Patents by Inventor Tue Nguyen

Tue Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7087522
    Abstract: A multilayer copper structure has been provided for improving the adhesion of copper to a diffusion barrier material, such as TiN, in an integrated circuit substrate. The multilayer copper structure comprises a thin high-resistive copper layer to provide improved adhesion to the underlying diffusion barrier layer, and a low-resistive copper layer to carry the electrical current with minimum electrical resistance. The invention also provides a method to form the multilayer copper structure.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: August 8, 2006
    Assignee: Tegal Corporation
    Inventor: Tue Nguyen
  • Patent number: 7074278
    Abstract: A semiconductor processing system includes a chamber adapted to process a wafer, the chamber having an opening to facilitate access to the interior of the chamber. The system has a lid coupled to the chamber opening, the lid having an open position and a closed position. An actuator is connected to the lid to move the lid between the closed position and the open position. The system may include a floating pivot coupled to the lid and the actuator to align the lid with the opening when the lid closes.
    Type: Grant
    Filed: July 10, 2003
    Date of Patent: July 11, 2006
    Assignee: Tegal Corporation
    Inventors: Tue Nguyen, Craig Alan Bercaw
  • Publication number: 20060131363
    Abstract: A high pressure trapping system is provided to collect chemical vapor by-products in successive stages through chemical reasons conducted at progressively colder temperatures. A hot trap receives chemical vapor exhaust and collects a first waste, typically a solid, as a result of the high temperature completing a chemical reason in the vapor. Surviving gaseous by-products continue to the next process. The following chamber is colder, and collects waste as a solid or a liquid as a result of a chemical process dependent on the cold temperature. Sometimes a third chamber is used for even a colder chemical reaction to collect waste products. As a solid, these waste products are easier to collect, remove, and even reuse.
    Type: Application
    Filed: December 27, 2005
    Publication date: June 22, 2006
    Applicant: Tegal Corporation
    Inventor: Tue Nguyen
  • Patent number: 7049549
    Abstract: A deposition shield partially covering a substrate and having two zones of different thermal properties can provide minimal deposition on the shield together with minimal heat loss due to substrate contact. A zone of low thermal transmittivity is contact shielding the substrate, and due to the low thermal transmittivity property, there is minimal heat loss of the heated substrate, resulting in a more uniform temperature profile and a more uniform film deposition. A zone of high thermal transmittivity is in the rest of the shield, allowing thermal energy from the heated substrate to transmit through, resulting in a cooler shield and minimal deposition on the shield.
    Type: Grant
    Filed: July 20, 2004
    Date of Patent: May 23, 2006
    Assignee: Tegal Corporation
    Inventors: Tue Nguyen, Craig Alan Bercaw
  • Publication number: 20060046412
    Abstract: An apparatus and method for sequential and isolated processing of a workpiece comprises a two compartment chamber and a mechanism to transfer the workpiece from a fist compartment to a second compartment by rotating the workpiece on a workpiece mover through an internal pathway. The transfer mechanism comprises two doors coupled to the workpiece mover to seal the internal pathway between the first and second compartments so that the two compartments are isolated and the workpiece can be processed sequentially and in isolation. The apparatus further comprises components to enable the processing of a workpiece. The preferred method of processing a workpiece is to deposit or adsorb a thin layer in the first compartment and then transfer by rotating the workpiece on the workpiece mover to the second compartment for further processing.
    Type: Application
    Filed: May 26, 2005
    Publication date: March 2, 2006
    Applicant: Tegal Corporation
    Inventors: Tue Nguyen, Tai Nguyen
  • Publication number: 20060040055
    Abstract: An apparatus and method for sequential and isolated processing of a workpiece comprises a two compartment chamber and a mechanism to transfer the workpiece from a fist compartment to a second compartment by rotating the workpiece on a workpiece mover through an internal pathway. The transfer mechanism comprises two doors coupled to the workpiece mover to seal the internal pathway between the first and second compartments so that the two compartments are isolated and the workpiece can be processed sequentially and in isolation. The apparatus further comprises components to enable the processing of a workpiece. The preferred method of processing a workpiece is to deposit or adsorb a thin layer in the first compartment and then transfer by rotating the workpiece on the workpiece mover to the second compartment for further processing.
