Patents by Inventor Tsuyoshi Miyamoto

Tsuyoshi Miyamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11267961
    Abstract: This resin composition includes: a polyolefin; carbon fibers having an average fiber length of 0.1 to 2.5 mm; a resin including at least one among an amide bond and an imide bond, the content of the resin with respect to 100 parts by mass of the polyolefin being greater than 20 parts by mass and less than or equal to 100 parts by mass; and a compatibilizer.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: March 8, 2022
    Assignee: FUJIFILM Business Innovation Corp.
    Inventors: Yuko Iwadate, Masayuki Okoshi, Hiroyuki Moriya, Tsuyoshi Miyamoto, Daisuke Nakayama
  • Publication number: 20220012230
    Abstract: A management system includes processing circuitry configured to acquire, from a device configured to store shared common definition information indicating a definition of a common list serving as a list of files and directories likely to be described in the collation information and a definition of an element attribute serving as conditions for determining elements of a list of files and directories in the collation information in an individual file management device, first common definition information corresponding to identification information of the first common definition information input to the acquisition device, compare the first common definition information acquired with the file managed to distinguish whether there is a file satisfying all the conditions of the first common definition information, and output, to the generation device, second common definition information corresponding to the file managed among the first common definition information acquired based on a distinction result.
    Type: Application
    Filed: October 16, 2019
    Publication date: January 13, 2022
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Tsuyoshi MIYAMOTO, Kazumi KINOSHITA, Yuichi KOMATSU, Kimihiro YAMAKOSHI
  • Patent number: 10647881
    Abstract: A polyimide precursor composition in which a resin and an organic amine compound are dispersed in an aqueous solvent, wherein the aqueous solvent contains 50% by weight or more of water and at least one organic solvent selected from a solvent group A consisting of a urea solvent, an amide solvent containing an alkoxy group, and an amide solvent containing an ester group in an amount of 5% by weight or more with respect to the total amount of the aqueous solvent, and the resin has a repeating unit represented by the following formula (I): wherein A indicates a tetravalent organic group, and B indicates a bivalent organic group.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: May 12, 2020
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Tomoya Sasaki, Tsuyoshi Miyamoto, Kana Miyazaki, Katsumi Nukada
  • Patent number: 10626244
    Abstract: A resin composition includes a thermoplastic resin, a carbon fiber, a polyamide having at least one of a carboxy group and an amino group at a terminal thereof, in which a presence ratio of the amino group present on the terminal (terminal amino group) is higher than a presence ratio of the carboxy group present the terminal (terminal carboxy group), and a compatibilizer.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: April 21, 2020
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Daisuke Nakayama, Tsuyoshi Miyamoto, Masayuki Okoshi, Hiroyuki Moriya
  • Patent number: 10597493
    Abstract: A polyimide precursor composition includes a solvent including water and a polyimide precursor including a group having a triple bond at a terminal thereof, which is dissolved in the solvent.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: March 24, 2020
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Kana Miyazaki, Tsuyoshi Miyamoto, Tomoya Sasaki
  • Patent number: 10546140
    Abstract: A leakage prevention apparatus stores an assumed use permission range, stores an information asset caused to be in an unavailable state by encryption, stores an information asset caused to be in an available state by decryption, and stores an information asset caused to be in a leakage-concerned state. When use of an information asset in the unavailable state is requested by an application corresponding to the use permission range, the information asset is decrypted to cause the information asset to be in the available state. When the use of the information asset in the available state by the application ends, the information asset is encrypted to cause the information asset to be in the unavailable state. When use of an information asset in the unavailable state is requested by an application not corresponding to the use permission range, the information asset is caused to be in the leakage-concerned state.
