Abstract: A water block reinforcement structure includes a substrate and a cover body mated with the substrate to define a heat exchange chamber therebetween. At least one radiating fin assembly and at least one reinforcement section are disposed in the heat exchange chamber. The reinforcement section has an upper end connected with the inner face of the cover body by a connection means.

Abstract: A hinge is adapted to an electronic device having two screens. A base body of the hinge is mounted to a host base of the electronic device. The base body includes an operating portion and a linkage portion connected to each other. A first screen of the two screens is connected to the operating portion; a second screen of the two screens is connected to the linkage portion. The first screen rotates according to an operating part of the operating portion, and a driver assembly of the hinge simultaneously drives the operating portion and the linkage portion to rotate, so that the first screen and the second screen rotate simultaneously. By the simple hinge linkage structure design, the two screens rotate in opposite directions when being open, and may provide parallel slopes for viewing when being open to a preset open angle, thereby enhancing the convenience and smoothness of operation.

Abstract: A liquid-cooling device includes multiple water blocks and at least one connection tube. Each of the water blocks has a water incoming end, a water outgoing end and a water-receiving space in communication with the water incoming end and the water outgoing end. The connection tube is disposed between each two water blocks. Two ends of the connection tube are respectively connected with the water incoming end of one of the two water blocks and the water outgoing end of the other water block, whereby the water-receiving spaces of the two water blocks communicate with each other via the connection tube. The connection tube has at least one bellows section between two ends of the connection tube. The liquid-cooling device solves the problems of the conventional liquid-cooling device that when the water block is welded, thermal deformation is produced to cause tolerance and the manufacturing cost is higher.

Abstract: A package manufacturing process and semiconductor packages are provided. An interposer having a crystal structure is provided. A first die and a second die are bonded on the interposer. The second die is positioned to be spaced apart from the first die with a gap extending direction that is perpendicular to a shortest distance of the gap, and the gap extending direction is not parallel with a crystallographic orientation of the crystal structure of the interposer. A molding compound is formed over the interposer covering the first and second dies. The molding compound and the interposer are cut into packages.

Abstract: An anti-theft lock for a portable electronic device has a mounting shaft, two buckling units, a split-abutting unit, and a controlling unit. The two buckling units are moveably mounted around the mounting shaft. The split-abutting unit is moveable and has an engaging end and a split-abutting end. The split-abutting end selectively abuts the two buckling units via the movement of the split-abutting unit. The controlling unit has an annular curved surface. The annular curved surface slidably abuts the engaging end of the split-abutting unit. During the rotation of the controlling unit, the annular curved surface is capable of pushing the split-abutting unit to make the split-abutting end abut the two buckling units with inclined surfaces to move the two buckling units away from each other. The larger a distance the split-abutting unit moves, the larger a distance the two buckling units move away from each other.

Abstract: A thermally conductive board includes a metal substrate, a metal layer, a thermal conductive insulating polymer layer, and a ceramic material layer. The thermal conductive insulating polymer layer is located between the metal layer and the metal substrate. The ceramic material layer includes an upper ceramic layer or a lower ceramic layer, or includes both the upper ceramic layer and the lower ceramic layer. The upper ceramic layer is disposed between the metal layer and the thermal conductive insulating polymer layer, and the lower ceramic layer is disposed between the thermal conductive insulating polymer layer and the metal substrate.

Abstract: A circuit screening system includes a target circuit under test, a power circuit, and a clock generating circuit. The target circuit under test receives a first testing signal in a first period, and a second testing signal in a second period, and the first testing signal is different from the second testing signal. The power circuit provides a supply voltage to the target circuit under test, wherein a voltage level of the supply voltage maintains at a first voltage level in the first period, is pulled up to a second voltage level and back to the first level after the first period, and maintains at the first voltage level in a second period after the first period. The clock generating circuit provides a clock signal to the target circuit under test, wherein the clock signal has different profiles in the first period and the second period.

Abstract: A power supplying device comprising a battery, a charging circuit and a DC-AC conversion circuit is provided. The charging circuit is electrically coupled to an AC power source and configured to charge the battery. The DC-AC conversion circuit is electrically coupled to the battery and configured to supply an AC output. When the power supplying device is powered on, both of the charging circuit and the DC-AC conversion circuit are enabled.