    Type: Application
    Filed: June 23, 2005
    Publication date: February 23, 2006
    Applicant: Tegal Corporation
    Inventors: Tue Nguyen, Tai Nguyen
  • Patent number: 6998097
    Abstract: A high pressure trapping system is provided to collect chemical vapor by-products in successive stages through chemical reactions conducted at progressively colder temperatures. A hot trap receives chemical vapor exhaust and collects a first waste, typically a solid, as a result of the high temperature completing a chemical reaction in the vapor. Surviving gaseous by-products continue to the next process. The following chamber is colder, and collects waste as a solid or a liquid as a result of a chemical process dependent on the cold temperature. Sometimes a third chamber is used for even a colder chemical reaction to collect waste products. As a solid, these waste products are easier to collect, remove, and even reuse.
    Type: Grant
    Filed: June 7, 2000
    Date of Patent: February 14, 2006
    Assignee: Tegal Corporation
    Inventor: Tue Nguyen
  • Publication number: 20050257742
    Abstract: A replaceable shielding apparatus provides a cost effective way of shielding a portion of a workpiece during processing. The apparatus includes a replaceable shield, made of comparable weight as the workpiece for allowing replacement of the shield in the same way as the replacement of the workpiece. With this feature, the replacement of the shield is a routine process and would not interfere much with the workpiece operation. The invention further includes a shield clamp for clamping the shield onto the workpiece. In a preferred embodiment, the invention further includes a non-reactive gas inlet for creating a pressurized cavity in the vicinity of the shielded portion of the workpiece.
    Type: Application
    Filed: August 7, 2003
    Publication date: November 24, 2005
    Inventor: Tue Nguyen
  • Patent number: 6946178
    Abstract: This invention discloses a releasable adhesion layer having good adhesion during high temperature fabrication process in the absence of light, and delaminating at a lower temperature in the presence of light. One embodiment of this invention is a film of polymer whose thermal decomposition temperature changes drastically upon photoexposure. These materials, prior to photoexposure, can withstand temperatures in the range of approximately 200° C. to 300° C. without decomposition, yet decompose at around 100° C. with photoexposure. The releasable adhesion layer can be used in a thermal transfer element, sandwiching a donor substrate and a transfer layer having a plurality of multicomponent transfer units. In the absence of light, the releasable adhesion layer can sustain high temperature processing of these multicomponent transfer units. By photoexposing according to a pattern, the photoexposed multicomponent transfer units can be selectively released at a low temperature to transfer to a receptor.
    Type: Grant
    Filed: May 23, 2003
    Date of Patent: September 20, 2005
    Inventors: James Sheats, Tue Nguyen
  • Patent number: 6921555
    Abstract: An apparatus and method for sequential and isolated processing of a workpiece comprises a two compartment chamber and a mechanism to transfer the workpiece from a first compartment to a second compartment by rotating the workpiece on a workpiece mover through an internal pathway. The transfer mechanism comprises two doors coupled to the workpiece mover to seal the internal pathway between the first and second compartments so that the two compartments are isolated and the workpiece can be processed sequentially and in isolation. The apparatus further comprises components to enable the processing of a workpiece. The preferred method of processing a workpiece is to deposit or adsorb a thin layer in the first compartment and then transfer by rotating the workpiece on the workpiece mover to the second compartment for further processing.
