Abstract: Memory systems and operating method of a memory system are provided. The memory system utilized for performing a computing-in-memory (CiM) operation comprises a memory array and a processing circuit. The memory array comprises a plurality of memory cells. The processing circuit is coupled to the memory array and comprises a programming circuit and a control circuit. The programming circuit is coupled to the memory array and configured to perform a write operation for programming electrical characteristics of the memory cells. The control circuit is coupled to the programming circuit and configured to: receive a plurality of weight data corresponding to a plurality of weight values; and control the write operation performed by the programming circuit, so the electrical characteristics of the memory cells are programmed following a sequential order of the weight values.

Abstract: A radiotherapy system includes a neutron acceptor, an aerosolization device for aerosolizing the neutron acceptor, and an energy beam generator. A method for treating cancer, including: administering to a subject in need thereof an effective amount of an aerosolized neutron acceptor; and irradiating the subject with neutrons. A method for diagnosing cancer, including: administering to a subject in need thereof an effective amount of an aerosolized radioactive agent; and receiving an energy beam signal from the subject. A method for delivering a neutron receptor to a subject during radiation therapy, including aerosolizing the neutron receptor and administering to the subject an effective amount of the neutron receptor.

Abstract: A flash memory includes a linear array of flash memory cells having a source region extending along a first direction. Each flash memory cell includes a floating gate disposed adjacent the source region. The linear array of flash memory cells further includes isolation strips disposed between the floating gates of the flash memory cells. An erase gate line extends along the first direction and is disposed over the source region. A control gate line extends along the first direction and is disposed over the isolation strips and over the floating gates of the flash memory cells. The control gate line has a non-straight edge proximate to the source region that is indented away from the source region at least where the control gate line is disposed over the isolation strips.

Abstract: A method for forming a semiconductor structure includes the steps of forming a stacked structure on a substrate, forming an insulating layer on the stacked structure, forming a passivation layer on the insulating layer, performing an etching process to form an opening through the passivation layer and the insulating layer to expose a portion of the stacked structure and an extending portion of the insulating layer, and forming a contact structure filling the opening and directly contacting the stacked structure, wherein the extending portion of the insulating layer is adjacent to a surface of the stacked structure directly contacting the contact structure.

Abstract: The present disclosure relates to a semiconductor device and a method of fabricating the same, the semiconductor device including a substrate, an active structure and a shallow trench isolation. The active structure is disposed within the substrate, including a plurality of first active fragments and a plurality of second active fragments. The first active fragments and the second active fragments are parallel and separately extended along a first direction, and the second active fragments are disposed outside all of the first active fragments. The first active fragments have a same length in the first direction, being a first length, the second active fragment have a second length in the first direction, and the second length is greater than the first length.

Abstract: Packaged semiconductor devices including heat-dissipating structures and methods of forming the same are disclosed. In an embodiment, a semiconductor package includes a semiconductor die including a substrate, a front-side interconnect structure on a front-side of the substrate, and a backside interconnect structure on a backside of the substrate opposite the front-side interconnect structure; a support die disposed on the front-side interconnect structure; a heat-dissipating structure on the support die, the heat-dissipating structure being thermally coupled to the semiconductor die and the support die; a redistribution structure on the backside interconnect structure opposite the substrate, the redistribution structure being electrically coupled to the semiconductor die; and an encapsulant on the redistribution structure and adjacent to side surfaces of the semiconductor die, the support die, and the heat-dissipating structure.

Abstract: A method includes depositing a mask layer over a dielectric layer, patterning the mask layer to form a trench, applying a patterned photo resist having a portion over the mask layer, and etching the dielectric layer using the patterned photo resist as an etching mask to form a via opening, which is in a top portion of the dielectric layer. The method further includes removing the patterned photo resist, and etching the dielectric layer to form a trench and a via opening underlying and connected to the trench. The dielectric layer is etched using the mask layer as an additional etching mask. A polymer formed in at least one of the trench and the via opening is removed using nitrogen and argon as a process gas. The trench and the via opening are filled to form a metal line and a via, respectively.

Abstract: Among other things, a method of fabricating an integrated electronic device package is described. First trace portions of an electrically conductive trace are formed on an electrically insulating layer of a package structure, and vias of the conductive trace are formed in a sacrificial layer disposed on the electrically insulating layer. The sacrificial layer is removed, and a die is placed above the electrically insulating layer. Molding material is formed around exposed surfaces of the die and exposed surfaces of the vias, and a magnetic structure is formed within the layer of molding material. Second trace portions of the electrically conductive trace are formed above the molding material and the magnetic structure. The electrically conductive trace and the magnetic structure form an inductor. The electrically conductive trace may have a coil shape surrounding the magnetic structure. The die may be positioned between portions of the inductor.

Abstract: A work piece holder provided herein includes a support baffle and an elevating element. The support baffle extends along an arc path. The elevating element is disposed on the support baffle and is pivoted to be movable between an unlock status and a lock status.

Abstract: A method for providing a cooling system is described. The method includes providing a plurality of sheets. Each sheet includes at least one structure for a level in each cooling cell of a plurality of cooling cells. A particular level of each cooling cell includes a cooling element having a first side and a second side. The cooling element is configured to undergo vibrational motion to drive fluid from the first side to the second side. The method also includes aligning the sheets, attaching the sheets to form a laminate that includes the cooling cells, and separating the laminate into sections. Each section includes at least one cooling cell.