Abstract: A package manufacturing process and semiconductor packages are provided. An interposer having a crystal structure is provided. A first die and a second die are bonded on the interposer. The second die is positioned to be spaced apart from the first die with a gap extending direction that is perpendicular to a shortest distance of the gap, and the gap extending direction is not parallel with a crystallographic orientation of the crystal structure of the interposer. A molding compound is formed over the interposer covering the first and second dies. The molding compound and the interposer are cut into packages.

Abstract: An over-current protection device for a power generator includes a first pin, configured to receive a signal; a detection and control module, coupled to the first pin, and configured to detect the signal to determine whether the signal conforms to a pre-determined condition or not, and to output a control signal when the signal conforms to the pre-determined condition; and an auto-trim and memory module, coupled to the detection and control module, and configured to receive the control signal from the detection and control module for executing corresponding auto-trim measurements and storing corresponding adjustment data.

Abstract: The present invention relates to a fan control system, which comprises a controller and a detection circuit. The controller controls a fan. The detection circuit detects at least one state of the fan control system, and generates a confirmation signal according to the at least one state. The confirmation signal represents the state of the fan control system.

Abstract: An over-current protection device for a power generator includes a first pin, configured to receive a signal; a detection and control module, coupled to the first pin, and configured to detect the signal to determine whether the signal conforms to a pre-determined condition or not, and to output a control signal when the signal conforms to the pre-determined condition; and an auto-trim and memory module, coupled to the detection and control module, configured to receive the control signal from the detection and control module, wherein the auto-trim and memory module is configured to execute a plurality of auto-trim measurements and to store adjustment data corresponding to the plurality of auto-trim measurements; a second pin, coupled to the detection and control module, configured to receive a second signal.

Abstract: A method is provided in the present disclosure. The method includes several operations: generating, by a processing unit, a mapping table associated with multiple scan chains and multiple shift cycles corresponding to multiple values stored in the scan chains in an integrated circuit; determining, based on the mapping table, at least one fail flip flop in the scan chains in response to the values outputted from the scan chains; and identifying at least one fault site corresponding to the at least one fail flip flop.

Abstract: A method includes: determining a defective area in a semiconductor device of a semiconductor wafer; thinning the semiconductor wafer from a backside of the semiconductor wafer; bonding a first substrate to the backside of the semiconductor wafer, wherein the first substrate includes an opening and the defective area is exposed through the opening; and performing a test on the defective area by projecting a light beam from the backside through the opening.

Abstract: A method includes: determining a defective area in a semiconductor device of a semiconductor wafer; thinning the semiconductor wafer from a backside of the semiconductor wafer; bonding a first substrate to the backside of the semiconductor wafer, wherein the first substrate includes an opening and the defective area is exposed through the opening; and performing a test on the defective area by projecting a light beam from the backside through the opening.

Abstract: An interposer substrate is manufactured with a scribe line between adjacent regions. In an embodiment a separate exposure reticle is utilized to pattern the scribe line. The exposure reticle to pattern the scribe line will create an exposure region which overlaps and overhangs the exposure regions utilized to form adjacent regions.

Abstract: An apparatus for testing a device under test (DUT) is provided. The apparatus includes a power supply device and a data generating device. The power supply device is configured to provide a first voltage and a second voltage to the DUT. The data generating device is configured to provide first data to the DUT. The power supply device is configured to provide the first voltage to the DUT in a first time duration. The data generating device is configured to provide the first data to the DUT in the first time duration. The power supply device is configured to provide the second voltage to the DUT in a second time duration after the first time duration. The second voltage is different from the first voltage.

Abstract: A method for in-line optical testing is provided. The method includes providing a substrate, forming an optical device on the substrate, and forming a test circuit on the substrate, the test circuit being optically coupled to the optical device. An optical test is performed on the optical device with the test circuit. The test circuit is then removed.

Abstract: An interposer substrate is manufactured with a scribe line between adjacent regions. In an embodiment a separate exposure reticle is utilized to pattern the scribe line. The exposure reticle to pattern the scribe line will create an exposure region which overlaps and overhangs the exposure regions utilized to form adjacent regions.

Abstract: An off-line uninterruptible power system and two line-interactive uninterruptible power systems are provided. The off-line uninterruptible power system and one of the line-interactive uninterruptible power systems additionally adopt a transformer for supplying an AC output, with lower voltage level than a rated output voltage, to at least one electrical device (especially those with resistive load characteristic). The other line-interactive uninterruptible power system controls its automatic voltage regulating circuit to supply an AC output, with lower voltage level than a rated output voltage, to at least one electrical device (especially those with resistive load characteristic).