Abstract: An anti-theft lock for a portable electronic device has a mounting shaft, two buckling units, a split-abutting unit, and a controlling unit. The two buckling units are moveably mounted around the mounting shaft. The split-abutting unit is moveable and has an engaging end and a split-abutting end. The split-abutting end selectively abuts the two buckling units via the movement of the split-abutting unit. The controlling unit has an annular curved surface. The annular curved surface slidably abuts the engaging end of the split-abutting unit. During the rotation of the controlling unit, the annular curved surface is capable of pushing the split-abutting unit to make the split-abutting end abut the two buckling units with inclined surfaces to move the two buckling units away from each other. The larger a distance the split-abutting unit moves, the larger a distance the two buckling units move away from each other.

Abstract: A thermally conductive board includes a metal substrate, a metal layer, a thermal conductive insulating polymer layer, and a ceramic material layer. The thermal conductive insulating polymer layer is located between the metal layer and the metal substrate. The ceramic material layer includes an upper ceramic layer or a lower ceramic layer, or includes both the upper ceramic layer and the lower ceramic layer. The upper ceramic layer is disposed between the metal layer and the thermal conductive insulating polymer layer, and the lower ceramic layer is disposed between the thermal conductive insulating polymer layer and the metal substrate.

Abstract: An apparatus for testing a device under test (DUT) is provided. The apparatus includes a power supply device and a data generating device. The power supply device is configured to provide a first voltage and a second voltage to the DUT. The data generating device is configured to provide first data to the DUT. The power supply device is configured to provide the first voltage to the DUT in a first time duration. The data generating device is configured to provide the first data to the DUT in the first time duration. The power supply device is configured to provide the second voltage to the DUT in a second time duration after the first time duration. The second voltage is different from the first voltage.

Abstract: A package manufacturing process and semiconductor packages are provided. An interposer having a crystal structure is provided. A first die and a second die are bonded on the interposer. The second die is positioned to be spaced apart from the first die with a gap extending direction that is perpendicular to a shortest distance of the gap, and the gap extending direction is not parallel with a crystallographic orientation of the crystal structure of the interposer. A molding compound is formed over the interposer covering the first and second dies. The molding compound and the interposer are cut into packages.

Abstract: A hinge is adapted to an electronic device having two screens. A base body of the hinge is mounted to a host base of the electronic device. The base body includes an operating portion and a linkage portion connected to each other. A first screen of the two screens is connected to the operating portion; a second screen of the two screens is connected to the linkage portion. The first screen rotates according to an operating part of the operating portion, and a driver assembly of the hinge simultaneously drives the operating portion and the linkage portion to rotate, so that the first screen and the second screen rotate simultaneously. By the simple hinge linkage structure design, the two screens rotate in opposite directions when being open, and may provide parallel slopes for viewing when being open to a preset open angle, thereby enhancing the convenience and smoothness of operation.

Abstract: A method is provided and includes several operations: testing multiple scan chains in multiple shift cycles to obtain multiple values; determining at least one fail chain in the scan chains and determining at least one fail shift cycle corresponding to at least one fail value in the values; mapping the at least one fail chain and the at least one fail shift cycle to the scan chains to identify the at least one fail flip flop; and identifying at least one fault site corresponding to the at least one fail flip flop.

Abstract: An apparatus for testing a device under test (DUT) is provided. The apparatus includes a power supply device and a data generating device. The power supply device is configured to provide a first voltage and a second voltage to the DUT. The data generating device is configured to provide first data to the DUT. The power supply device is configured to provide the first voltage to the DUT in a first time duration. The data generating device is configured to provide the first data to the DUT in the first time duration. The power supply device is configured to provide the second voltage to the DUT in a second time duration after the first time duration. The second voltage is different from the first voltage.

Abstract: An off-line uninterruptible power system and two line-interactive uninterruptible power systems are provided. The off-line uninterruptible power system and one of the line-interactive uninterruptible power systems additionally adopt a transformer for supplying an AC output, with lower voltage level than a rated output voltage, to at least one electrical device (especially those with resistive load characteristic). The other line-interactive uninterruptible power system controls its automatic voltage regulating circuit to supply an AC output, with lower voltage level than a rated output voltage, to at least one electrical device (especially those with resistive load characteristic).

Abstract: A universal security lock for portable electronic devices has an engaging mechanism which has a base, an expanding rod, and two gripping fingers. The expanding rod is slidable along an engaging direction. Each of the gripping fingers is pivotally mounted on the base and disposed on a respective side of the expanding rod. When the expanding rod is moved toward the engaging direction, an end of the expanding rod abuts against the two gripping fingers and expands the gripping fingers gradually such that the gripping fingers can be engaged in security slots of a portable electronic device. At least one of the gripping fingers has a protrusion extending toward the other gripping finger. The expanding rod selectively abuts against the protrusion to further expand the gripping finger.

Abstract: A universal security lock for portable electronic devices has a base and a lock core. An operating part, a blocker, a displacement absorber, an expanding rod, and two gripping fingers are arranged in the base. The operating part is slidably mounted through the rear opening and is slidable toward the front opening to an engaged position. The displacement absorber is a spring or two mutually repelling magnets that drive the operating part and the expanding rod away from each other. The two gripping fingers are pivotally mounted to the base and disposed on a front opening of the base. When the operating part is in the engaged position, the displacement absorber pushes the expanding rod toward the front opening to move the outer ends of the two gripping fingers away from each other gradually such that the gripping fingers engage with security slots of different widths.

