Patents by Inventor Tsuyoshi Takahashi

Tsuyoshi Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10314363
    Abstract: Provided is an insole capable of supporting a foot in a well-balanced manner. An insole 1 for a shoe is configured to include a calcaneal anterior-part support protrusion 90 for supporting a calcaneal anterior part 12A from a sole.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: June 11, 2019
    Assignee: BMZ. Inc
    Inventors: Tsuyoshi Takahashi, Kimihiko Kanazawa, Shigeki Takahashi, Takeo Sayama, Norihisa Okumura, Shouta Kaneko, Yuichi Takata
  • Publication number: 20190152121
    Abstract: Provided is a blow molding machine including an injection molding unit and a blow molding unit, wherein the injection molding unit includes a preform mold and an injection device configured to supply resin to the preform mold, wherein the injection device is fixed to a support plate, and wherein the support plate includes a position adjustment mechanism capable of adjusting a position of the injection device in an upper and lower direction with respect to the preform mold.
    Type: Application
    Filed: June 27, 2017
    Publication date: May 23, 2019
    Applicant: NISSEI ASB MACHINE CO., LTD.
    Inventors: Hiroshi HORIGOME, Tsuyoshi TAKAHASHI
  • Publication number: 20190143205
    Abstract: A game system configured to change game control and change control of perceived vibration to be fed back to a player via a first controller and a second controller, between a mounted state in which the first controller and the second controller are mounted to a gaming console and an unmounted state in which the first controller and the second controller are detached from the gaming console.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 16, 2019
    Applicants: BANDAI NAMCO Entertainment Inc., BANDAI NAMCO Studios Inc.
    Inventors: Tsuyoshi TAKAHASHI, Toru TAKAHASHI
  • Patent number: 10134889
    Abstract: A disclosed compound semiconductor device includes a substrate, a channel layer formed over the substrate, an electron supply layer famed on the channel layer, a first cap layer and a second cap layer formed at a distance from each other on the electron supply layer, a source electrode formed on the first cap layer, a drain electrode formed on the second cap layer, and a gate electrode formed on the electron supply layer between the first cap layer and the second cap layer. Each of the first cap layer and the second cap layer is a stacked film formed by alternately stacking i-type first compound semiconductor layers and n-type second compound semiconductor layers having a wider bandgap than the first compound semiconductor layers.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: November 20, 2018
    Assignee: Fujitsu Limited
    Inventor: Tsuyoshi Takahashi
  • Patent number: 10118313
    Abstract: This invention generally relates to a mixing at least one material with at least one other material within an in-line mixing device. In one example embodiment methods, apparatuses, and systems are described to treat, reuse or otherwise remediate dredged or raw material from bottom sediment or other sources through the mixture of raw material and another material such as a hardening agent into a homogenous material for contamination remediation, use as construction materials or other uses.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: November 6, 2018
    Assignee: JAFEC USA, Inc.
    Inventors: Shigeru Takeshima, Tsuyoshi Takahashi
  • Patent number: 10118328
    Abstract: A forming mold (311) is configured to include: a pair of split mold bodies (312) in which an intermediate molded product (61) is accommodated; a pair of handle holding split molds (312) provided in the split mold bodies (315) so as to be slidable in a direction orthogonal to the opening and closing direction of the split mold bodies, and sandwiching a handle (30) therebetween; and driving means (313) connected to the handle holding split molds (312) for sliding the handle holding split molds individually.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: November 6, 2018
    Assignee: NISSI ASB MACHINE CO., LTD.
    Inventors: Tsuyoshi Takahashi, Yuji Sakabe
  • Publication number: 20180311700
    Abstract: A step of constantly supplying first and second carrier gases into a processing container having a substrate therein through first and second carrier gas flow paths, respectively, and supplying a source gas into the processing container through a source gas flow path, a step of purging the source gas by supplying a purge gas into the processing container through a purge gas flow path provided separately from the carrier gas, a step of supplying a reactant gas into the processing container through a reactant gas flow path, and a step of purging the reactant gas by supplying a purge gas into the processing container through the purge gas flow path are performed in a predetermined cycle. An additive gas having a predetermined function is supplied as at least a part of the purge gas in at least one of the purging steps.