    Type: Grant
    Filed: August 6, 2002
    Date of Patent: July 26, 2005
    Assignee: Tegal Corporation
    Inventors: Tue Nguyen, Tai Dung Nguyen, Craig Alan Bercaw
  • Patent number: 6919101
    Abstract: A method for improving the adhesion of an impermeable film on a porous low-k dielectric film in an interconnect structure is disclosed. The method provides an in-situ annealing step before the deposition of the impermeable film to release the volatile trapped molecules such as water, alcohol, HCl, and HF vapor, inside the pores of the porous low-k dielectric film. The method also provides an in-situ deposition step of the impermeable film right after the deposition of the porous low dielectric film without exposure to an atmosphere containing trappable molecules. The method further provides an in-situ deposition step of the impermeable film right after the removal a portion of the porous low-k dielectric film without exposure to an atmosphere containing trappable molecules. By the removal of all trapped molecules inside the porous low-k dielectric film, the adhesion between the deposited impermeable film and the low-k dielectric film is improved.
    Type: Grant
    Filed: February 4, 2003
    Date of Patent: July 19, 2005
    Assignee: Tegal Corporation
    Inventors: Zhihong Zhang, Tai Dung Nguyen, Tue Nguyen
  • Publication number: 20050084619
    Abstract: A method for improving the adhesion of an impermeable film on a porous low-k dielectric film in an interconnect structure is disclosed. The method provides an in-situ annealing step before the deposition of the impermeable film to release the volatile trapped molecules such as water, alcohol, HCl, and HF vapor, inside the pores of the porous low-k dielectric film. The method also provides an in-situ deposition step of the impermeable film right after the deposition of the porous low dielectric film without exposure to an atmosphere containing trappable molecules. The method further provides an in-situ deposition step of the impermeable film right after the removal a portion of the porous low-k dielectric film without exposure to an atmosphere containing trappable molecules. By the removal of all trapped molecules inside the porous low-k dielectric film, the adhesion between the deposited impermeable film and the low-k dielectric film is improved.
    Type: Application
    Filed: October 12, 2004
    Publication date: April 21, 2005
    Applicant: TEGAL CORPORATION
    Inventors: Zhihong Zhang, Tai Nguyen, Tue Nguyen
  • Patent number: 6859262
    Abstract: A system delivers radiation to a substrate with a radiation source to generate radiation having a source intensity distribution pattern; and a redistribution radiation guide adapted to receive the radiation from the radiation source and to direct the radiation from one region to different regions on the substrate so that the substrate intensity distribution pattern is different from the source pattern.
    Type: Grant
    Filed: December 6, 2000
    Date of Patent: February 22, 2005
    Assignee: Tegal Corporation
    Inventor: Tue Nguyen
  • Patent number: 6858085
    Abstract: An apparatus for sequential and isolated processing of a workpiece comprises a two compartment chamber and a mechanism to transfer the workpiece from one compartment to the other compartment. The transfer mechanism comprises two doors that seal the pathway between the two compartments between movement so that the two compartments are isolated and the workpiece can be processed sequentially and isolatedly in each compartment. The apparatus further comprises components to enable the processing of a workpiece: a delivery system to delivery precursor, a plasma source to generate a plasma and a vacuum pump to maintain a sub-atmospheric pressure. The preferred method of processing a workpiece is to deposit or adsorb a thin layer in the first compartment and then to transfer the workpiece to the second compartment for a reaction or a plasma reaction on the existing thin layer.
    Type: Grant
    Filed: August 6, 2002
    Date of Patent: February 22, 2005
    Assignee: Tegal Corporation
    Inventors: Tue Nguyen, Tai Dung Nguyen, Craig Alan Bercaw
  • Publication number: 20050037597
    Abstract: Systems and methods are disclosed to perform semiconductor processing with a process chamber; a flash lamp adapted to be repetitively triggered; and a controller coupled to the control input of the flash lamp to trigger the flash lamp. The system can deploy a solid state plasma source in parallel with the flash lamp in wafer processing.