    Type: Grant
    Filed: January 14, 2016
    Date of Patent: January 28, 2020
    Assignee: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Reo Yoshida, Hitoshi Fuji, Tetsutaro Kobayashi, Junya Akiba, Tomoaki Washio, Tsuyoshi Miyamoto
  • Patent number: 10539909
    Abstract: An endless belt includes a polyamide imide resin layer in which a content of at least one solvent selected from a solvent group A consisting of a urea solvent, an alkoxy group-containing amide solvent, and an ester group-containing amide solvent is from 0.005 parts by weight to 3 parts by weight with respect to 100 parts by weight of the polyamide imide resin layer.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: January 21, 2020
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Tomoya Sasaki, Tsuyoshi Miyamoto, Kana Miyazaki, Wataru Yamada
  • Patent number: 10526486
    Abstract: A resin composition includes a thermoplastic resin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond that includes a first resin containing at least one of an amide bond and an imide bond and having such a melting temperature that a difference in melting temperature between the first resin and the thermoplastic resin is from 0° C. to 90° C. and a second resin containing at least one of an amide bond and an imide bond and having a melting temperature which is higher than that of the thermoplastic resin and that of the first resin, and a compatibilizer.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: January 7, 2020
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi Miyamoto, Daisuke Nakayama, Masayuki Okoshi, Hiroyuki Moriya
  • Publication number: 20190359821
    Abstract: The invention is directed to a resin composition containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, a resin molded article containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, and a method for preparing a resin composition including molten kneading polycarbonate, reinforced fibers and compatibilizer having a reactive cyclic group.
    Type: Application
    Filed: August 12, 2019
    Publication date: November 28, 2019
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Masayuki OKOSHI, Hiroyuki MORIYA, Tsuyoshi MIYAMOTO, Yuko IWADATE, Daisuke NAKAYAMA
  • Patent number: 10442913
    Abstract: A resin composition includes a thermoplastic resin, a carbon fiber, a polyamide having at least one of a carboxy group and an amino group at a terminal thereof, in which a presence ratio of the carboxy group present on the terminal is higher than a presence ratio of the amino group present on the terminal, and a compatibilizer.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: October 15, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Daisuke Nakayama, Tsuyoshi Miyamoto, Masayuki Okoshi, Hiroyuki Moriya
  • Patent number: 10385195
    Abstract: A resin composition for resin moldings comprises: a first resin composition containing a first polyolefin, a polyamide, carbon fibers having an average fiber length of 0.1 mm to 1 mm and a carboxylic anhydride-modified polyolefin as a compatibilizer; and a second resin composition containing a second polyolefin and organic fibers having an average fiber length of 1 mm to 20 mm, wherein, taking the total contents of the first polyolefin and the second polyolefin as 100 parts by mass, a content of the polyamide accounts for 1 part by mass to 50 parts by mass, a content of the carbon fiber accounts for 1 part by mass to 50 parts by mass, a content of the organic fibers accounts for 1 part by mass to 20 part by mass, and a content of the compatibilizer accounts for 1 part by mass to 10 parts by mass.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: August 20, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi Miyamoto, Hiroyuki Moriya, Masayuki Okoshi
  • Publication number: 20190248992
    Abstract: A resin molding including a polyolefin, a polyamide in a content of 1 part by mass to 50 parts by mass per 100 parts of the polyolefin, carbon fibers in a content of 1 part by mass to 50 parts by mass per 100 parts by mass of the polyolefin, organic fibers in a content of 1 part by mass to 20 parts by mass per 100 parts by mass of the polyolefin, and a carboxylic anhydride-modified polyolefin as a compatibilizer in a content of 1 part by mass to 10 parts by mass per 100 parts by mass of the polyolefin, where a proportion of a carbon fiber and an organic fiber each having a fiber length in a range of 1 mm to 20 mm to all the carbon fibers and the organic fibers is 1% to 20% by number.
    Type: Application
    Filed: April 24, 2019
    Publication date: August 15, 2019
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi MIYAMOTO, Hiroyuki MORIYA, Masayuki OKOSHI
  • Publication number: 20190169381
    Abstract: A resin composition containing a thermoplastic resin, carbon fibers, glass fibers, a resin containing amide bonds and/or imide bonds, and a compatibilizer.