Abstract: A universal security lock for portable electronic devices has a lock case and a lock core. The lock core, a displacement absorber, an expanding rod, and two gripping fingers are arranged in a passage of the lock case. An operating part of the lock core is movable inwardly into the passage to an engaged position. The displacement absorber is a spring or two mutually repelling magnets that drive the operating part and the expanding rod to move away from each other. The two gripping fingers are pivotally mounted on a front opening of the lock case. When the operating part is in the engaged position, the displacement absorber pushes the expanding rod toward the front opening to move the outer ends of the two gripping fingers away from each other gradually such that the gripping fingers engage with security slots of different widths.

Abstract: A circuit screening system including a target circuit under test receiving a first testing signal in a first period and a second testing signal in a second period; a power circuit providing a supply voltage to the target circuit under test, the supply voltage maintaining at a first voltage level in the first period and deviating from the first voltage level, and maintaining at the first voltage level in the second period; and a clock generating circuit providing a clock signal to the target circuit under test, the clock signal triggering the target circuit under test to receive the first testing signal in the first period and the second testing signal in the second period; the clock signal having a first profile and a second profile in the first period and the second period, respectively, and the first profile and the second profile having a phase difference.

Abstract: An adaptable liquid connector structure includes a case, an intermediate member and a liquid connector main body. The case is a hollow frame. The intermediate member is located in the case and includes an opening formed at a front area thereof for mounting the liquid connector main body therein, a locating bore located below the opening, and a plurality of elastic elements mounted on outer sides and a rear side of thereof. The intermediate member is supported by the elastic elements to suspend in the case and the elastic elements absorb assembly tolerance of the adaptable liquid connector structure, such that the liquid connector main body mounted therein is allowed for a positional floating adjustment in and relative to the case upward, downward, leftward and rightward to be smoothly, correctly and securely connected to an adaptor connector.

Abstract: A method is provided in the present disclosure. The method includes several operations: generating, by a processing unit, a mapping table associated with multiple scan chains and multiple shift cycles corresponding to multiple values stored in the scan chains in an integrated circuit; determining, based on the mapping table, at least one fail flip flop in the scan chains in response to the values outputted from the scan chains; and identifying at least one fault site corresponding to the at least one fail flip flop.

Abstract: A method includes acquiring a design layout of a standard cell, extracting feature information of one or more vias in the standard cell from the design layout, performing a circuit simulation to obtain first simulation outputs of the standard cell for input patterns by applying a first abnormal resistance value as a parasitic resistance value of a first via among the one or more vias, the first abnormal resistance value being different from a nominal parasitic resistance value of the first via, determining whether the first simulation outputs match corresponding expected outputs of the standard cell for the input patterns, and in response to one or more simulation outputs among the first simulation outputs not matching the corresponding expected outputs, recording one or more defect types for the first via having the first abnormal resistance value along with corresponding input patterns and corresponding simulation outputs.

Abstract: An uninterruptible power system and an operation method thereof are provided. The uninterruptible power system comprises a DC-AC conversion circuit, a plurality of switches, a plurality of sensing units, a plurality of output ports and a control unit. Each output port is electrically coupled to an output terminal of the DC-AC conversion circuit sequentially through one of the sensing units and one of the switches. The control unit is configured to define members of at least one group from the output ports according to a system setting, and define which members of each group are non-critical output ports according to the system setting. The control unit is further configured to set, according to the system setting, at least one condition for all non-critical output ports in each group to simultaneously stop supplying power, and to accordingly control the operations of the corresponding switches.

Abstract: A circuit screening system includes a target circuit under test, a power circuit, and a clock generating circuit. The target circuit under test receives a first testing signal in a first period, and a second testing signal in a second period, and the first testing signal is different from the second testing signal. The power circuit provides a supply voltage to the target circuit under test, wherein a voltage level of the supply voltage maintains at a first voltage level in the first period, is pulled up to a second voltage level and back to the first level after the first period, and maintains at the first voltage level in a second period after the first period. The clock generating circuit provides a clock signal to the target circuit under test, wherein the clock signal has different profiles in the first period and the second period.

Abstract: A package comprises an interposer, comprising an interposer substrate including at least one layer, and a plurality of RDLs formed through at least a portion of the interposer substrate. The package also includes a die device structure comprising at least one device die, and a first test line (TL) structure interposed between the interposer and the die device structure. The first TL structure includes at least one first test line electrically coupled to the at least one device die, at least a portion of the at least one first test line extending beyond a peripheral edge of the die device structure to provide an electrical interface with the at least one device die.

Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.

Abstract: A liquid-cooling heat dissipation structure includes a substrate and a cover body mated with the substrate to define a heat exchange chamber therebetween. A radiating fin unit and a stop section are disposed in the heat exchange chamber. The stop section serves to first divide a cooling liquid entering the heat exchange chamber, whereby the cooling liquid first flows through the periphery of the radiating fin unit and then flow into the middle of the radiating fin unit so that the cooling liquid is prevented from straightly passing through the radiating fin unit. Multiple cooperative flow-stopping protrusions are disposed in the periphery of the radiating fin unit to help the cooling liquid to uniformly flow through the radiating fin unit. By means of the structural design of the liquid-cooling heat dissipation structure, the heat exchange efficiency is greatly enhanced.