Patents by Inventor Tsung-Yi Chen

Tsung-Yi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9638716
    Abstract: A positioner and a probe head of a probe card are provided. The positioner has a main opening, a first sub-opening, a second sub-opening, a third sub-opening, a fourth sub-opening, a first positioning portion, a second positioning portion, a first elastic portion and a second elastic portion. The first sub-opening, the second sub-opening, the third sub-opening, and the fourth sub-opening are sequentially arranged at the periphery of the main opening and are communicated to the main opening. A stiffness of the first positioning portion and a stiffness of the second positioning portion are higher than a stiffness of the first elastic portion and a stiffness of the second elastic portion.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: May 2, 2017
    Assignee: MPI Corporation
    Inventors: Tzu-Yang Chen, Shang-Jung Hsieh, Chung-Tse Lee, Tsung-Yi Chen, Tien-Chia Li, Chia-Yuan Kuo, Che-Wei Lin
  • Patent number: 9618536
    Abstract: A probe needle includes a head, a tail and a body connected between the head and the tail and provided with a first flat section curvedly extending from the head towards the tail for providing sufficient deformation when the tail is pressed on a device under test, and a second flat section neighbored to the first flat section for supporting the probe needle in between upper and lower dies. When the probe needles are used in a probe module, the probe needles can be arranged with a pitch same as that of the conventional probe needles even though the probe needles are formed from posts having a relatively greater diameter than that of the posts for making the conventional probe needles, such that the probe needles may have enhanced current withstanding capacity and prolonged lifespan.
    Type: Grant
    Filed: June 3, 2014
    Date of Patent: April 11, 2017
    Assignee: MPI Corporation
    Inventors: Chia-Yuan Kuo, Tien-Chia Li, Ming-Chi Chen, Chien-Chou Wu, Tsung-Yi Chen
  • Publication number: 20170082656
    Abstract: A probe card includes a probe seat having upper and lower dies and a probe accommodating hole, a spring probe inserted through the probe accommodating hole and including a spring sleeve having upper and lower non-spring sections, and a circuit board disposed on the upper die and having a contact pad against which the spring probe is abutted. At least one of the upper and lower dies has a stopping surface partially facing the probe accommodating hole and an extended portion inserting hole in alignment with the probe accommodating hole. At least one of the upper and lower non-spring sections has a cylinder portion abutted on the stopping surface and an extended portion inserted through the extended portion inserting hole.
    Type: Application
    Filed: September 23, 2016
    Publication date: March 23, 2017
    Inventors: Tsung-Yi CHEN, Ting-Hsin KUO, Yi-Lung LEE, Shih-Shin CHEN, Horng-Chuan SUN, Horng-Kuang FAN
  • Patent number: 9588141
    Abstract: A probe device includes a spring probe having a spring sleeve with at least a spring section and a connection segment fixed to a needle and having a convex portion protruding over an outer cylinder surface of the spring section, and a probe seat having stacked dies and at least a guiding hole through which the probe is inserted. The dies includes a lower die, a supporting die above the lower die and a non-circular supporting hole at the supporting die. The distance between a supporting surface and a center of the supporting hole is greater than the radius of the outer cylinder surface and smaller than the distance between a guiding surface of the supporting hole and the center, which is greater than the maximum distance between the convex portion and a needle center, thereby preventing the probe receiving external force from exceeding deflection and bending.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: March 7, 2017
    Assignee: MPI CORPORATION
    Inventors: Tsung-Yi Chen, Chien-Chou Wu, Tien-Chia Li, Ting-Hsin Kuo
  • Patent number: 9535092
    Abstract: A spring probe includes a needle, a spring sleeve sleeved onto the needle, and a protrusion. The spring sleeve has upper and lower non-spring sections, and at least a spring section therebetween. The needle has a bottom end portion protruding out from the lower non-spring section, and a top end portion located in the upper non-spring section. The protrusion is located at one of the top end portion and the upper non-spring section. The needle is movable relative to the upper non-spring section from an initial position to a connected position where the upper non-spring section is electrically connected with the needle through the protrusion when receiving an external force. As a result, the spring probe effectively prevents signals from being transmitted through the spring section, thereby improving stability of signal transmission and preventing the spring section from fracture.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: January 3, 2017
    Assignee: MPI CORPORATION
    Inventors: Ting-Hsin Kuo, Tsung-Yi Chen, Tien-Chia Li, Yi-Lung Lee, Chien-Chou Wu
  • Patent number: 9470750
    Abstract: An alignment adjusting mechanism for a probe card includes a frame, a substrate and positioning screws. The frame has an opening, an inner periphery wall surrounding around the opening, and an outer periphery wall corresponding to the inner periphery wall. The substrate is disposed in the opening and supported by a support flange extending from the inner periphery wall toward a center of the opening. The frame is provided with a plurality of positioning threaded holes each extending from the outer periphery wall to the inner periphery wall in communication with the opening. Each positioning screw is threaded into one of the positioning threaded holes and has an end stopped at a lateral side of the substrate. By turning the positioning screws, the planimetric position of the substrate on an imaginary plane is adjustable.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: October 18, 2016
    Assignee: MPI CORPORATION
    Inventors: Tsung-Yi Chen, Chung-Tse Lee, Shih-Shin Chen
  • Patent number: 9465050
    Abstract: An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: October 11, 2016
    Assignee: MPI CORPORATION
    Inventors: Tsung-Yi Chen, Horng-Kuang Fan, Ching-Hung Yang, Chung-Tse Lee, Chia-Yuan Kuo, Tien-Chia Li, Ting-Ju Wu
  • Publication number: 20160262063
    Abstract: A method of coordinating a plurality of radio access networks (RANs) includes aggregating, with a gateway, communications interfaces between a plurality of RANs and a packet core network through the gateway. A plurality of radio nodes (RNs) in each of the RANs is communicatively coupled to the gateway and to user equipment (UE) devices associated with the RNs in each of the RANs. The gateway also controls and coordinates mobility of the UE devices within and among the RANs.
