Abstract: Technology capable of suppressing performance variation for each flow sensor and enhancing the performance is provided. According to a flow sensor of an embodiment, a local cavity CAV is provided on an upper surface SUR (MR) of a resin MR to generate an eddying current in a counterclockwise direction, so that an advancing direction of gas (air) that collided to an exposed side surface of a semiconductor chip CHP1 can be changed to an eddying direction instead of a direction toward an upper side of the semiconductor chip CHP1 differing by 90 degrees. Therefore, according to the flow sensor of the embodiment, the flow of the gas (air) at an upper side of the flow sensing unit FDU can be stably made smooth without being disturbed, whereby a flow sensing accuracy in the flow sensing unit FDU can be enhanced.

Abstract: To obtain a thermal flow meter capable of alleviating stress in an axial direction that acts on a lead according to a temperature difference between a proximal end side and a leading end portion side of a measuring portion. An air flow sensing portion 300 according to the present invention includes a bypass passage for flowing a measurement target gas 30 received from a main passage 124, and an air flow sensing portion 602 for measuring a flow rate of the measurement target gas 30 by performing heat transfer with the measurement target gas 30 flowing through the bypass passage via a heat transfer surface, and the thermal flow meter includes a circuit package 400 in which the air flow sensing portion 602 and a lead 514 are sealed by a first resin molding process and a housing 302 forming a part of the bypass passage and fixing the circuit package 400 by a second resin molding process.

Abstract: A technique capable of suppressing performance variation of every flow sensor and achieving performance improvement is provided. For example, in an arbitrary cross-sectional surface in parallel to a moving direction of a gas flowing on an exposed flow detecting unit FDU which is formed in a semiconductor chip CHP1, a sealing body is released from the lower mold BM by thrusting up, from a lower mold BM, an ejection pin EJPN arranged in an outer region of the semiconductor chip CHP1 so as not to overlap with the semiconductor chip CHP1 arranged in the vicinity of the center part. Thus, according to the first embodiment, the deformation applied to the sealing body at the time of mold releasing can be smaller than that in a case in which the sealing body is released from the lower mold BM by arranging the ejection pin EJPN in a region overlapping with the semiconductor chip CHP1.

Abstract: The present invention provides a method for analyzing growth of void of resin in a porous material which comprising the steps of inputting data of the shape of a porous material filled with a resin material, and dividing the shape of the porous material into three-dimensional solid elements; inputting physical properties of the porous material, and boundary conditions including a pressure that is applied to the porous material; obtaining a resin-density distribution in the porous material through fluid analysis using a database obtained by experimentally measuring in advance a temporal change in a volume of gas generated from the resin material and porous material during heating, changes in a compressive force and compressive displacement respectively occurring when the porous material impregnated with the resin is compressed, and a change in a flow resistance of the resin; and comprehensively grasping production, growth, and distribution of voids deriving from gas generation.

Abstract: The invention provides a flow sensor structure for sealing the surface of an electric control circuit and a part of a semiconductor device via a manufacturing method capable of preventing occurrence of flash or chip crack when clamping the semiconductor device via a mold. The invention provides a flow sensor structure comprising a semiconductor device having an air flow sensing unit and a diaphragm formed thereto, and a board or a lead frame having an electric control circuit for controlling the semiconductor device disposed thereto, wherein a surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed.

Abstract: An extraction cap of an integrated flat tire repair kit is provided with; an air-dedicated flow passage that normally connects the inlet mouth portion for taking compressed air to the outlet mouth portion without passing through the bottle container; and a puncture repair-dedicated flow passage that is connected to the inlet mouth portion instead of the air-dedicated flow passage by switching means. The puncture repair-dedicated flow passage comprises a first flow passage portion that connects the inlet mouth portion to the inside of the bottle container and a second flow passage portion that connects the inside of the bottle container to the outlet mouth portion.

Abstract: An extraction cap of an integrated puncture repair kit is provided with: an intake unit for taking compressed air coming from a compressor into the extraction cap; an outlet unit for taking the intaken compressed air or both compressed air and a puncture repair solution to outside the extraction cap; a dedicated air flow path that ordinarily connects to the intake unit and provides conduction from the inlet unit to the outlet unit without passing through a bottle container; a dedicated puncture repair flow path comprising a first flow path section that is connected by a switching means to the intake unit instead of the dedicated air flow path and providing conduction from the intake unit into the bottle container, and a second flow path section providing conduction from inside the bottle container to the intake unit; a first on-off valve that is interposed in the second flow path section and ordinarily closes the first flow path section; and the switching means, which is actuated by downward pressing of a bot

Abstract: A thermal type air flow meter that is capable of suppressing deformation of a base member at the time of molding is disclosed, to thereby secure dimension accuracy and reduce an influence of a dimension change on measuring accuracy. The meter includes a housing member placed in an intake passage of an internal combustion engine, and a base member fixed to the housing member and includes a secondary air passage into which part of air passing through the intake passage flows. The base member is a plate-like resin molded component formed of a synthetic resin material and includes a reinforcing structure integrally formed between a board fixing part to which a circuit board is fixed; and a secondary passage constituting part formed at a leading end part of the board fixing part, the reinforcing structure enhancing strength of the base member.

