Abstract: An objective of the present invention is, in a thermal flow meter having a structure including a resin portion formed in the vicinity of a diaphragm structural portion using a mold, to prevent destruction of the diaphragm structural portion at the time of pressing the mold, in a method of manufacturing the thermal flow meter, including: supporting a gas flow measurement element 200 on support members 102b and 111, the gas flow measurement element 200 including a cavity portion 202 surrounded by a substrate inclined portion 202a inclined to a substrate surface, a diaphragm 201 that covers the cavity portion, and an electrical resistive element formed in the diaphragm 201; and covering the gas flow measurement element 200 and the support members 102b and 111 with the resin portion 104 formed with the mold, to set the mold 14 such that an acting portion of pressure force by the mold that molds the resin portion 104 is positioned outside the substrate inclined portion 202a in the entire periphery of the diaphragm

Abstract: A reaction cell for automatic biochemical analyzer in which weld generation in beam transmission parts is prevented to reduce scattering of transmitted beam, thereby having a stable transmissivity to achieve high analytical efficiency is provided. It is a reaction cell which is bottomed and has an opening formed on one end, the reaction cell comprising a tube wall including one pair of walls facing to each other and two side walls each connecting to each of the one pair of walls via a corner portion, wherein the one pair of walls each have a thickness larger than thicknesses of the corner portions, and have a uniform thickness over the entire wall, or when each wall has a maximum value in thickness in a part of the wall, the thickness monotonically decreases from the part having the maximum value to the corner portion.

Abstract: In order to provide a method of manufacturing a thermal type flowmeter that is capable of reducing deformation of a semiconductor chip, which is caused by molding, a method of manufacturing a thermal type flowmeter is provided that includes a circuit package of a resin-molded semiconductor chip. The method includes resin-molding the semiconductor chip in a state in which a mold is pressed against a heat transfer surface that is provided on a surface of the semiconductor chip and a pressed surface that is set on the surface of the semiconductor chip at a position separate from the heat transfer surface.

Abstract: By the present invention, an inner lid is easily removed by upward thrusting of a sheath tube while detachment of the inner lid during storage is suppressed. An extraction cap is provided with: a cap body provided with a barrel part, a top-end part of which attaches to a mouth of a bottle container, and an air supply tube standing from a bottom portion of the barrel part and forming a first flow channel; and a sheath tube arranged and retained around an exterior of the air supply tube so as to be able to slide up and down. An inner lid is fitted on a top-end part of the air supply tube. An annular first retaining protrusion extending in the circumferential direction is formed on an external peripheral surface of the air supply tube, and a second retaining protrusion retained by the first retaining protrusion and comprising a plurality of retaining protrusions arranged at intervals in the circumferential direction is formed on an internal peripheral surface of the inner lid.

Abstract: An extraction cap of an integrated flat tire repair kit is provided with; an air-dedicated flow passage that normally connects the inlet mouth portion for taking compressed air to the outlet mouth portion without passing through the bottle container; and a puncture repair-dedicated flow passage that is connected to the inlet mouth portion instead of the air-dedicated flow passage by switching means. The puncture repair-dedicated flow passage comprises a first flow passage portion that connects the inlet mouth portion to the inside of the bottle container and a second flow passage portion that connects the inside of the bottle container to the outlet mouth portion.

Abstract: The invention allows the relaxation of the precision of fitting the inner lid to the cap body while making removal of the inner lid more reliable. In the bottle unit of the tire puncture repair kit that has an extraction cap attached to the mouth portion of the bottle container, the extraction cap is provided with: a first flow channel for taking in compressed air from a compressor into the bottle container; a second flow channel for successively taking out the puncture repair liquid and compressed air from the bottle container; and first and second closing means for closing the first and second flow channels in the pre-coupling state. The extraction cap is provided with a release means for releasing the second closing means and opening the second flow channel when connection occurs.

Abstract: An objective of the present invention is, in a thermal flowmeter having a structure including a resin portion formed in the vicinity of a diaphragm structural portion using a mold, to prevent destruction of the diaphragm structural portion at the time of pressing the mold, in a method of manufacturing the thermal flow meter, including: supporting a gas flow measurement element 200 on support members 102b and 111, the gas flow measurement element 200 including a cavity portion 202 surrounded by a substrate inclined portion 202a inclined to a substrate surface, a diaphragm 201 that covers the cavity portion, and an electrical resistive element formed in the diaphragm 201; and covering the gas flow measurement element 200 and the support members 102b and 111 with the resin portion 104 formed with the mold, to set the mold 14 such that an acting portion of pressure force by the mold that molds the resin portion 104 is positioned outside the substrate inclined portion 202a in the entire periphery of the diaphragm

Abstract: Cap unit provided with: cap body (7) having first-flow-channel (5) for feeding compressed air from compressor (3) into bottle container (4) and second-flow-channel (6) for sequentially providing puncture repair liquid (T) and compressed air from the bottle container; and first and second closing plugs (8A, 8B) independent from one another and closing both flow channels. Cap body (7) includes boss portion (11) on which is disposed first-closing-plug securing portion (11A) permitting elastic fitting of first-closing-plug disposed. Upper opening portion (5a) of first-flow-channel opens further inward than the first-closing-plug securing portion, and the upper opening portion of second-flow-channel opens further outward than the first-closing-plug securing portion. Second-closing-plug can be moved by hand and opens second-flow-channel by means of said movement. This reduces precision requirements when fitting a cap unit while ensuring the opening and closing of a first and second path.

