Abstract: A process for producing an antistatic yarn includes the steps of: (a) providing antistatic composite filaments having carbon black dispersed therein; (b) advancing the antistatic composite filaments to a first heating zone at a first advancing speed which ranges from 230 m/min to 330 m/min; (c) drawing the antistatic composite filaments from the first heating zone to a false twist zone at a second advancing speed such that a draw ratio of the second advancing speed to the first advancing speed ranges from 1.5 to 1.75, thereby obtaining false twisted filaments; and (d) heat-setting the false twisted filaments so as to obtain a permanent antistatic crimped yarn.

Abstract: A package apparatus comprises a first wiring layer, a metal layer, a conductive pillar layer, a passive component, a first molding compound layer, a second wiring layer, and a protection layer. The first wiring layer has a first surface and a second surface opposite to each other. The metal layer is disposed on the first surface of the first wiring layer. The conductive pillar layer is disposed on the second surface of the first wiring layer. The passive component is disposed on the second surface of the first wiring layer. The first molding compound layer is disposed within a part of the zone of the first wiring layer and the conductive pillar layer. The second wiring layer is disposed on the first molding compound layer and one end of the conductive pillar layer. The protection layer is disposed on the first molding compound layer and the second wiring layer.

Abstract: A phosphor wheel includes a rotating disk and a wavelength converting layer. The rotating disk has a first surface and a second surface opposite to the first surface, in which the first surface forms a coating region and a non-coating region. The wavelength converting layer is formed on the coating region of the first surface for converting a light wavelength of a light beam. In addition, an embodiment of the invention discloses a projection device having the phosphor wheel. When the rotating disk of the phosphor wheel rotates, the recess portion may disturb the air around the phosphor wheel such that the temperature of the wavelength converting layer may be effectively decreased. Simultaneously, the rotating disk has a stable dynamic balance and the rotating disk has a larger heat dissipating region because the recess portion is disposed on the rotating disk.

Abstract: A fabrication of natural cellulose fiber with flame-retarding capability comprises following steps. Blend pulp and solvent of N-methylmorpholine N-oxide (NMMO) to form slurry. Evaporate extra water content from slurry by a Thin Film Evaporator (TFE) to form dope. By Dry-Jet Wet Spinning, spin and extrude dope for coagulating and regenerating. Water-rinse and dry to form natural cellulose fiber. Soaking roll natural cellulose fiber by flame retardant of N-(hydroxymethyl)-3-(methoxy phosphorus acyl). Orderly dry, bake, neutralize, soaping clean, water rinse, baking dry, soaking rolled, alkaline clean, water rinse, dry and oil the natural cellulose fiber to produce natural cellulose fiber of flame retarding capacity. Because of cross-linking reaction for the flame retardant of N-(hydroxymethyl)-3-(methoxy phosphorus acyl) with natural cellulose fiber, the flame-retarding capability thereof meet requirements of testing standards in American ASTM D6413-1999 and ASTM D2863-1995.

Abstract: A Meltblown process for producing non-woven fabrics with flame-retarding capability from natural cellulose comprises following steps. Blend pulp and solvent of N-methylmorpholine N-oxide (NMMO) to form slurry. Evaporate water content from slurry by a Thin Film Evaporator to form dope. Extrude the dope off spinneret bank to form filament bundle via meltblown process. Coagulating regenerate, water rinse, hydro-entangled needle-punch and dry the filament bundle to form normal natural cellulose nonwoven. Soaking roll formed nonwoven by flame retardant of N-(hydroxymethyl)-3-(methoxy phosphorus acyl). Orderly dry, bake, neutralize, soaping clean, water rinse, baking dry, soaking roll, alkaline clean, water rinse, dry and coil the nonwoven to produce modified natural cellulose nonwoven of flame retarding capacity.

Abstract: A light source module and a projection apparatus including the light source module, an optical engine module, and a projection lens are provided. The light source module includes a lamp holder, a casing, a light source, and a heat dissipation fan. The lamp holder has a cover having a first inlet and a first outlet. The casing is connected to the lamp holder and has a second inlet and at least one second outlet. The light source is fixed to the lamp holder fixed to a housing of the projection apparatus. The heat dissipation fan generates a heat dissipation airflow through an outflow side. A first part of the heat dissipation airflow enters the cover through the first inlet, and leaves the cover through the first outlet. A second part of the heat dissipation airflow enters the casing through the second inlet, and leaves the casing through the second outlet.