    Type: Application
    Filed: April 24, 2018
    Publication date: November 1, 2018
    Inventors: Hiroaki Ashizawa, Yasushi Fujii, Tsuyoshi Takahashi, Seokhyoung Hong, Kazuyoshi Yamazaki, Hideo Nakamura, Yu Nunoshige, Takashi Kamio
  • Patent number: 10030346
    Abstract: The system, method and apparatus described relates generally to a method of Direct Power Compaction (DPC). In one example embodiment to methods, apparatus, and systems to compact loose ground by vibration and compaction of H piles driven by vibrators or drivers (vibro-hammer). The DPC method is an efficient and highly economical technique for densifying loose soils. In the procedure piles, with an innovative H pattern structure, are driven in the ground using a combination of downward and vibratory force to move particles of the loose or sandy soil closer together and reduce the voids between them. Subsequent backfilling and vibration at the H-pile sites achieves the highest density possible and provides for an improvement ground soil structure and load bearing capacity.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: July 24, 2018
    Assignee: JAFEC USA, Inc.
    Inventors: Shigeru Takeshima, Tsuyoshi Takahashi
  • Patent number: 9977369
    Abstract: A developer conveying apparatus for conveying a developer that develops an electrostatic latent image includes a rotation unit which rotates around a rotation shaft extending in an axial direction and parallel to a developer conveying direction, a first developer conveying portion which is provided in the rotation unit and which has an opening configured to convey the developer in a first axial direction of the rotation shaft, and a second developer conveying portion which is provided in the rotation unit and which has an opening configured to convey the developer in a second axial direction opposite to the first axial direction. A distance from the rotation shaft to the opening in the first developer conveying portion is different than a distance from the rotation shaft to the opening in the second developer conveying portion.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: May 22, 2018
    Assignee: CANON FINETECH NISCA INC.
    Inventors: Hideo Nagura, Chihiro Tanaka, Masashi Wakisaka, Naoki Tamaru, Ryo Nakajima, Tsuyoshi Takahashi
  • Publication number: 20180112312
    Abstract: Disclosed is a film forming apparatus that forms a TiN film on a wafer by an ALD method. The film forming apparatus includes a chamber configured to accommodate the wafer, a gas supply mechanism configured to supply a titanium raw material gas including a TiCl4 gas, a nitriding gas including a NH3 gas, and a purge gas into the chamber, an exhaust mechanism configured to evacuate the inside of the chamber, and a controller configured to control the gas supply mechanism such that the TiCl4 gas and the NH3 gas are alternately supplied into the wafer. The gas supply mechanism has an NH3 gas heating unit configured to heat the NH3 gas to change a state of the NH3 gas and supplies the NH3 gas, the state of which is changed by the NH3 gas heating unit, into the chamber.
    Type: Application
    Filed: October 16, 2017
    Publication date: April 26, 2018
    Inventors: Masaya ODAGIRI, Hirotaka KUWADA, Hiroki EHARA, Yukihiro TAMEGAI, Tsuyoshi TAKAHASHI, Hideo NAKAMURA, Kazuyoshi YAMAZAKI, Yoshikazu IDENO
  • Publication number: 20180061973
    Abstract: A disclosed compound semiconductor device includes a substrate, a channel layer formed over the substrate, an electron supply layer formed on the channel layer, a first cap layer and a second cap layer formed at a distance from each other on the electron supply layer, a source electrode formed on the first cap layer, a drain electrode formed on the second cap layer, and a gate electrode formed on the electron supply layer between the first cap layer and the second cap layer. Each of the first cap layer and the second cap layer is a stacked film formed by alternately stacking i-type first compound semiconductor layers and n-type second compound semiconductor layers having a wider bandgap than the first compound semiconductor layers.
    Type: Application
    Filed: July 17, 2017
    Publication date: March 1, 2018
    Applicant: FUJITSU LIMITED
    Inventor: Tsuyoshi Takahashi
  • Publication number: 20180037989
    Abstract: A metal-containing film can be formed with high continuity with respect to a base when forming the metal-containing film on the base by CVD or ALD. A film forming method of forming, by ALD or CVD, a Ti-containing film on a base film of a processing target object having a SiO2 film as the base film includes performing a surface processing of accelerating formation of a silanol group on a surface of the SiO2 film by bringing a fluid containing O and H into contact with the surface of the SiO2 film; and performing a film forming processing of forming the Ti-containing film on the SiO2 film, on which the surface processing is performed, by the ALD or the CVD with a Ti source gas which reacts with the silanol group.
    Type: Application
    Filed: August 3, 2017
    Publication date: February 8, 2018
    Inventors: Miyako Kaneko, Naotaka Noro, Tsuyoshi Takahashi, Kazuyoshi Yamazaki
  • Patent number: 9884445
    Abstract: A preform heating apparatus has cover members 164 provided to close upper parts of two transport lines arranged in parallel, heating units 162 each having heaters 166 for heating preforms 200, and a first supply section for supplying cooling air into the cover members 164. The heating units 162 are each provided within each cover member 164 on a side between the transport lines. The first supply section introduces cooling air from air delivery spaces 169 provided between the transport lines into the cover members 164 through gaps between the heaters 166 to supply the cooling air toward the preforms 200.