    Type: Application
    Filed: March 25, 2016
    Publication date: September 8, 2016
    Inventors: Tsung-Yi Chen, Jaspreet Singh, Peter J. Worters
  • Patent number: 9435856
    Abstract: A position adjustable probing device adapted for being mounted to a circuit board includes a frame, a probe head, a space transformer module and an elevation adjusting structure. The frame has a first surface, a second surface opposite to the first surface, and a first opening penetrating through the first and second surfaces. The probe head is coupled to the frame. The space transformer module is disposed in the first opening. The elevation adjusting structure is provided at the frame and has a plurality of spacers for adjusting a position of the frame relative to a reference surface in a vertical direction.
    Type: Grant
    Filed: April 15, 2014
    Date of Patent: September 6, 2016
    Assignee: MPI CORPORATION
    Inventors: Tsung-Yi Chen, Chung-Tse Lee, Shih-Shin Chen
  • Patent number: 9425000
    Abstract: An embodiment provides a manufacturing method for a porous carbon material including: preparing a first solution including a surfactant, a carbon source material and a solvent; pouring the first solution into a silica sol aqueous solution to form a second solution; preparing a silicate aqueous solution; pouring the silicate aqueous solution into the second solution to form a third solution and to precipitate out an intermediate, wherein the intermediate includes the surfactant, the carbon source material and a silica template; performing a heating process on the intermediate to carbonize the intermediate; and removing the silica template of the carbonized intermediate to form a porous carbon material. Another embodiment of the disclosure provides a porous carbon material. The other embodiment provides a supercapacitor.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: August 23, 2016
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yu-Ming Lin, Tsung-Yi Chen, Hong-Ping Lin, Wen-Ling Lu, Ssu-Jung Pan
  • Patent number: 9341648
    Abstract: The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against plural probes.
    Type: Grant
    Filed: August 22, 2013
    Date of Patent: May 17, 2016
    Assignee: MPI Corporation
    Inventors: Chung-Tse Lee, Chien-Chou Wu, Tsung-Yi Chen, Ming-Chi Chen
  • Publication number: 20150377926
    Abstract: A positioner and a probe head of a probe card are provided. The positioner has a main opening, a first sub-opening, a second sub-opening, a third sub-opening, a fourth sub-opening, a first positioning portion, a second positioning portion, a first elastic portion and a second elastic portion. The first sub-opening, the second sub-opening, the third sub-opening, and the fourth sub-opening are sequentially arranged at the periphery of the main opening and are communicated to the main opening. A stiffness of the first positioning portion and a stiffness of the second positioning portion are higher than a stiffness of the first elastic portion and a stiffness of the second elastic portion.
    Type: Application
    Filed: December 3, 2014
    Publication date: December 31, 2015
    Inventors: Tzu-Yang Chen, Shang-Jung Hsieh, Chung-Tse Lee, Tsung-Yi Chen, Tien-Chia Li, Chia-Yuan Kuo, Che-Wei Lin
  • Publication number: 20150276807
    Abstract: A probe device includes a spring probe having a spring sleeve with at least a spring section and a connection segment fixed to a needle and having a convex portion protruding over an outer cylinder surface of the spring section, and a probe seat having stacked dies and at least a guiding hole through which the probe is inserted. The dies includes a lower die, a supporting die above the lower die and a non-circular supporting hole at the supporting die. The distance between a supporting surface and a center of the supporting hole is greater than the radius of the outer cylinder surface and smaller than the distance between a guiding surface of the supporting hole and the center, which is greater than the maximum distance between the convex portion and a needle center, thereby preventing the probe receiving external force from exceeding deflection and bending.