Abstract: An optical engine module includes a first casing with a first enclosed space, a light source at the first casing, a phosphor wheel in the first casing, a cooling fan and a heat-dissipating module. The light source emits a light beam passing through the phosphor wheel. The cooling fan is in the first enclosed space and has an airflow outlet. The heat-dissipating module includes two heat-dissipating parts and a heat-guiding part, wherein the first and second heat-dissipating parts are respectively in and outside the first enclosed space, the heat-guiding part is connected between the first and second heat-dissipating parts and the phosphor wheel is between the airflow outlet and the first heat-dissipating part. The airflow outlet and the phosphor wheel, and the phosphor wheel and the first heat-dissipating part, are at least partially overlapped with each other along the airflow exiting direction of the cooling fan.

Abstract: A color wheel module and a projection apparatus are provided, wherein the color wheel module includes a color wheel, a cover and a flow detour duct. The cover shades the color wheel. The flow detour duct is communicated with the cover and has an airflow inlet and an airflow outlet. The rotating color wheel is configured to drive airflow into the flow detour duct from the airflow inlet, and cause the airflow through the color wheel and then discharged from the airflow outlet.

Abstract: A circuit board includes an insulation layer, an electrically conductive layer, and a solder mask layer. The insulation layer has a plurality of through holes passing through. The electrically conductive layer is formed on a surface of the insulation layer and covers the through holes. The electrically conductive layer has a plurality of portions exposed in the through holes to serve as a plurality of first conductive pads. The solder mask layer covers the electrically conductive layer and defines a plurality of openings to expose parts of the electrically conductive layer. Parts of the electrically conductive layer are exposed to the solder mask layer to serve as a plurality of second conductive pads. The second conductive pads are electrically connected to the first conductive pads respectively. This disclosure further relates to a chip package and a method of manufacturing the same.

Abstract: A coreless package structure and a method for manufacturing same includes the steps of providing a supporting substrate comprising an etching resist layer and a copper foil. A groove is defined in the copper foil and a plurality of contact pads are formed on the surface of the copper foil. A chip including a plurality of electrode pads is received in the groove and a packaging layer is formed on a side of the copper foil. An insulating layer and a conductive pattern layer are formed on the packaging layer in that order, the conductive pattern layer being electrically connected to the contact pads and the electrode pads by a plurality of conductive bumps. Finally, the etching resist layer and the copper foil are removed to obtain a coreless package structure.

Abstract: This disclosure relates to a method of recovering and concentrating an aqueous N-methylmorpholine-N-oxide (NMMO) solution.

Abstract: The present invention provides a processing method of natural cellulose fiber intrinsically with enhanced antiseptic, deodorant and negative-ion features from bamboo. The process uses mixture of wasted coffee residue and bamboo pulp as raw material. The process uses N-methylmorpholine N-oxide (NMMO) as primary solvent and 1, 3-phenylene-bis 2-oxazoline (BOX) as additive stabilizer. A cellulose solution is firstly formed by the wasted coffee residue, bamboo pulp, NMMO and BOX aforesaid. Secondly, via grinding, blending, dissolving and thermal dehydrating, the cellulose solution is converted into spinning dope. Thirdly, spin the dope obtained previously by dry-jet wet spinning method and coagulate and regenerate in a coagulation bath to form into threads. Finally, rinse, desiccate and lubricate the regenerated threads obtained previously as well as wind it up to produce reeled natural bamboo cellulose fiber with enhanced antiseptic, deodorant and negative-ion features.

Abstract: The present invention provides a processing method of non-woven intrinsically with enhanced deodorant feature from bamboo. The process uses mixture of wasted coffee residue and bamboo pulp as raw material. The process uses N-methylmorpholine N-oxide (NMMO) as primary solvent and 1,3-phenylene-bis 2-oxazoline (BOX) as additive stabilizer. A cellulose solution is firstly formed by the wasted coffee residue, bamboo pulp, NMMO and BOX aforesaid. Secondly, via grinding, blending, dissolving and thermal dehydrating, the cellulose solution is converted into spinning dope. Thirdly, via meltblown method, the dope is extruded out of spinnerets in a die assembly by a metering gear pump to form thread bundle. Finally, the thread bundle is orderly treated by coagulation with regeneration via ejecting mist aerosol of water, rinsing, bleaching, re-rinsing, drying, winding-up and the like to create continuous filaments, then final product for nonwoven with deodorant feature is produced by the filaments from bamboo cellulose.