Abstract: A thermal type air flow meter that is capable of suppressing deformation of a base member at the time of molding is disclosed, to thereby secure dimension accuracy and reduce an influence of a dimension change on measuring accuracy. The meter includes a housing member placed in an intake passage of an internal combustion engine, and a base member fixed to the housing member and includes a secondary air passage into which part of air passing through the intake passage flows. The base member is a plate-like resin molded component formed of a synthetic resin material and includes a reinforcing structure integrally formed between a board fixing part to which a circuit board is fixed; and a secondary passage constituting part formed at a leading end part of the board fixing part, the reinforcing structure enhancing strength of the base member.

Abstract: The present invention is capable of reducing the precision requirements when fitting a cap unit while ensuring the opening and closing of a first and second path. A cap unit (1) is provided with: a cap body (7) having a first flow channel (5) for feeding the compressed air from a compressor (3) into a bottle container (4), and a second flow channel (6) for sequentially taking out a puncture repair liquid (T) and the compressed air from the bottle container (4); and first and second closing plugs (8A, 8B) which are independent from one another and which close the first and second flow channels (5, 6). The cap body (7) has a boss portion (11) on which a first closing plug securing portion (11A) permitting elastic fitting of the first closing plug (8A) is disposed.

Abstract: To reduce the amount of warping deformation of a reaction cell block for an analysis device in which reaction cells and a holder are formed integrally in a complex shape with a resin material. At least one rib is provided on the front surface or the rear surface of one or both of a reaction cell arrangement face 4 or a coupling face 5 of a reaction cell block 18, the coupling face 5 being adapted to join the reaction cell arrangement face 4 and a flange face for attachment to an analysis device, whereby rigidity is increased.

Abstract: The invention allows the relaxation of the precision of fitting the inner lid to the cap body while making removal of the inner lid more reliable. In the bottle unit of the tire puncture repair kit that has an extraction cap attached to the mouth portion of the bottle container, the extraction cap is provided with: a first flow channel for taking in compressed air from a compressor into the bottle container; a second flow channel for successively taking out the puncture repair liquid and compressed air from the bottle container; and first and second closing means for closing the first and second flow channels in the pre-coupling state. The extraction cap is provided with a release means for releasing the second closing means and opening the second flow channel when connection occurs.

Abstract: The invention allows the relaxation of the precision of fitting the inner lid to the cap body while making removal of the inner lid more reliable. In the bottle unit of the tire puncture repair kit that has an extraction cap attached to the mouth portion of the bottle container, the extraction cap is provided with: a first flow channel for taking in compressed air from a compressor into the bottle container; a second flow channel for successively taking out the puncture repair liquid and compressed air from the bottle container; and first and second closing means for closing the first and second flow channels in the pre-coupling state. The extraction cap is provided with a release means for releasing the second closing means and opening the second flow channel when connection occurs.

Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, apart of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

Abstract: In the present invention, a difference between a pressure displayed by a manometer of a compressor device and an actual internal pressure of a ti re can be reduced. A compressor device (2) and a bottle unit (3) are directly connected. A cap (6) attached to the bottle unit (3) comprises a unidirectional valve (14) for preventing a reverse flow of a flat ti re sealing agent to the side of the compressor device. A cylinder (12) of the compressor device (2) is provided with a pump chamber (11), and a surge chamber (18) which receives the compressed air from the pump chamber through an exhaust valve (16), wherein a volume (Q2) of the surge chamber (18) is 1.0 to 3.0 times of the stroke volume of a piston (10) in the pump chamber (11).

Abstract: The present method aims at preventing breakdown by selecting conditions for preventing the occurrence of voids via analysis. According to the present method, a database related to the time variation of amount of generated gas or number of moles when a solid member is heated is experimentally formulated in advance, and the amount of generated gas from the member and the specific heat ratio of gases are entered for analysis in order to predict via analysis the generation of voids within the resin material when the solid member is heated, to thereby select conditions for preventing voids.

Abstract: A puncture repair kit that reduces the difference between a pressure displayed on a manometer of a compressor device and an actual tire internal pressure. The compressor device (2) is connected with a bottle unit (3) directly. A cap 6 comprises a one-way valve (14) to prevent puncture-sealing agent from flowing back toward the compressor device. A cylinder (12) of the compressor device (2) comprises a branch chamber (21) receiving compressed air from a pump chamber (11). The branch chamber (21) is connected with an air feeding passage (39) extending toward a bottle unit (3), a manometer (22), a relief valve (23), and a surge chamber (70) to store the compressed air from the pump chamber (11) and to reduce the pressure fluctuation of the compressed air.

Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).