Abstract: A resin composition contains a polyolefin; 0.1 parts by mass or more and 200 parts by mass or less of carbon fibers, over 20 parts by mass and 100 parts by mass or less of polyamide, and 1 part by mass or more and 50 parts by mass or less of a compatibilizer relative to 100 parts by mass of the polyolefin; and 2 parts by mass or more and 20 parts by mass or less of a coloring agent having a polar group relative to 100 parts by mass of the carbon fibers.

Abstract: A resin composition for resin moldings includes: a first resin composition containing a first polyolefin, a polyamide, first carbon fibers having an average fiber length of 0.1 mm to 1 mm and a carboxylic anhydride-modified polyolefin as a compatibilizer; and a second resin composition containing a second polyolefin and second carbon fibers having an average fiber length of 6 mm to 20 mm, wherein of the whole quantity of the resin composition for resin moldings, taking the total contents of the first polyolefin and the second polyolefin as 100 parts by mass, a content of the polyamide accounts for 1 part by mass to 50 parts by mass, the total contents for the first carbon fiber and the second carbon fiber account for 1 part by mass to 50 parts by mass and a content of the compatibilizer accounts for 1 part by mass to 10 parts by mass.

Abstract: A resin composition contains: polyolefin; a carbon fiber; a resin containing at least one of an amide bond and an imide bond; and a compatibilizer, the resin containing at least one of an amide bond and an imide bond forms a coating layer around the carbon fiber, and a thickness of the coating layer is from 50 nm to 700 nm.

Abstract: A polyimide precursor composition includes a solvent including water and a polyimide precursor including a group having a triple bond at a terminal thereof, which is dissolved in the solvent.

Abstract: An intermediate for a resin molded article includes a curable epoxy resin, a reinforcing fiber, and a resin including at least one of an amide bond and an imide bond.

Abstract: A resin composition includes a thermoplastic resin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond and having such a melting temperature that a difference in melting temperature between the resin containing at least one of an amide bond and an imide bond and the thermoplastic resin is 90° C. or lower, and a compatibilizer.

Abstract: A resin composition includes a thermoplastic resin, a carbon fiber, a resin containing at least one of an amide bond and an imide bond that includes a first resin containing at least one of an amide bond and an imide bond and having such a melting temperature that a difference in melting temperature between the first resin and the thermoplastic resin is from 0° C. to 90° C. and a second resin containing at least one of an amide bond and an imide bond and having a melting temperature which is higher than that of the thermoplastic resin and that of the first resin, and a compatibilizer.

Abstract: Provided is a resin composition including: a thermoplastic resin; a carbon fiber; and a terminal modified resin including a main chain having at least one terminal modified with a long chain alkyl group having 8 or more carbon atoms, the main chain containing at least one of an amide bond and an imide bond.

Abstract: A resin composition includes a thermoplastic resin, a carbon fiber, a polyamide having at least one of a carboxy group and an amino group at a terminal thereof, in which a presence ratio of the amino group present on the terminal (terminal amino group) is higher than a presence ratio of the carboxy group present the terminal (terminal carboxy group), and a compatibilizer.

Abstract: A resin composition includes a thermoplastic resin, a carbon fiber, a polyamide having at least one of a carboxy group and an amino group at a terminal thereof, in which a presence ratio of the carboxy group present on the terminal is higher than a presence ratio of the amino group present on the terminal, and a compatibilizer.

Abstract: A polyimide precursor composition includes a solvent mixture containing an alcohol solvent and a water-insoluble solvent that is at least one selected from the solvent group consisting of water-insoluble ketones and water-insoluble ethers; and a polyimide precursor dissolved in the solvent mixture.

Abstract: An endless belt includes a polyimide resin layer in which a content of at least one solvent selected from a solvent group A consisting of a urea solvent, an alkoxy group-containing amide solvent, and an ester group-containing amide solvent is from 50 ppm to 2,000 ppm.

Abstract: An assumed use permission range storage stores a predetermined assumed use permission range. An unavailable state storage stores an information asset in an unavailable state by encryption. An available state storage stores an information asset in an available state by decryption. A leakage-concerned state storage stores an information asset in a leakage-concerned state. When use of an information asset in the unavailable state is requested by an application corresponding to the assumed use permission range, a state changing part decrypts the information asset into the available state. When use of the information asset in the available state by the application ends, the state changing part encrypts the information asset into the unavailable state. When use of an information asset in the unavailable state is requested by an application not corresponding to the assumed use permission range, a state monitoring part puts the information asset in the leakage-concerned state.

Abstract: An endless belt includes a polyimide resin layer in which a content of at least one solvent selected from a solvent group A consisting of a urea solvent, an alkoxy group-containing amide solvent, and an ester group-containing amide solvent is from 50 ppm to 2,000 ppm.

Abstract: An endless belt includes a polyamide imide resin layer in which a content of at least one solvent selected from a solvent group A consisting of a urea solvent, an alkoxy group-containing amide solvent, and an ester group-containing amide solvent is from 0.005 parts by weight to 3 parts by weight with respect to 100 parts by weight of the polyamide imide resin layer.

Abstract: A polyimide precursor composition includes a mixed solvent and a polyimide precursor dissolved in the mixed solvent, and the mixed solvent contains at least one organic solvent A and at least one organic solvent B, wherein the organic solvent A is selected from the group consisting of an aprotic polar solvent which contains a nitrogen atom and a lactone solvent, and the organic solvent B is selected from the group consisting of a non-aqueous solvent which has a carbonyl structure.

Abstract: The invention is directed to a resin composition containing a styrene-based resin, reinforced fibers and a compatibilizer having a reactive cyclic group, a resin molded article containing a styrene-based resin, reinforced fibers and a compatibilizer having a reactive cyclic group, and a method for preparing the resin composition including: melting and kneading styrene-based resin, reinforced fibers, and compatibilizer having a reactive cyclic group

Abstract: The invention is directed to a resin composition containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, a resin molded article containing polycarbonate, reinforced fibers and a compatibilizer having a reactive cyclic group, and a method for preparing a resin composition including molten kneading polycarbonate, reinforced fibers and compatibilizer having a reactive cyclic group.

Abstract: There is provided a method for producing a porous polyimide film, including a first step of forming a coating film containing a polyimide precursor solution where a polyimide precursor and an organic amine compound are dissolved in an aqueous solvent, and a resin particle incapable of dissolving in the polyimide precursor solution, followed by drying of the coating film to form a coat containing the polyimide precursor and the resin particle, and a second step of heating the coat to imidize the polyimide precursor and form a polyimide film, the second step including a treatment for removing the resin particle.

Abstract: A polyimide precursor composition includes a solvent mixture containing an alcohol solvent and a water-insoluble solvent that is at least one selected from the solvent group consisting of water-insoluble ketones and water-insoluble ethers; and a polyimide precursor dissolved in the solvent mixture.