Abstract: Technology capable of suppressing performance variation for each flow sensor and enhancing the performance is provided. According to a flow sensor of an embodiment, a local cavity CAV is provided on an upper surface SUR (MR) of a resin MR to generate an eddying current in a counterclockwise direction, so that an advancing direction of gas (air) that collided to an exposed side surface of a semiconductor chip CHP1 can be changed to an eddying direction instead of a direction toward an upper side of the semiconductor chip CHP1 differing by 90 degrees. Therefore, according to the flow sensor of the embodiment, the flow of the gas (air) at an upper side of the flow sensing unit FDU can be stably made smooth without being disturbed, whereby a flow sensing accuracy in the flow sensing unit FDU can be enhanced.

Abstract: An extraction cap of an integrated puncture repair kit is provided with: an intake unit for taking compressed air coming from a compressor into the extraction cap; an outlet unit for taking the intaken compressed air or both compressed air and a puncture repair solution to outside the extraction cap; a dedicated air flow path that ordinarily connects to the intake unit and provides conduction from the inlet unit to the outlet unit without passing through a bottle container; a dedicated puncture repair flow path comprising a first flow path section that is connected by a switching means to the intake unit instead of the dedicated air flow path and providing conduction from the intake unit into the bottle container, and a second flow path section providing conduction from inside the bottle container to the intake unit; a first on-off valve that is interposed in the second flow path section and ordinarily closes the first flow path section; and the switching means, which is actuated by downward pressing of a bot

Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, apart of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

Abstract: When an exposed part of a semiconductor chip is reduced in size, a tendency of development of a crack on the semiconductor chip is suppressed. A pressure of injection of a resin MR into a second space creates a gap on a contact part SEL where an elastic film LAF and a semiconductor chip CHP1 are in contact, and a resin MR2 different in constituent from the resin MR infiltrates into the gap. As a result, in an area of semiconductor chip CHP1 that is exposed from the resin MR, the resin MR2 is formed in an area other than a flow detecting unit FDU and an area around it. Hence, an area of semiconductor chip CHP1 that is exposed from the resins MR and MR2 can be reduced in size.

Abstract: The invention allows the relaxation of the precision of fitting the inner lid to the cap body while making removal of the inner lid more reliable. In the bottle unit of the tire puncture repair kit that has an extraction cap attached to the mouth portion of the bottle container, the extraction cap is provided with: a first flow channel for taking in compressed air from a compressor into the bottle container; a second flow channel for successively taking out the puncture repair liquid and compressed air from the bottle container; and first and second closing means for closing the first and second flow channels in the pre-coupling state. The extraction cap is provided with a release means for releasing the second closing means and opening the second flow channel when connection occurs.

Abstract: In the present invention, a difference between a pressure displayed by a manometer of a compressor device and an actual internal pressure of a tire can be reduced. A compressor device (2) and a bottle unit (3) are directly connected. A cap (6) attached to the bottle unit (3) comprises a unidirectional valve (14) for preventing a reverse flow of a flat tire sealing agent to the side of the compressor device. A cylinder (12) of the compressor device (2) is provided with a pump chamber (11), and a surge chamber (18) which receives the compressed air from the pump chamber through an exhaust valve (16), wherein a volume (Q2) of the surge chamber (18) is 1.0 to 3.0 times of the stroke volume of a piston (10) in the pump chamber (11).

Abstract: The pressure of compressed air supplied to an object to be filled with air is controlled at a specified pressure or less without using a relief valve. Given that a cylinder volume (stroke volume) during a piston moves from the lower dead point to the top dead point is V1, a cylinder volume (compression volume) when the piston reaches the top dead point is V2, the atmospheric pressure is P0, and the specified pressure is PP, the compression volume V2 in the compressor system satisfies the following expression (1). The diameter D of the air intake hole of an air intake valve provided on the piston is 3 to 15 mm. 0.8×{V1×P0/(PP?P0)}=<V2<1.

Abstract: A thermal flow meter which has a high reliability and has a gas temperature detecting portion is obtained.

Abstract: A puncture repair kit that reduces the difference between a pressure displayed on a manometer of a compressor device and an actual tire internal pressure. The compressor device (2) is connected with a bottle unit (3) directly. A cap 6 comprises a one-way valve (14) to prevent puncture-sealing agent from flowing back toward the compressor device. A cylinder (12) of the compressor device (2) comprises a branch chamber (21) receiving compressed air from a pump chamber (11). The branch chamber (21) is connected with an air feeding passage (39) extending toward a bottle unit (3), a manometer (22), a relief valve (23), and a surge chamber (70) to store the compressed air from the pump chamber (11) and to reduce the pressure fluctuation of the compressed air.

Abstract: A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.

Abstract: To obtain a thermal flow meter capable of providing thermal insulation without degrading responsiveness of a temperature detection element.