Abstract: The invention discloses a semiconductor package structure including a package carrier, at least one electronic component, a packaging layer, a support component and a shielding layer. The electronic component is disposed on a first surface of the package carrier. The packaging layer is disposed on the first surface and covers the electronic component. The support component is embedded in the packaging layer to surround the electronic component. An end surface of the support component is electrically connected to a build-up circuit and electrically grounded. A patterned metal layer of the shielding layer is electrically connected to the support component. The shielding range of the patterned metal layer covers at least electronic component. A shielding space, which covers the electronic component, is formed by the support component and the shielding layer. In addition, a semiconductor EMI shielding component and a method of making a semiconductor package structure are also disclosed.

Abstract: A heat dissipation module includes an airflow generator, a heat dissipation substrate connected to a heat source, a heat dissipation member, a baffle, and a heat conductive member connected to the heat dissipation substrate. The heat dissipation member includes a main body and first fins arranged around an outer periphery of the main body and forming an accommodation space with the main body. The airflow generator has a rotation axis, and is accommodated in the accommodation space and connected to the main body. The baffle is connected to the first fins and has an opening corresponded to an air inlet surface of the airflow generator. On a reference plane perpendicular to the rotation axis, at least a part of an orthographic projection of each first fin does not overlap an orthographic projection of the airflow generator, and an orthographic projection of the baffle overlaps the orthographic projections of the first fins.

Abstract: Methods and systems for improving fusion bonding are disclosed. Plasma treatment is performed on a substrate prior to the fusion bonding, which leaves residual charge on the substrate to be fusion bonded. The residual charge is usually dissipated through an electrically conductive silicone cushion on a loading pin. In the methods, the amount of residual voltage on a test silicon wafer is measured. If the residual voltage is too high, this indicates the usable lifetime of the silicone cushion has passed, and the electrically conductive silicone cushion is replaced. This ensures the continued dissipation of residual charge during use in production, improving the quality of fusion bonds between substrates.

Abstract: The disclosure provides a projection apparatus, which includes a casing, a projection module, at least one airflow generating unit, and at least one speaker. The casing has at least one air outlet. The projection module is disposed in the casing and configured to project an image beam outside the casing. The airflow generating unit is disposed in the casing and configured to generate airflow. The speaker is disposed in the casing, and the airflow generating unit is located between the projection module and the speaker. The speaker has at least one flow guiding surface, and the flow guiding surface is inclined toward the air outlet to guide the airflow toward the air outlet. The projection apparatus has a favorable heat dissipation capability and may reduce the noise generated by the airflow generating unit.

Abstract: A near-eye display device includes a main frame, a temple, an optical engine module, a first heat transfer plate, and a second heat transfer plate. The temple is pivotally connected to the main frame, and the optical engine module is disposed in the main frame. The first heat transfer plate is disposed in the main frame and connected to the optical engine module. The second heat transfer plate is disposed in the temple. The temple is adapted to be rotated relative to the main frame and switched between a folded state and an unfolded state. When the temple is in the folded state, the second heat transfer plate and the first heat transfer plate are separated from each other. When the temple is in the unfolded state, the second heat transfer plate is in contact with the first heat transfer plate.

Abstract: A projection apparatus includes an illumination system, an optical engine module, a lens module, and a heat-dissipation module. The illumination system includes a light source configured to provide an illumination light beam. The optical engine module is disposed on a transmission path of the illumination light beam, and configured to convert the illumination light beam into an image light beam. The lens module is disposed on a transmission path of the image light beam, and configured to project the image light beam out of the projection apparatus. The lens module has an optical axis. The lens module is adapted to move between a first position and a second position along the optical axis. The heat-dissipation module includes a light source heat-dissipation fin connected to the light source. When the lens module moves, the light source, the light source heat-dissipation fin, and the optical engine move with the lens module.

