Abstract: A resin molding includes a semiconductor element, a circuit board, and a resin. A conductor connected to the semiconductor element is formed on the circuit board. The resin is adhered and integrated with the circuit board. A resin leakage suppression layer including a material having a higher thermal conductivity than that of a material forming a surface layer of the circuit board is provided in an edge region extending along a portion adhered to the resin in the circuit board and extending along at least one-side side surface of the resin.

Abstract: In a module in which a circuit board is integrally insert molded with a housing while semiconductor parts mounted on the circuit board are exposed, deformation of the circuit board caused by pressure on the circuit board by a mold for blocking the molding resin is reduced. In the module in which the circuit board is integrally insert molded with the housing while the semiconductor parts mounted on the circuit board are exposed, the deformation of the circuit board is reduced by placing a material, which has an elastic modulus smaller than the elastic modulus of the printed circuit board, in the projection area of the mold holding portion on the circuit board.

Abstract: A resin molding includes a semiconductor element, a circuit board, and a resin. A conductor connected to the semiconductor element is formed on the circuit board. The resin is adhered and integrated with the circuit board. A resin leakage suppression layer including a material having a higher thermal conductivity than that of a material forming a surface layer of the circuit board is provided in an edge region extending along a portion adhered to the resin in the circuit board and extending along at least one-side side surface of the resin.

Abstract: The pressure of compressed air supplied to an object to be filled with air is controlled at a specified pressure or less without using a relief valve. Given that a cylinder volume (stroke volume) during a piston moves from the lower dead point to the top dead point is V1, a cylinder volume (compression volume) when the piston reaches the top dead point is V2, the atmospheric pressure is P0, and the specified pressure is PP, the compression volume V2 in the compressor system satisfies the following expression (1). The diameter D of the air intake hole of an air intake valve provided on the piston is 3 to 15 mm. 0.8×{V1×P0/(PP?P0)}=<V2<1.

Abstract: When an exposed part of a semiconductor chip is reduced in size, a tendency of development of a crack on the semiconductor chip is suppressed. A pressure of injection of a resin MR into a second space creates a gap on a contact part SEL where an elastic film LAF and a semiconductor chip CHP1 are in contact, and a resin MR2 different in constituent from the resin MR infiltrates into the gap. As a result, in an area of semiconductor chip CHP1 that is exposed from the resin MR, the resin MR2 is formed in an area other than a flow detecting unit FDU and an area around it. Hence, an area of semiconductor chip CHP1 that is exposed from the resins MR and MR2 can be reduced in size.

Abstract: A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.

Abstract: A compressor unit 1 comprises a compressor 5 and a pressure meter 6. The pressure meter 6 comprises: a tubular body 18 communicating with the surge chamber 12B, a meter-piston 19 movable in the tubular body 18 in the longitudinal direction thereof by the compressed air, and a spring 20 biasing the piston 18 toward the front end. The tubular body 18 comprises a small diameter portion 18F in which a seal ring 25 of the piston airtightly contacts with the tubular body, and a large diameter portion 18R in which a gap D is formed between the seal ring and the tubular body. The large diameter portion is connected to the small diameter portion via a step K at which the insider diameter of the tubular body 18 is abruptly changed, whereby when the compressed air reaches to a specified pressure and the seal ring of the piston is moved beyond the step K, the compressed air is discharged through the gap D.

Abstract: To obtain a physical quantity detection apparatus that can reduce the outer shape of a housing in size. A physical quantity detection apparatus 300 detects a plurality of physical quantities of gas 30 to be measured flowing in a main passage 124. The physical quantity detection apparatus 300 has a housing 302 disposed in the main passage 124, a circuit substrate 400 insert molded in the housing 302, and a plurality of detection sensors 452, 453, 454, 455, and 456 each mounted on each of one face and the other face of the circuit substrate 400.

Abstract: A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.

Abstract: A thermal type air flow meter that is capable of suppressing deformation of a base member at the time of molding is disclosed, to thereby secure dimension accuracy and reduce an influence of a dimension change on measuring accuracy. The meter includes a housing member placed in an intake passage of an internal combustion engine, and a base member fixed to the housing member and includes a secondary air passage into which part of air passing through the intake passage flows. The base member is a plate-like resin molded component formed of a synthetic resin material and includes a reinforcing structure integrally formed between a board fixing part to which a circuit board is fixed; and a secondary passage constituting part formed at a leading end part of the board fixing part, the reinforcing structure enhancing strength of the base member.

Abstract: In order to provide a method of manufacturing a thermal type flowmeter that is capable of reducing deformation of a semiconductor chip, which is caused by molding, a method of manufacturing a thermal type flowmeter is provided that includes a circuit package of a resin-molded semiconductor chip. The method includes resin-molding the semiconductor chip in a state in which a mold is pressed against a heat transfer surface that is provided on a surface of the semiconductor chip and a pressed surface that is set on the surface of the semiconductor chip at a position separate from the heat transfer surface.