    Type: Application
    Filed: February 4, 2019
    Publication date: June 6, 2019
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Masayuki OKOSHI, Hiroyuki MORIYA, Tsuyoshi MIYAMOTO
  • Patent number: 10301461
    Abstract: Provided is a resin composition including: a thermoplastic resin; a carbon fiber; and a terminal modified resin including a main chain having at least one terminal modified with a long chain alkyl group having 8 or more carbon atoms, the main chain containing at least one of an amide bond and an imide bond.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: May 28, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi Miyamoto, Daisuke Nakayama, Hiroyuki Moriya, Masayuki Okoshi
  • Publication number: 20190153203
    Abstract: This resin composition includes: a polyolefin; carbon fibers having an average fiber length of 0.1 to 2.5 mm; a resin including at least one among an amide bond and an imide bond, the content of the resin with respect to 100 parts by mass of the polyolefin being greater than 20 parts by mass and less than or equal to 100 parts by mass; and a compatibilizer.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Yuko IWADATE, Masayuki OKOSHI, Hiroyuki MORIYA, Tsuyoshi MIYAMOTO, Daisuke NAKAYAMA
  • Publication number: 20190153222
    Abstract: Provided is a resin composition containing a thermoplastic resin, a carbon fiber, a polyamide, and a compatibilizer. The polyamide contains: a structural unit containing an aromatic ring other than an aramid structure; and a structural unit not containing an aromatic ring. Each of the structural unit is a structural unit in which a dicarboxylic acid and a diamine are condensation-polymerized, or a structural unit that is a ring-opened lactam.
    Type: Application
    Filed: January 18, 2019
    Publication date: May 23, 2019
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi MIYAMOTO, Masayuki OKOSHI, Hiroyuki MORIYA
  • Patent number: 10221287
    Abstract: A resin composition includes a thermoplastic resin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond and having such a melting temperature that a difference in melting temperature between the resin containing at least one of an amide bond and an imide bond and the thermoplastic resin is 90° C. or lower, and a compatibilizer.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: March 5, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi Miyamoto, Daisuke Nakayama, Masayuki Okoshi, Hiroyuki Moriya
  • Patent number: 10195794
    Abstract: There is provided a method for producing a porous polyimide film, including a first step of forming a coating film containing a polyimide precursor solution where a polyimide precursor and an organic amine compound are dissolved in an aqueous solvent, and a resin particle incapable of dissolving in the polyimide precursor solution, followed by drying of the coating film to form a coat containing the polyimide precursor and the resin particle, and a second step of heating the coat to imidize the polyimide precursor and form a polyimide film, the second step including a treatment for removing the resin particle.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: February 5, 2019
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Katsumi Nukada, Tsuyoshi Miyamoto, Tomoya Sasaki, Kana Miyazaki
  • Patent number: 10100184
    Abstract: A resin composition for resin moldings includes: a first resin composition containing a first polyolefin, a polyamide, first carbon fibers having an average fiber length of 0.1 mm to 1 mm and a carboxylic anhydride-modified polyolefin as a compatibilizer; and a second resin composition containing a second polyolefin and second carbon fibers having an average fiber length of 6 mm to 20 mm, wherein of the whole quantity of the resin composition for resin moldings, taking the total contents of the first polyolefin and the second polyolefin as 100 parts by mass, a content of the polyamide accounts for 1 part by mass to 50 parts by mass, the total contents for the first carbon fiber and the second carbon fiber account for 1 part by mass to 50 parts by mass and a content of the compatibilizer accounts for 1 part by mass to 10 parts by mass.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: October 16, 2018
    Assignee: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi Miyamoto, Hiroyuki Moriya, Masayuki Okoshi
  • Publication number: 20180273738
    Abstract: A resin composition for resin moldings comprises: a first resin composition containing a first polyolefin, a polyamide, carbon fibers having an average fiber length of 0.1 mm to 1 mm and a carboxylic anhydride-modified polyolefin as a compatibilizer; and a second resin composition containing a second polyolefin and organic fibers having an average fiber length of 1 mm to 20 mm, wherein, taking the total contents of the first polyolefin and the second polyolefin as 100 parts by mass, a content of the polyamide accounts for 1 part by mass to 50 parts by mass, a content of the carbon fiber accounts for 1 part by mass to 50 parts by mass, a content of the organic fibers accounts for 1 part by mass to 20 part by mass, and a content of the compatibilizer accounts for 1 part by mass to 10 parts by mass.
    Type: Application
    Filed: July 31, 2017
    Publication date: September 27, 2018
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Tsuyoshi MIYAMOTO, Hiroyuki MORIYA, Masayuki OKOSHI