Abstract: An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.

Abstract: A probe needle includes a head, a tail and a body connected between the head and the tail and provided with a first flat section curvedly extending from the head towards the tail for providing sufficient deformation when the tail is pressed on a device under test, and a second flat section neighbored to the first flat section for supporting the probe needle in between upper and lower dies. When the probe needles are used in a probe module, the probe needles can be arranged with a pitch same as that of the conventional probe needles even though the probe needles are formed from posts having a relatively greater diameter than that of the posts for making the conventional probe needles, such that the probe needles may have enhanced current withstanding capacity and prolonged lifespan.

Abstract: An alignment adjusting mechanism for a probe card includes a frame, a substrate and positioning screws. The frame has an opening, an inner periphery wall surrounding around the opening, and an outer periphery wall corresponding to the inner periphery wall. The substrate is disposed in the opening and supported by a support flange extending from the inner periphery wall toward a center of the opening. The frame is provided with a plurality of positioning threaded holes each extending from the outer periphery wall to the inner periphery wall in communication with the opening. Each positioning screw is threaded into one of the positioning threaded holes and has an end stopped at a lateral side of the substrate. By turning the positioning screws, the planimetric position of the substrate on an imaginary plane is adjustable.

Abstract: A position adjustable probing device adapted for being mounted to a circuit board includes a frame, a probe head, a space transformer module and an elevation adjusting structure. The frame has a first surface, a second surface opposite to the first surface, and a first opening penetrating through the first and second surfaces. The probe head is coupled to the frame. The space transformer module is disposed in the first opening. The elevation adjusting structure is provided at the frame and has a plurality of spacers for adjusting a position of the frame relative to a reference surface in a vertical direction.

Abstract: A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head.

Abstract: A probe card for being abutted against a plurality of probes is provided. The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against the probes. In addition, a method of manufacturing the probe card is provided.

Abstract: A decoder includes an interface and a processing module. The interface receives first data, redundant data of the first data, second data, redundant data of the second data, and combined redundant data. The processing module decodes the first data based on the redundant data of the first data, decodes the second data based on the redundant data, of the second data and verifies the decoding of the first and second data. When the first data is decoded successfully and the second data is not, the processing module encodes the first data to produce a second redundant data of the first data, determines a second redundant data of the second data based on the combined redundant data and the second redundant data of the first data, decodes the second data based on the second redundant data of the second data, and verifies the decoding of the second data.

Abstract: An elastic micro high frequency probe includes a conductor, which includes a stationary body and a movable body. The stationary body has a conductive terminal, a contacting end, and a guider. The movable body has a conductive terminal, a spring mechanism, and a guider. The spring mechanism is connected to the stationary body and to one conductive terminal. The second guider connects to the spring mechanism in such a manner that the compression direction of the spring mechanism is confined by a guiding rail. Since the width of the spring mechanism is not limited by the first and second guiders, the width of the spring mechanism can be enlarged to maximize within limited space. Therefore, the HF probe as a whole can have shortest length while acquiring the predetermined total length of the elastic stroke, such that the transmission performance of the high frequency signals can be effectively enhanced.

Abstract: A direct-docking probing device is provided. The probing device includes a probe interface board, a space transformer, a conductive elastic member, a fixing frame, and at least one vertical probe assembly. The space transformer includes a space transforming plate and a reinforcing plate, and the mechanical strength of the reinforcing plate is larger than that of the space transforming plate. The reinforcing plate is electrically connected with the space transforming plate. Furthermore, the conductive elastic member is electrically connected with the probe interface board and the reinforcing plate. The fixing frame includes a stiffener, a frame body, and a pressing portion. The stiffener is disposed on the probe interface board. The frame body contains the conductive elastic member. The pressing portion is pressed on the space transformer. The vertical probe assembly includes a plurality of vertical probes which are electrically connected with the space transforming plate.

Abstract: A maintenance apparatus and a maintenance method for a probe card are provided. The maintenance apparatus includes a first supporting member, a second supporting member, a first clamping member, a second clamping member, and a plurality of locking units. In the maintenance method, the first supporting member and the second supporting member are initially positioned underneath below the two sides of a positioning slice, respectively, and then the first clamping member and the second clamping member are each disposed on the first supporting member and the second supporting member, respectively. First clamping member and first supporting member, and second clamping member and second supporting member are secured together respectively by locking units. Thus two sides of positioning slice are secured tightly and the positioning slice is well fastened. A probe card is also provided. The probe card includes a guide slot having a size corresponding to that of maintenance apparatus.

Abstract: A decoder includes an interface and a processing module. The interface receives first data, redundant data of the first data, second data, redundant data of the second data, and combined redundant data. The processing module decodes the first data based on the redundant data of the first data, decodes the second data based on the redundant data, of the second data and verifies the decoding of the first and second data. When the first data is decoded successfully and the second data is not, the processing module encodes the first data to produce a second redundant data of the first data, determines a second redundant data of the second data based on the combined redundant data and the second redundant data of the first data, decodes the second data based on the second redundant data of the second data, and verifies the decoding of the second data.

Abstract: A notebook computer with multi-purpose hot keys comprising a platform inside which a motherboard is situated and a covering board on which a screen is situated is provided. A fast select program is stored in the motherboard. A set of multi-purpose hot keys including a number of select keys and an Enter key is situated on the platform besides an ordinary input keyboard. The hot keys can open a fast select application program and have a fast select menu displayed on the screen, wherein the select key selects and the Enter key executes the selected item. The hot keys can further cooperate with the screen brightness adjustment program, volume adjustment program, color contrast adjustment program and the suspend function so as to adjust the intensity of screen brightness, loudness of volume, ratio of color contrast and bring the computer systems into suspend status respectively.