Abstract: A thermal type air flow meter that is capable of suppressing deformation of a base member at the time of molding is disclosed, to thereby secure dimension accuracy and reduce an influence of a dimension change on measuring accuracy. The meter includes a housing member placed in an intake passage of an internal combustion engine, and a base member fixed to the housing member and includes a secondary air passage into which part of air passing through the intake passage flows. The base member is a plate-like resin molded component formed of a synthetic resin material and includes a reinforcing structure integrally formed between a board fixing part to which a circuit board is fixed; and a secondary passage constituting part formed at a leading end part of the board fixing part, the reinforcing structure enhancing strength of the base member.

Abstract: The purpose of the present invention is to prevent an extraction cap from getting detached under high-temperature environments while minimizing the force for attaching the extraction cap under low-temperature environments. A connecting means (7) for connecting a compressor (3) and an extraction cap (5) is composed of first and second connecting portions (7A, 7B). The first connecting portion (7A) has a hook pawl portions (28) at the tip end part of each of a pair of plate-shaped base portions (27) extending in a coupling direction from the extraction cap (5) through on both sides of an intake port portion (10), the hook pawl portions (28) having a triangular cross-sectional shape and including a locking surface (28S) projecting outwardly. The second connecting portion (7B) has an engaging surface (29S) that engages with the locking surfaces (28S).

Abstract: To obtain a thermal flow meter capable of providing thermal insulation without degrading responsiveness of a temperature detection element.

Abstract: To obtain a thermal flow meter capable of alleviating stress in an axial direction that acts on a lead according to a temperature difference between a proximal end side and a leading end portion side of a measuring portion. An air flow sensing portion 300 according to the present invention includes a bypass passage for flowing a measurement target gas 30 received from a main passage 124, and an air flow sensing portion 602 for measuring a flow rate of the measurement target gas 30 by performing heat transfer with the measurement target gas 30 flowing through the bypass passage via a heat transfer surface, and the thermal flow meter includes a circuit package 400 in which the air flow sensing portion 602 and a lead 514 are sealed by a first resin molding process and a housing 302 forming a part of the bypass passage and fixing the circuit package 400 by a second resin molding process.

Abstract: In a module in which a circuit board is integrally insert molded with a housing while semiconductor parts mounted on the circuit board are exposed, deformation of the circuit board caused by pressure on the circuit board by a mold for blocking the molding resin is reduced. In the module in which the circuit board is integrally insert molded with the housing while the semiconductor parts mounted on the circuit board are exposed, the deformation of the circuit board is reduced by placing a material, which has an elastic modulus smaller than the elastic modulus of the printed circuit board, in the projection area of the mold holding portion on the circuit board.

Abstract: To obtain a thermal flow meter capable of providing thermal insulation without degrading responsiveness of a temperature detection element.

Abstract: A technique capable of suppressing performance variation of every flow sensor and achieving performance improvement is provided. For example, in an arbitrary cross-sectional surface in parallel to a moving direction of a gas flowing on an exposed flow detecting unit FDU which is formed in a semiconductor chip CHP1, a sealing body is released from the lower mold BM by thrusting up, from a lower mold BM, an ejection pin EJPN arranged in an outer region of the semiconductor chip CHP1 so as not to overlap with the semiconductor chip CHP1 arranged in the vicinity of the center part. Thus, according to the first embodiment, the deformation applied to the sealing body at the time of mold releasing can be smaller than that in a case in which the sealing body is released from the lower mold BM by arranging the ejection pin EJPN in a region overlapping with the semiconductor chip CHP1.

Abstract: To control compressed air to a prescribed pressure without using a relief valve and a chamber and to suppress deviation of the pressure. A compressor device 2 of a puncture repair kit 1 has a pressure gauge 6. The pressure gauge 6 has a tubular body portion 18 provided in a front end portion with a communicating hole 21 communicating with a surge chamber 12B, a piston 19 movable within the tubular body portion 18 in the longitudinal direction by the compressed air from the communicating hole 21, and a spring 20 biasing the piston 19 toward the front end and changing its displacement according to the magnitude of the pressure of the compressed air. An exhaust port 25 is formed on the peripheral wall of the tubular body portion 18. The exhaust port 25 releases the compressed air when a seal ring 23 of the piston 19 exceeds the exhaust port 25.

Abstract: A thermal flow meter has a bypass passage for taking in and flowing measurement target gas flowing in a main passage, a circuit package having an air flow measurement circuit for measuring an air flow by carrying out heat transfer in relation to the measurement target gas flowing in the bypass passage, and a temperature detecting portion. A case is provided with an external terminal outputting electric signals indicating the air flow and the temperature of the measurement target gas and supports the circuit package. Resin contains the air flow measurement circuit and the temperature detecting portion. The temperature detecting portion has a protrusion which protrudes out of a circuit package main body, and the protrusion is formed into a shape which is thicker in its root than in its leading end portion and its neck portion is narrower little by little toward the leading end.