    Type: Application
    Filed: April 1, 2003
    Publication date: February 17, 2005
    Inventors: Tue Nguyen, Tai Nguyen, Craig Bercaw
  • Patent number: 6844527
    Abstract: A multi-thermal zone shielding apparatus provides a multi-zone temperature profile for the shield while shielding a portion of a hot workpiece in a high temperature processing system. The apparatus keeps the workpiece temperature hot at the shielded area and maintains the rest of the shield at a lower temperature. The apparatus includes a multi-thermal zone shield having a low thermal transmissivity section for preventing heat loss from the shielded portion of the hot workpiece due to less thermal energy being transmitted through the shielding portion of the shield, thus maintaining a more uniform temperature at the shielded portion of the workpiece, and a high thermal transmissivity section in the rest of shield for allowing more thermal energy from the hot workpiece to be transmitted through the shield without heating the shield, thus maintaining a lower temperature at the portion of the shield that is not engaged with the workpiece.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: January 18, 2005
    Assignee: Tegal Corporation
    Inventors: Tue Nguyen, Craig Alan Bercaw
  • Publication number: 20050005855
    Abstract: A process system and a deposition method for depositing a highly controlled layered film on a workpiece is disclosed. The basic component of the apparatus is a pulsing plasma source that is capable of either exciting or not-exciting a first precursor. The pulsing plasma source includes an energy source to generate a plasma, and a plasma adjusting system to cause the plasma to either excite or not-excite a precursor. The precursor could flow continuously (an aspect totally new to ALD), or intermittently (or pulsing, standard ALD operation process). The deposition method includes the steps of pulsing the plasma to excite/not-excite the precursors and the ambient to deposit and modify the deposited layers. This procedure then can be repeated until the film reaches the desired thickness.
    Type: Application
    Filed: August 10, 2004
    Publication date: January 13, 2005
    Inventor: Tue Nguyen
  • Publication number: 20040261722
    Abstract: A multi-thermal zone shielding apparatus provides a multi-zone temperature profile for the shield while shielding a portion of a hot workpiece in a high temperature processing system. The apparatus keeps the workpiece temperature hot at the shielded area and maintains the rest of the shield at a lower temperature. The apparatus includes a multi-thermal zone shield having a low thermal transmissivity section for preventing heat loss from the shielded portion of the hot workpiece due to less thermal energy being transmitted through the shielding portion of the shield, thus maintaining a more uniform temperature at the shielded portion of the workpiece, and a high thermal transmissivity section in the rest of shield for allowing more thermal energy from the hot workpiece to be transmitted through the shield without heating the shield, thus maintaining a lower temperature at the portion of the shield that is not engaged with the workpiece.
    Type: Application
    Filed: July 20, 2004
    Publication date: December 30, 2004
    Applicant: TEGAL CORPORATION
    Inventors: Tue Nguyen, Craig Alan Bercaw
  • Publication number: 20040251308
    Abstract: A dual format medium can receive and store information in two formats, a printed text format and an electronic format for machine recognition. The dual format medium includes a printable surface for showing the text in a visual format and a data storage section for receiving and storing essentially the same information in an electronic format. The dual format medium allows the rapid and accurate processing of information transfer.
    Type: Application
    Filed: June 12, 2003
    Publication date: December 16, 2004
    Inventors: Tue Nguyen, Larry Clopp, Minoru Tomijima
  • Publication number: 20040232943
    Abstract: This invention discloses a releasable adhesion layer having good adhesion during high temperature fabrication process in the absence of light, and delaminating at a lower temperature in the presence of light. One embodiment of this invention is a film of polymer whose thermal decomposition temperature changes drastically upon photoexposure. These materials, prior to photoexposure, can withstand temperatures in the range of approximately 200° C. to 300° C. without decomposition, yet decompose at around 100° C. with photoexposure. The releasable adhesion layer can be used in a thermal transfer element, sandwiching a donor substrate and a transfer layer having a plurality of multicomponent transfer units. In the absence of light, the releasable adhesion layer can sustain high temperature processing of these multicomponent transfer units. By photoexposing according to a pattern, the photoexposed multicomponent transfer units can be selectively released at a low temperature to transfer to a receptor.
    Type: Application
    Filed: May 23, 2003
    Publication date: November 25, 2004
    Inventors: James Sheats, Tue Nguyen