Abstract: A projection apparatus includes an illumination system; an optical engine module; a lens module; and a heat-dissipation module. The illumination system includes a light source, and is configured to provide an illumination light beam. The optical engine module includes a light valve. The light valve is disposed on a transmission path of the illumination light beam, and configured to convert the illumination light beam into an image light beam. The lens module is disposed on a transmission path of the image light beam, and configured to project the image light beam out of the projection apparatus. The lens module has an optical axis. The lens module is adapted to move between a first position and a second position along the optical axis. The heat-dissipation module includes a heat dissipating device, a first liquid-cooling plate, a second liquid-cooling plate, and a plurality of pipes. The first liquid-cooling plate is connected to the light source.

Abstract: A projection device of the present invention includes a casing, a light source module, a light source thermal module, a fan, and a projection lens; wherein the light source module, the light source thermal module, the fan and the projection lens are disposed in the casing, and the casing has a first side wall, a second side wall, and a bottom plate, wherein the first side wall includes a first air inlet, and the second side wall includes an air outlet; the orthographic projection range of the air outlet on the first side wall overlaps with the orthographic projection range of the light source thermal module on the first side wall, and the orthographic projection range of the projection lens on the first side wall does not overlap with the orthographic projection range of the light source thermal module on the first side wall.

Abstract: A wearable projection device includes a main body, an optical-mechanical module, a waveguide module, a first thermally conductive plate, and a control module. The main body has a display portion and a support portion connected to each other. The optical-mechanical module is disposed at the display portion and includes at least one light source. The waveguide module is disposed at the display portion. The first thermally conductive plate is connected to the light source and extends from the display portion to the support portion. The control module is electrically connected to the optical-mechanical module, so that an image generated by the optical-mechanical module is displayed on the display portion by the waveguide module. The wearable projection device is able to increase a heat dissipation area through the first thermally conductive plate, so that the wearable projection device may achieve an improved heat dissipation effect and have an improved display quality.

Abstract: A projection device of the present invention includes a casing, a light source module, a light source thermal module, a fan, and a projection lens; wherein the light source module, the light source thermal module, the fan and the projection lens are disposed in the casing, and the casing has a first side wall, a second side wall, and a bottom plate, wherein the first side wall includes a first air inlet, and the second side wall includes an air outlet; the orthographic projection range of the air outlet on the first side wall overlaps with the orthographic projection range of the light source thermal module on the first side wall, and the orthographic projection range of the projection lens on the first side wall does not overlap with the orthographic projection range of the light source thermal module on the first side wall.

Abstract: An optical engine module and a projection apparatus are provided. The optical engine module is adapted for a projection apparatus. The optical engine module includes a casing, an optical element, a fixing member, and a heat dissipation fin group. The optical element is disposed in the casing. The optical element has a first surface, a second surface, and a plurality of side surfaces. Each of the side surfaces is adjacent between the first surface and the second surface. The fixing member is disposed on at least one of the side surfaces of the optical element, and is configured to fix the optical element in the casing. The heat dissipation fin group is disposed on the fixing member and extends out of the casing.

Abstract: A projection apparatus including a casing, a light source module, a light source heat dissipation module, an optical engine module, an optical engine heat dissipation module, and a projection lens is provided. The casing has an air inlet and an air outlet. The light source module is disposed in the casing. The light source heat dissipation module is disposed in the casing and connected to the light source module. The optical engine module is disposed in the casing and includes a liquid crystal panel. The optical engine heat dissipation module is disposed in the casing and connected to the liquid crystal panel. Airflow enters the casing from the air inlet, passes through the optical engine heat dissipation module and the light source heat dissipation module in sequence, and flows out of the casing from the air outlet. The projection lens is connected to the casing.

Abstract: The disclosure provides a projection device and a parameter adjustment method thereof. An environment detection value is received from a detection module through a control chip, wherein the environment detection value is at least one of an environment illuminance value, a volume load value and an environment volume value. Then, the environment detection value is compared with a reference range to obtain a corresponding environment mode. Furthermore, a rotation speed of a fan module is adjusted according to an environment load value corresponding to the environment mode. The projection device and the parameter adjustment method thereof provided by the invention make the illuminance and noise output of the projection device more suitable for the operation condition.