    Type: Application
    Filed: February 23, 2015
    Publication date: October 1, 2015
    Inventors: Tsung-Yi CHEN, Chien-Chou WU, Tien-Chia LI, Ting-Hsin KUO
  • Publication number: 20150276806
    Abstract: A probe device includes a spring probe and a probe seat. The spring probe includes a needle and a spring sleeve sleeved onto the needle and provided with at least one spring section and at least one non-spring section. The probe seat includes a plurality of dies stacked together and at least one guiding hole through which the spring probe is inserted. An upper edge and a lower edge of the guiding hole of the probe seat are arranged corresponding in position to the non-spring section of the spring sleeve. As a result, the spring probe is prevented from getting jammed due to the contact of the spring section of the spring sleeve with the upper and lower edges of the guiding hole.
    Type: Application
    Filed: February 23, 2015
    Publication date: October 1, 2015
    Inventors: Chien-Chou WU, Tsung-Yi CHEN
  • Publication number: 20150276800
    Abstract: A vertical probe device includes a lower die having engaging holes and needle holes, a positioning film having limiting holes and needle holes, probe needles inserted through the needle holes, and supporters having at least an upper stopping surface and at least a lower stopping surface for moveably limiting the positioning film therebetween. Each supporter has a head, a neck passing through the limiting hole and having a length longer than the thickness of the positioning film, a body, and a tail inserted into the engaging hole, which are connected in order, and at least one of the upper and lower stopping surfaces. The supporters can prevent the positioning film from being lifted and flipped over and enables the positioning film to move so that the probe needles are reliable.
    Type: Application
    Filed: March 25, 2015
    Publication date: October 1, 2015
    Inventors: Tsung-Yi CHEN, Horng-Kuang FAN, Ching-Hung YANG, Chung-Tse LEE, Chia-Yuan KUO, Tien-Chia LI, Ting-Ju WU, Shang-Jung HSIEH
  • Publication number: 20150253358
    Abstract: An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.
    Type: Application
    Filed: March 10, 2015
    Publication date: September 10, 2015
    Inventors: Tsung-Yi CHEN, Horng-Kuang FAN, Ching-Hung YANG, Chung-Tse LEE, Chia-Yuan KUO, Tien-Chia LI, Ting-Ju WU
  • Publication number: 20150253356
    Abstract: A spring probe includes a needle, a spring sleeve sleeved onto the needle, and a protrusion. The spring sleeve has upper and lower non-spring sections, and at least a spring section therebetween. The needle has a bottom end portion protruding out from the lower non-spring section, and a top end portion located in the upper non-spring section. The protrusion is located at one of the top end portion and the upper non-spring section. The needle is movable relative to the upper non-spring section from an initial position to a connected position where the upper non-spring section is electrically connected with the needle through the protrusion when receiving an external force. As a result, the spring probe effectively prevents signals from being transmitted through the spring section, thereby improving stability of signal transmission and preventing the spring section from fracture.
    Type: Application
    Filed: January 26, 2015
    Publication date: September 10, 2015
    Inventors: Ting-Hsin KUO, Tsung-Yi CHEN, Tien-Chia LI, Yi-Lung LEE, Chien-Chou WU
  • Publication number: 20150206850
    Abstract: A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.
    Type: Application
    Filed: January 20, 2015
    Publication date: July 23, 2015
    Inventors: Kun-Han HSIEH, Huo-Kang HSU, Kuan-Chun CHOU, Tsung-Yi CHEN, Chung-Tse LEE
  • Publication number: 20150107102
    Abstract: A space transformer includes a carrier substrate made for a chip package, an insulated layer disposed on the carrier substrate, and a conductive block. The carrier substrate is provided with elongated first and second wires. The first wire has an elongated contact which is longer than the width of the first wire. The insulated layer has a hole corresponding in position to the elongated contact. The conductive block has an elongated connecting column located in the hole and connected with the elongated contact, and a cylindrical contact pad exposed at the outside of the insulated layer, larger-sized than the elongated connecting column and connected with the elongated connecting column. As a result, the cylindrical contact pad has sufficient area and structural strength for contact with a probe needle. The method for manufacturing the space transformer is also disclosed.
    Type: Application
    Filed: October 22, 2014
    Publication date: April 23, 2015
    Inventors: Chung-Tse LEE, Chien-Chou WU, Tsung-Yi CHEN
  • Patent number: 9000794
    Abstract: An elastic micro high frequency probe includes a conductor, which includes a stationary body and a movable body. The stationary body has a conductive terminal, a contacting end, and a guider. The movable body has a conductive terminal, a spring mechanism, and a guider. The spring mechanism is connected to the stationary body and to one conductive terminal. The second guider connects to the spring mechanism in such a manner that the compression direction of the spring mechanism is confined by a guiding rail. Since the width of the spring mechanism is not limited by the first and second guiders, the width of the spring mechanism can be enlarged to maximize within limited space. Therefore, the HF probe as a whole can have shortest length while acquiring the predetermined total length of the elastic stroke, such that the transmission performance of the high frequency signals can be effectively enhanced.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: April 7, 2015
    Assignee: MPI Corporation
    Inventors: Yi-Lung Lee, Chih-Chung Chen, Tsung-Yi Chen, Horng-Kuang Fan