Abstract: A hinge for the temples and the lens frame of glasses comprises engaging rods and bushings that are respectively formed at two sides of the lens frame and fronts ends of the temples. A spiral guiding slot and a guiding block are separately formed at an external surface of the engaging rod and at the inner surface of the bushing. The spiral guiding slots at the two sides of the lens frame have the same spiral orientation. The temples at the two sides of the lens frame are respectively slid upward and downward to be staggered in time of folding due to the cooperation of the spiral guiding slot and the guiding block. As a result, the dimension of the glasses is reduced, which conduces to convenient storage for users.

Abstract: A hinge for the temples and the lens frame of glasses comprises engaging rods and bushings that are respectively formed at two sides of the lens frame and fronts ends of the temples. A spiral guiding slot and a guiding block are separately formed at an external surface of the engaging rod and at the inner surface of the bushing. The spiral guiding slots at the two sides of the lens frame have the same spiral orientation. The temples at the two sides of the lens frame are respectively slid upward and downward to be staggered in time of folding due to the cooperation of the spiral guiding slot and the guiding block. As a result, the dimension of the glasses is reduced, which conduces to convenient storage for users.

Abstract: A glasses hinge structure includes a pivot and a pivot seat. The pivot seat and the pivot are integrally formed with a corner panel of a glasses frame and a glasses foot, respectively. The pivot has a vertical portion in a cylinder shape and a horizontal connecting portion. The vertical portion has a middle section connected with a front end of the horizontal connecting portion. The horizontal connecting portion has a rear end connected to the glasses foot. The pivot seat has a vertical trough and a recess. The vertical trough is adapted for insertion of the vertical portion of the pivot. The recess is interconnected with a middle section of the vertical trough to accommodate the horizontal connecting portion when the glasses foot is extended. The vertical trough has a C-shaped cross-section which has an opening. The opening is less than a diameter of the vertical portion and greater than a width of the horizontal connecting portion.

Abstract: The present invention discloses glasses. The glasses include a pair of temples and a frame which is integrally formed with the temples. An inner side of the junction of each of the temples and the frame is formed with a corrugated surface. The temples are provided with magnetic members in relative positions. The magnetic members engage with each other to secure the temples in place when the temples are folded. The glasses may be attracted on a metallic board or a metallic frame for convenient storage and use. The present invention discloses a glasses box which includes a box body and a box cover. The box body and the box cover are buckled together to form an accommodating space for receiving glasses. The box cover has an outer side provided with a sucker and an inner side provided with a magnet. When in use, the glasses box provides an accommodating space for receiving glasses therein. When taking out the glasses, the sucker of the box cover could be secured on a desired place.

Abstract: A manufacturing method for a semiconductor-device isolation structure comprises providing a substrate with at least one shallow trench isolation structure, performing a salicide process that forms a recess on the surface of the shallow trench isolation structure, forming a cap film covering the substrate and filling the recess, performing an etching process to remove the cap film outside the recess, and forming a contact etch stop layer covering the substrate and filling the recess. Due to the filling recess with the cap film first, the contact etch stop layer covering the substrate and filling the recess does not have seams or voids.

Abstract: A method for fabricating a negative temperature coefficient thermistor is provided, including the steps of: (A) combining ceramic powders having a negative temperature coefficient of resistance, a polymer binder and a solvent to form a mixture; (B) removing the solvent and granulating the mixture to form granulous powders; (C) compressing the granulous powders to obtain a thermistor material with a specific shape; (D) curing the thermistor material at 80° C. to 350° C.; and (E) mounting an electrode to the thermistor material to form the negative temperature coefficient thermistor. The method can be performed in a low temperature without the problem of interface diffusion. Further, the desired resistance value and thermistor constant (B) can be easily adjusted and obtained by mixing ceramic powders with different characteristics of temperature coefficient of resistance and/or the addition of conductive metal powder.

Abstract: A glasses hinge structure includes a pivot and a pivot seat. The pivot seat and the pivot are integrally formed with a corner panel of a glasses frame and a glasses foot, respectively. The pivot has a vertical portion in a cylinder shape and a horizontal connecting portion. The vertical portion has a middle section connected with a front end of the horizontal connecting portion. The horizontal connecting portion has a rear end connected to the glasses foot. The pivot seat has a vertical trough and a recess. The vertical trough is adapted for insertion of the vertical portion of the pivot. The recess is interconnected with a middle section of the vertical trough to accommodate the horizontal connecting portion when the glasses foot is extended. The vertical trough has a C-shaped cross-section which has an opening. The opening is less than a diameter of the vertical portion and greater than a width of the horizontal connecting portion.

Abstract: The present invention discloses glasses. The glasses include a pair of temples and a frame which is integrally formed with the temples. An inner side of the junction of each of the temples and the frame is formed with a corrugated surface. The temples are provided with magnetic members in relative positions. The magnetic members engage with each other to secure the temples in place when the temples are folded. The glasses may be attracted on a metallic board or a metallic frame for convenient storage and use. The present invention discloses a glasses box which includes a box body and a box cover. The box body and the box cover are buckled together to form an accommodating space for receiving glasses. The box cover has an outer side provided with a sucker and an inner side provided with a magnet. When in use, the glasses box provides an accommodating space for receiving glasses therein. When taking out the glasses, the sucker of the box cover could be secured on a desired place.

Abstract: A manufacturing method for a semiconductor-device isolation structure comprises providing a substrate with at least one shallow trench isolation structure, performing a salicide process that forms a recess on the surface of the shallow trench isolation structure, forming a cap film covering the substrate and filling the recess, performing an etching process to remove the cap film outside the recess, and forming a contact etch stop layer covering the substrate and filling the recess. Due to the filling recess with the cap film first, the contact etch stop layer covering the substrate and filling the recess does not have seams or voids.

Abstract: A method for fabricating a negative temperature coefficient thermistor is provided, including the steps of: (A) combining ceramic powders having a negative temperature coefficient of resistance, a polymer binder and a solvent to form a mixture; (B) removing the solvent and granulating the mixture to form granulous powders; (C) compressing the granulous powders to obtain a thermistor material with a specific shape; (D) curing the thermistor material at 80° C. to 350° C.; and (E) mounting an electrode to the thermistor material to form the negative temperature coefficient thermistor. The method can be performed in a low temperature without the problem of interface diffusion. Further, the desired resistance value and thermistor constant (B) can be easily adjusted and obtained by mixing ceramic powders with different characteristics of temperature coefficient of resistance and/or the addition of conductive metal powder.

Abstract: A method of protecting a shallow trench isolation structure is described, which is applied to a semiconductor device process that includes a first process causing a recess in the STI structure and a second process after the first process. The method includes forming a silicon nitride layer in the recess along the profile of the same during the second process.