Abstract: An electronic apparatus includes a main body, at least one fan in the main body, an audio receiving module on the main body, and a control module electrically connected to the audio receiving module and the fan. If the audio receiving module receives an activation command, the control module records an instant value of a rotation speed of the fan and controls the rotation speed to be decreased. After the rotation speed is reduced, if the audio receiving module receives a voice command within a predetermined time period, the electronic apparatus executes the voice command, and the control module controls the rotation speed to be returned to the instant value; if the audio receiving module does not receive the voice command within the predetermined time period, the control module controls the rotation speed to be returned to the instant value.

Abstract: The invention discloses a semiconductor package structure including a package carrier, at least one electronic component, a packaging layer, a support component and a shielding layer. The electronic component is disposed on a first surface of the package carrier. The packaging layer is disposed on the first surface and covers the electronic component. The support component is embedded in the packaging layer to surround the electronic component. An end surface of the support component is electrically connected to a build-up circuit and electrically grounded. A patterned metal layer of the shielding layer is electrically connected to the support component. The shielding range of the patterned metal layer covers at least electronic component. A shielding space, which covers the electronic component, is formed by the support component and the shielding layer. In addition, a semiconductor EMI shielding component and a method of making a semiconductor package structure are also disclosed.

Abstract: The disclosure provides a projection apparatus, which includes a casing, a projection module, at least one airflow generating unit, and at least one speaker. The casing has at least one air outlet. The projection module is disposed in the casing and configured to project an image beam outside the casing. The airflow generating unit is disposed in the casing and configured to generate airflow. The speaker is disposed in the casing, and the airflow generating unit is located between the projection module and the speaker. The speaker has at least one flow guiding surface, and the flow guiding surface is inclined toward the air outlet to guide the airflow toward the air outlet. The projection apparatus has a favorable heat dissipation capability and may reduce the noise generated by the airflow generating unit.

Abstract: A projection device includes a heat source module, a heat storage module, and a heat dissipation connecting element. The heat source module is configured to generate a light beam. The heat storage module includes a storage tank and a heat storage material, and the heat storage material is filled into the storage tank. The heat dissipation connecting element connects the heat source module and the heat storage module. Heat generated by the heat source module is transferred to the heat storage module through the heat dissipation connecting element.

Abstract: A projector including a casing, a control system, an image assembly and at least one electric thermal heater is provided. The image assembly is coupled to and controlled by the control system. The electric thermal heater is coupled to and controlled by the control system. The control system is configured to activate the electric thermal heater to preheat the image assembly, such that the image assembly is warmed up to a cut-off temperature. Then, the control system is configured to switch off the electric thermal heater. Then the focal length of the image assembly is adjusted. A focal length adjusting method for the projector is further provided. The projector and the method may be used to avoid the thermal expansion of various elements, so as to avoid focal length shift.

Abstract: The invention relates to a Lyocell fiber with recycled cellulose, which uses recycled cellulose pulp to dissolve in the spinning solution. The weight percentage of the recycled cellulose in the spinning solution is 30% to 55%. The Lyocell fibers of the invention also have hydrophilic, cooling, drape, antistatic, and biodegradable properties compared to the Lyocell fibers without recycled cellulose.

Abstract: A projection device includes a housing, a projection lens, a first light source module, a second light source module, a first heat dissipation module and a second heat dissipation module. The housing includes a front cover, a rear cover, a first side cover, a second side cover, a first air inlet, a second air inlet and an air outlet. The front cover, the rear cover, the first side cover and the second side cover define an accommodation space. A direction of an optical axis of the projection lens divides the accommodation space into a first area and a second area. The second air inlet is located at the first area, and the air outlet is located at the second area. The first heat dissipation module is connected to the first light source module, and the second heat dissipation module is connected to the second light source module.