Abstract: A device includes a semiconductor substrate, an active region over the semiconductor substrate extending lengthwise in a first direction, a gate structure over the active region extending lengthwise in a second direction perpendicular to the first direction, a source feature and a drain feature on the active region and interposed by the gate structure, a source contact on the source feature, a drain contact on the drain feature, and a via rail over the substrate spaced from the active region. The via rail includes a main portion extending lengthwise in the first direction having a sidewall surface facing opposite the end surface of the drain contact, and a jog via extending from the main portion along the second direction and having a sidewall surface facing the second direction, each of the main portion and the jog via contacting the source contact.

Abstract: An adaptive minimum voltage aging margin prediction method includes acquiring characteristic data of a plurality of dies in a testing line, predicting a wear-out failure rate of each module of the plurality of dies according to the characteristic data by using a neural network, and predicting a minimum voltage aging margin of the each module according to the wear-out failure rate of the each module by using the neural network.

Abstract: An electronic device includes: a first panel including a first bonding pad and a first edge adjacent to the first bonding pad; a second panel overlapped with the first panel and including a second bonding pad; a circuit board electrically connected to the first panel and used to provide a first signal; and a first conductive connector electrically connected to the first panel and the second panel, wherein the first signal is input to the first bonding pad of the first panel through the circuit board, and input to the second bonding pad of the second panel through the first conductive connector, wherein the first bonding pad is between the second bonding pad and the first edge in a top view direction.

Abstract: A method includes receiving a layout; performing an optimization process to the layout to generate an optimized layout, wherein the optimization process comprising simulating a mask image of a photomask based on the layout; simulating an aerial image projected on a photoresist layer based on the mask image; simulating a resist image of the photoresist layer based on the aerial image; simulating an etch image of a layer underneath the photoresist layer based on the resist image; and performing an inverse lithographic technology (ILT) process to generate the optimized layout, wherein the ILT process is performed based on the mask image, the aerial image, the resist image, and the etch image; and fabricating a photomask based on the optimized layout.

Abstract: A cooling system for a heterogeneous integrated semiconductor package structure is disclosed. The heterogeneous integrated semiconductor package structure is arranged on a circuit board. The cooling system may include a cooling component. The cooling component may be arranged on the heterogeneous integrated semiconductor package structure, and is configured to dissipate heat from the heterogeneous integrated semiconductor package structure by using a cooling fluid.

Abstract: Decoder for decoding a picture from a data stream, configured to check whether a plurality of coding parameters, which are contained in the data stream, relate to a predetermined portion of the picture and control a prediction residual transform mode and a quantization accuracy with respect to the predetermined portion, are indicative of a coding parameter setting corresponding to a lossless prediction residual coding. Responsive to the plurality of coding parameters being indicative of the coding parameter setting corresponding to the lossless prediction residual coding, the decoder is configured to set one or more predetermined coding options relating to one or more tools of the decoder for processing a prediction residual corrected predictive reconstruction with respect to the predetermined portion so that the one or more tools are disabled with respect to the predetermined portion.

Abstract: In an aspect of the disclosure, a method for detecting outlier integrated circuits on a wafer is provided. The method comprises: operating multiple test items for each IC on the wafer to generate measured values of the multiple test items for each IC; selecting a target IC and neighboring ICs on the wafer repeatedly. each time after selecting the target IC executes the following steps: selecting a measured value of the target IC as a target measured value and selecting measured values of the target IC and the neighboring ICs as feature values of the target IC and the neighboring ICs; executing a transformer deep learning model to generate a predicted value of the target measured value; and identifying outlier ICs according to the predicted values of all the target ICs and the corresponding target measured values of all the target ICs.

Abstract: The invention discloses a semiconductor package structure including a package carrier, at least one electronic component, a packaging layer, a support component and a shielding layer. The electronic component is disposed on a first surface of the package carrier. The packaging layer is disposed on the first surface and covers the electronic component. The support component is embedded in the packaging layer to surround the electronic component. An end surface of the support component is electrically connected to a build-up circuit and electrically grounded. A patterned metal layer of the shielding layer is electrically connected to the support component. The shielding range of the patterned metal layer covers at least electronic component. A shielding space, which covers the electronic component, is formed by the support component and the shielding layer. In addition, a semiconductor EMI shielding component and a method of making a semiconductor package structure are also disclosed.

Abstract: In an embodiment, a package includes a first package structure including a first die having a first active side and a first back-side, the first active side including a first bond pad and a first insulating layer a second die bonded to the first die, the second die having a second active side and a second back-side, the second active side including a second bond pad and a second insulating layer, the second active side of the second die facing the first active side of the first die, the second insulating layer being bonded to the first insulating layer through dielectric-to-dielectric bonds, and a conductive bonding material bonded to the first bond pad and the second bond pad, the conductive bonding material having a reflow temperature lower than reflow temperatures of the first and second bond pads.

Abstract: A storage device is disclosed. The storage device may include a storage for a data and a controller to manage access to the data in the storage. A mechanism may automatically manage a bias mode for a chunk of the data in the storage, the bias mode including one of a host bias mode and a device bias mode.

