate and includes a second portion protruding outward a boundary of the third substrate. The second portion overlaps the first portion. The first substrate includes a first side surface facing the third substrate. The fourth substrate includes a second side surface facing the second substrate. The first side surface and the second side surface are at least partially grinded.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a gate electrode layer formed over a semiconductor substrate. The semiconductor device structure also includes a gate dielectric layer formed between the gate electrode layer and the semiconductor substrate. In addition, the semiconductor device structure includes a first gate spacer having a hydrophobic surface that covers a first sidewall of the gate electrode layer. The first sidewall of the gate electrode layer extends along a first sidewall of the gate dielectric layer, so that the first sidewall of the gate dielectric layer is separated from the hydrophobic surface of the first gate spacer.

Abstract: An electronic modulating device is provided. The electronic modulating device includes a substrate, a plurality of first electrodes, a plurality of second electrodes, and a plurality of second electrodes. The plurality of first electrodes are disposed on the substrate. The plurality of second electrodes are disposed on the substrate. The common electrode is disposed opposite to the plurality of first electrodes and the plurality of second electrodes, and includes a plurality of openings. The electronic modulating device modulates an electromagnetic wave of radio frequency in a range from 1 G Hz to 100 T Hz.

Abstract: A display device includes a substrate, a first light-emitting unit, a second light-emitting unit, a first light conversion unit, a second light conversion unit, a first buffer layer, a second buffer layer, and a sidewall buffer layer. The first light-emitting unit and the second light-emitting unit are disposed on the substrate. The first buffer layer is disposed between the first light conversion unit and the first light-emitting unit and has a first curved bottom surface. The second buffer layer is disposed between the second light conversion unit and the second light-emitting unit and has a second curved bottom surface. The sidewall buffer layer directly contacts the first light conversion unit and the second light conversion. A width of the first curved bottom surface is different from a width of the second curved bottom surface.

Abstract: A light emitting device includes a first light emitting unit and a second light emitting unit. The first light emitting unit includes a first composite layer, and the first composite layer includes an organic light emitting layer. The second light emitting unit is adjacent to the first light emitting unit, the second light emitting unit includes a second composite layer, and the second composite layer includes a quantum dot light emitting layer. A thickness of the first composite layer is different from a thickness of the second composite layer.

Abstract: This disclosure provides for robust isolation across the SOI structure. In contrast to forming a charge trap layer in specific areas on the structure, a charge trap layer may be built across the insulating/substrate interface. The charge trap layer may be an implantation layer formed throughout and below the insulation layer. Devices built on this SOI structure have reduced cross-talk between the devices. Due to the uniform structure, isolation is robust across the structure and not confined to certain areas. Additionally, deep trench implantation is not required to form the structure, eliminating cost. The semiconductor-on-insulator substrate may include an active silicon layer over an oxide layer. The oxide layer may be over a charge trap layer. The charge trap layer may be over a silicon substrate.

Abstract: An electronic device includes a substrate, a grid structure, and a plurality of polarizing wires. The grid structure is disposed on the substrate and includes a plurality of apertures. The polarizing wires are disposed on the substrate and extend across the apertures. A first number of a portion of the polarizing wires within a first aperture of the apertures is in a range from 50 to 15000.

Abstract: An optical photographing lens assembly includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element has refractive power. The second lens element has positive refractive power. The third lens element with positive refractive power has an image-side surface being concave in a paraxial region thereof. The fourth lens element has refractive power. The fifth lens element with refractive power has an image-side surface being concave in a paraxial region thereof, wherein an object-side surface and the image-side surface of the fifth lens element are aspheric, and at least one of the surfaces of the fifth lens element has at least one inflection point. The optical photographing lens assembly has a total of five lens elements with refractive power.

Abstract: An optical fingerprint identification system includes a base, a photo sensor, a light emitting layer and a cover. The photo sensor is disposed on the base. The light emitting layer is disposed above the photo sensor, and the light emitting layer includes a light emitting element. The cover is disposed above the light emitting layer. The optical fingerprint identification system further includes a light path adjusting element between the photo sensor and the cover. The light emitting element is disposed away from the light path adjusting element and the photo sensor in a sideway direction that is different from a stack direction of the optical fingerprint identification system.

Abstract: A light emitting device includes a first light emitting element, a second light emitting element disposed adjacent to the first light emitting element, a first color conversion element disposed on the first light emitting element, and a second color conversion element disposed on the second light emitting element. A thickness of the first color conversion element is different from a thickness of the second color conversion element.