    Type: Grant
    Filed: June 26, 2014
    Date of Patent: February 6, 2018
    Assignee: NISSEI ASB MACHINE CO., LTD.
    Inventors: Tsuyoshi Takahashi, Shuichi Ogihara
  • Patent number: 9833712
    Abstract: A game system includes a game processing section that performs a process that implements a game, a data link processing section that determines that a data link activation condition has been satisfied when a data link start positional relationship has been established between a moving object and another moving object, and performs a process that produces a data link effect that changes at least one of the radar-related capability of the moving object and the performance of the moving object, and a display processing section that performs a display process that displays a display object that notifies a player of information about a data link. The data link processing section performs a process that prohibits production of the data link effect during at least one of a given first period after the game has started, and a given second period after production of the data link effect has been canceled.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: December 5, 2017
    Assignee: BANDAI NAMCO ENTERTAINMENT INC.
    Inventors: Jun Tamaoki, Makoto Yonezawa, Masayoshi Noda, Tsuyoshi Takahashi
  • Publication number: 20170275841
    Abstract: The system, method and apparatus described relates generally to a method of Direct Power Compaction (DPC). In one example embodiment to methods, apparatus, and systems to compact loose ground by vibration and compaction of H piles driven by vibrators or drivers (vibro-hammer). The DPC method is an efficient and highly economical technique for densifying loose soils. In the procedure piles, with an innovative H pattern structure, are driven in the ground using a combination of downward and vibratory force to move particles of the loose or sandy soil closer together and reduce the voids between them. Subsequent backfilling and vibration at the H-pile sites achieves the highest density possible and provides for an improvement ground soil structure and load bearing capacity.
    Type: Application
    Filed: June 12, 2017
    Publication date: September 28, 2017
    Inventors: Shigeru Takeshima, Tsuyoshi Takahashi
  • Patent number: 9702108
    Abstract: The system, method and apparatus described relates generally to a method of Direct Power Compaction (DPC). In one example embodiment to methods, apparatus, and systems to compact loose ground by vibration and compaction of H piles driven by vibrators or drivers (vibro-hammer). The DPC method is an efficient and highly economical technique for densifying loose soils. In the procedure piles, with an innovative H pattern structure, are driven in the ground using a combination of downward and vibratory force to move particles of the loose or sandy soil closer together and reduce the voids between them. Subsequent backfilling and vibration at the H-pile sites achieves the highest density possible and provides for an improvement ground soil structure and load bearing capacity.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: July 11, 2017
    Assignee: JAFEC USA, Inc.
    Inventors: Shigeru Takeshima, Tsuyoshi Takahashi
  • Publication number: 20170136678
    Abstract: A forming mold (311) is configured to include: a pair of split mold bodies (312) in which an intermediate molded product (61) is accommodated; a pair of handle holding split molds (312) provided in the split mold bodies (315) so as to be slidable in a direction orthogonal to the opening and closing direction of the split mold bodies, and sandwiching a handle (30) therebetween; and driving means (313) connected to the handle holding split molds (312) for sliding the handle holding split molds individually.
    Type: Application
    Filed: March 26, 2015
    Publication date: May 18, 2017
    Applicant: NISSEI ASB MACHINE CO., LTD.
    Inventors: Tsuyoshi TAKAHASHI, Yuji SAKABE
  • Publication number: 20170021528
    Abstract: This invention generally relates to a mixing at least one material with at least one other material within an in-line mixing device. In one example embodiment methods, apparatuses, and systems are described to treat, reuse or otherwise remediate dredged or raw material from bottom sediment or other sources through the mixture of raw material and another material such as a hardening agent into a homogenous material for contamination remediation, use as construction materials or other uses.
    Type: Application
    Filed: July 20, 2016
    Publication date: January 26, 2017
    Inventors: Shigeru Takeshima, Tsuyoshi Takahashi
  • Publication number: 20160368197
    Abstract: A preform heating apparatus has cover members 164 provided to close upper parts of two transport lines arranged in parallel, heating units 162 each having heaters 166 for heating preforms 200, and a first supply section for supplying cooling air into the cover members 164. The heating units 162 are each provided within each cover member 164 on a side between the transport lines. The first supply section introduces cooling air from air delivery spaces 169 provided between the transport lines into the cover members 164 through gaps between the heaters 166 to supply the cooling air toward the preforms 200.
    Type: Application
    Filed: June 26, 2014
    Publication date: December 22, 2016
    Applicant: NISSEI ASB MACHINE CO., LTD.
    Inventors: Tsuyoshi TAKAHASHI, Shuichi Ogihara
  • Patent number: D775802
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: January 10, 2017
    Inventor: Tsuyoshi Takahashi