Abstract: A method for controlling a plurality of autonomous robots for performing environment maintenance operations includes: generating a setup command that indicates a selected location, a plurality of selected robots, an available time slot, and a distribution mode signal that indicates whether the selected robots are to be controlled based on the available time slot or an inputted priority section; and generating a plurality of sub-routes based on different parameters, depending on the distribution mode signal. The sub-routes are generated to be connected into an unbroken trail. Then, the sub-routes are transmitted to the selected robots, respectively, so as to control each of the selected robots to move along the respective one of the sub-routes.

Abstract: A construction laser level including a housing, a laser mount disposed in the housing and at least one laser generator on the laser mount. A fan disposed in the housing and configured to circulate air to improve heat distribution and dissipation.

Abstract: An ingot splitting method and an ingot splitting apparatus are provided. The ingot splitting method includes the following steps. A laser provided from a laser source is focused with a focusing lens group on a plane to be split of an ingot, and a focus point of the laser is used to scan the plane to be split. An opposing first side and second side of the ingot are fixed with a chuck table and an ultrasonic source. The plane to be split is located between the first side and the second side. A pulling force is applied to the second side in a direction away from the ingot with a tensioner, and ultrasonic waves are applied to vibrate the ingot with the ultrasonic source simultaneously, so that the ingot is divided into two parts from the plane to be split.

Abstract: Examples can provide extended-range high-speed interconnect by providing microcoax cables in a hybrid flexible circuit board, which can be referred to as a hybrid flex or microcoax flex. This hybrid flex can be used to convey signals an extended distance within an electronic device. Multiple signals can be conveyed using corresponding microcoax cables. The microcoax cables can include a center conductor, an insulating layer, and an outside shield layer. The cables can be held in position in the hybrid flex relative to each other by a polyimide or other insulative layer. Copper layers can be provided on either or both the top and bottom of the polyimide or other insulative layer. Additional conductors can be embedded in the polyimide other insulative layer to convey power and ground. The microcoax and other conductors can be soldered to a flexible circuit board or other substrate using jet soldering.

Abstract: A white light emitting device with an efficiency of at least 230 lm/W at a blue LED chip input current density from 10 to 60 mA/mm2, preferably in the range from 15 to 40 mA/mm2 and more preferably in the range from 20 to 30 mA/mm2. The device comprises a substrate, at least one string of blue LED chips mounted on the substrate and a phosphor material composition. Said phosphor material composition comprises a narrow band red phosphor which generates light with a peak emission wavelength in a range from 625 nm to 635 nm. The weight percentages of the narrow band red phosphor are between 33 to 49 wt. % for a CCT of from 4000 to 6500K or in an amount of from 60 to 70 wt. % for a CCT of from 2700 to 3500K CCT.

Abstract: An electronic device includes: a first substrate, wherein the first substrate is flexible; a second substrate disposed corresponding to the first substrate, wherein the second substrate is flexible; and a first conductive layer disposed on the first substrate. The first conductive layer includes: a first conductive pattern for receiving a first electrode signal and including a first bonding part; and a second conductive pattern for receiving a second electrode signal and including a second bonding part. The electronic device further includes: a second conductive layer disposed on the second substrate and electrically connected to the second conductive pattern; and a first metal layer disposed between the first substrate and at least one of the first bonding part and the second bonding part and is electrically connected to the at least one of the first bonding part and the second bonding part.

Abstract: A heat dissipation module includes an airflow generator, a heat dissipation substrate connected to a heat source, a heat dissipation member, a baffle, and a heat conductive member connected to the heat dissipation substrate. The heat dissipation member includes a main body and first fins arranged around an outer periphery of the main body and forming an accommodation space with the main body. The airflow generator has a rotation axis, and is accommodated in the accommodation space and connected to the main body. The baffle is connected to the first fins and has an opening corresponded to an air inlet surface of the airflow generator. On a reference plane perpendicular to the rotation axis, at least a part of an orthographic projection of each first fin does not overlap an orthographic projection of the airflow generator, and an orthographic projection of the baffle overlaps the orthographic projections of the first fins.

Abstract: Various embodiments are directed towards techniques for automatically generating standard cell layouts. In various embodiments, those techniques include processing a netlist graph to generate a plurality of graph embeddings, processing the plurality graph embedding via a transformer model to generate a plurality of device component embeddings, generating a page rank value for each device included in the netlist graph based on the plurality of device component embeddings, performing one or more clustering operations on the page rank values to generate a plurality of device clusters, and performing one or more standard cell synthesis operations using labels for the plurality of device clusters to generate at least one standard cell layout for the netlist graph.

Abstract: A method for decapsulating packaged integrated circuit is provided for the detection of counterfeit integrated circuit. The present invention pertains particularly to methods for application of heat for the decapsulation. The best way to ensure devices under test is not a counterfeit is to match the golden sample's die topography with that of the device under test. It is extremely difficult to replicate the unique topography and logo markings on the die. For an application like a failure analysis, it requires more expensive and involved steps to preserve the functionality of the die after the decapsulation. The decapsulation method for the detection of counterfeit only requires the preservation of markings of the die. The present invention provides for an efficient and economical decapsulation method for the detection of counterfeit utilizing new and novel techniques involving precise temperature control and related steps.

Abstract: A memory circuit includes a memory array comprising a plurality of non-volatile memory cells, wherein the non-volatile memory cells are arranged along a plurality of access lines that extend along a lateral direction. The memory circuit includes a first access circuit physically disposed on a first side of the memory array in the lateral direction. The memory circuit includes a second access circuit physically disposed on a second side of the memory array in the lateral direction, the second side being opposite to the first side. When each of the non-volatile memory cells is configured to be programmed by at least a first current and a second current, the first current and second current flow through a first path and a second path, respectively. The first path at least comprises a portion on the first side and the second path at least comprises a portion on the second side.