Abstract: A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.

Abstract: The present invention provides a producing method for the artificial peat moss from natural cellulose fiber. The producing method comprises following steps in successive order manner. Firstly, blend natural pulp with N-methylmorpholine N-oxide (NMMO) as dissolving solvent and 1,3-phenylene-bis 2-oxazoline (BOX) as stabilizer in proper mixing ratio to yield a preliminary quasi-dope. Secondly, stir and dehydrate the preliminary quasi-dope to form dope. Thirdly, spin the dope by dry jet wet spinning method to yield filament bundle of cellulose. Fourthly, orderly perform coagulating with regenerating, water rinsing, twisting with plying and cutting processes on the filament bundle of cellulose to yield a preliminary artificial peat moss of natural cellulose fiber. Finally, per drying process of post-treatment on the preliminary artificial peat moss of natural cellulose fiber to obtain final artificial peat moss of natural cellulose fiber of the present invention.

Abstract: A packaging substrate includes a base layer, a first wiring layer, a second wiring layer, a first solder mask layer, a second solder mask layer and copper portions. The first second wiring layers are arranged on opposite sides of the base layer. The first solder mask layer covers the first wiring layer, and defines plenty of first openings. The first wiring layer exposed through the first openings serves as first contact pads. The second solder mask layer covers the second wiring layer. The second solder mask layer defines plenty of second openings. The second wiring layer exposed through the second openings serves as second contact pads. The copper portions are formed on the second contact pads. The copper portions protrude beyond the second solder mask layer. This disclosure further relates to a method of manufacturing the packaging substrate and a chip packaging body.

Abstract: A chip packaging substrate includes a dielectric layer, a first inner wiring layer embedded in the dielectric layer, an outer wiring layer, and many conductive connection points. The outer wiring layer is formed at one side of the dielectric layer, and is electrically connected to the first inner wiring layer through many first conductive vias in the dielectric layer. The conductive connection points are formed at the other side of the dielectric layer, and are electrically connected to the first inner wiring layer through many second conductive vias in the dielectric layer.

Abstract: A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a solder mask layer. The copper foil is attached on a surface of the supporting sheet through an adhesive sheet. The connecting pads are formed on the copper foil. The solder balls are formed on the connecting pads. The resin layer infills the gaps between the solder balls. The wiring layer is formed on the resin layer and the solder balls. Terminal portions of the solder balls facing away from the connecting pads are electrically connected to the wiring layer. The solder mask layer is formed on the wiring layer. The solder mask layer defines a number of openings exposing portions of the wiring layer. The portions of the wiring layer exposed through the openings serve as contact pads.

Abstract: A packaging substrate includes a copper foil substrate, a sputtering copper layer, a dielectric layer, a plurality of electrically conductive connection points, and an electrically conductive pattern layer. The sputtering copper layer is formed on the copper foil substrate. The electrically conductive connection points are formed on a surface of the sputtering copper layer, which is away from the copper foil substrate. The dielectric layer is sandwiched between the electrically conductive pattern layer and the sputtering copper layer. A plurality of first blind via are formed in the first dielectric layer. The electrically conductive pattern layer includes a plurality of electrically conductive traces and a plurality of connection pads. Each electrically conductive connection point is electrically connected to the electrically conductive trace by the first blind via.

Abstract: A circuit board includes an insulation layer, an electrically conductive layer, and a solder mask layer. The insulation layer has a plurality of through holes passing through. The electrically conductive layer is formed on a surface of the insulation layer and covers the through holes. The electrically conductive layer has a plurality of portions exposed in the through holes to serve as a plurality of first conductive pads. The solder mask layer covers the electrically conductive layer and defines a plurality of openings to expose parts of the electrically conductive layer. Parts of the electrically conductive layer are exposed to the solder mask layer to serve as a plurality of second conductive pads. The second conductive pads are electrically connected to the first conductive pads respectively. This disclosure further relates to a chip package and a method of manufacturing the same.