Abstract: An improved fiber-optic gyroscope (FOG) is proposed for enhancing the optical measurement sensitivity through the application of a heterodyne effect. The improved FOG is characterized by the use of a dual-injection polarization-maintaining 3×3 directional coupler which is configured to receive a pair of source light beams that are injected thereinto in a bi-directional manner. The forward-injected light beam is used to be split into a pair of interrogating beams for use by a coiled optical fiber to implement the detection and measurement of the Sagnac effect due to a rotational movement. On the other hand, the backward-injected light beam is used to be mixed with the paired interrogating beams that have passed through and returned from the coiled optical fiber to thereby provide a heterodyne effect that can boost the differential optical power amplitude of the paired interrogating beams, thereby enhancing the optical measurement sensitivity of the FOG application.

Abstract: The present disclosure pertains to a die bonding structure. The die bonding structure includes a carrier substrate, a sintered layer, a nano-twinned layer, an adhesive layer and a chip. The sintered layer is located on the carrier substrate. The nano-twinned layer is located on the sintered layer, in which the surface of the nano-twinned layer has [111] crystal orientation with a density greater than 80%, in which the nano-twinned layer comprises parallel-arranged twin boundaries, the parallel-arranged twin boundaries comprise more than 40% [111] crystal orientation, and the spacing between the parallel-arranged twin boundaries is 10 to 100 nm. The adhesive layer is located on the nano-twinned layer. The chip is located on the adhesive layer.

Abstract: A device is provided to excite and locate methylene blue two-photon fluorescence (MB-2 PF) signals under skin surface. The device comprises a laser source, a nonlinear optical microscope unit, a beam-splitter unit, an optical-signal capturing and observing unit, and an image processing unit. Second harmonic generation (SHG) signals and the MB-2 PF signals are combined and observed simultaneously to form images of nerve fiber structures at different depths under the surface of human skin. The MB-2 PF signals directly observe the nerve fiber structure under the skin surface. The SHG signals reflects the signals of collagen fibers in dermal layer of the skin. The junction between the dermal layer and the epidermal layer are located to divide the dermis and epidermis layers for determining whether the nerve fiber structure passes through the epidermis and dermis layers. Thus, the density of intraepidermal nerve fiber is calculated in a non-invasive way.

Abstract: A vehicle seat assembly, suitable for vehicles such as locomotives and the like, includes a main cushion body and a lifting cushion. The main cushion body has a sliding cushion connected to a vehicle body with a sliding structure. The lifting cushion is connected to the vehicle body with a linkage mechanism. The lifting cushion is moved into a carriage when the sliding cushion is in a first position, and when the sliding cushion slides laterally into a second position to form a space portion, the lifting cushion can be lifted from the carriage and moved into the space portion and then positioned, or can be lowered into the carriage again, so that the sliding cushion can be moved back to the first position, thereby allowing the user to adjust seat cushion length according to their needs.

Abstract: A film thickness measurement device includes a spectroscopic ellipsometer, and the spectroscopic ellipsometer includes a projection module and a light receiving module. The projection module is configured to project a multi-wavelength polarized light onto a thin film. The projection module includes a light source and a polarization state generator. The light receiving module includes a polarization analyzer and an optical detector. The polarization analyzer is configured to screen out a multi-wavelength polarized reflection light according to reflection of the multi-wavelength polarized light by the thin film. The optical detector is configured to receive the multi-wavelength polarized reflection light. The optical detector includes at least one optical splitting unit, at least two optical filtering units and at least two optical detection units.

Abstract: Disclosed is a pixel array substrate including a first conductive pattern, a first dielectric layer, and a second conductive pattern. The first conductive pattern includes scan lines and first test lines. The second conductive pattern includes gate signal lines, data lines, second test lines, a first gate test line, and a second gate test line. The data lines are respectively electrically connected to the second test lines. The scan lines are respectively electrically connected to the gate signal lines, and the gate signal lines are respectively electrically connected to the first test lines. First portion of the gate signal lines are electrically connected to the first gate test lines, while second portion of the gate signal lines are electrically connected to the second gate test line. The first portion of the gate signal lines and the second portion of the gate signal lines are alternately arranged.

Abstract: A signal sensing device includes a body and two signal sensing elements disposed in the body. An insulating layer is sandwiched between the two signal sensing elements. Each of the two signal sensing elements incudes a signal transmission section and a signal sensing section in electrical connection with the signal transmission section. The signal transmission sections are planar antennae parallel to each other and each having an antenna shape of meander-line type. The antenna shape of each transmission section has a vertical projection on a plane parallel to each signal transmission section. The vertical projections of the antenna shapes do not overlap completely. When a portion of the body forms a surrounding portion which surrounds a to-be-sensed target, a portion or an entirety of each signal sensing section is located on the surrounding portion.

Abstract: A power supply unit for a computer component includes a voltage regulator and an enclosure. The voltage regulator receives an input voltage at a first voltage level and provides a regulated output voltage at a second voltage level. The enclosure houses the voltage regulator and includes a first slot to receive a first rectifier module and a second slot to receive a second rectifier module. The first slot is configured to couple a first output from the first rectifier module to the input of the first voltage regulator, and the second slot is configured to couple a first output from the second rectifier module to the input of the first voltage regulator.

Abstract: A method of motion adaptive spatial smoothing includes determining a difference of a block duty of a selected block of a current frame and a block duty of the selected block of a previous frame, generating an original smoothing matrix for the selected block, generating a motion adaptive matrix according to the original smoothing matrix and a difference of the block duty of the selected block of the current frame and the block duty of the selected block of the previous frame, updating a block duty for each block with a corresponding motion adaptive matrix to generate an updated frame, and performing spatial smoothing for the updated frame.