Patents by Inventor Tung Chou

Tung Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140291883
    Abstract: The present invention provides a processing method of non-woven intrinsically with enhanced deodorant feature from bamboo. The process uses mixture of wasted coffee residue and bamboo pulp as raw material. The process uses N-methylmorpholine N-oxide (NMMO) as primary solvent and 1,3-phenylene-bis 2-oxazoline (BOX) as additive stabilizer. A cellulose solution is firstly formed by the wasted coffee residue, bamboo pulp, NMMO and BOX aforesaid. Secondly, via grinding, blending, dissolving and thermal dehydrating, the cellulose solution is converted into spinning dope. Thirdly, via meltblown method, the dope is extruded out of spinnerets in a die assembly by a metering gear pump to form thread bundle. Finally, the thread bundle is orderly treated by coagulation with regeneration via ejecting mist aerosol of water, rinsing, bleaching, re-rinsing, drying, winding-up and the like to create continuous filaments, then final product for nonwoven with deodorant feature is produced by the filaments from bamboo cellulose.
    Type: Application
    Filed: June 6, 2013
    Publication date: October 2, 2014
    Inventors: Wen-Tung Chou, Ming-Yi Lai, Kun-Shan Huang
  • Publication number: 20140185259
    Abstract: A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.
    Type: Application
    Filed: December 5, 2013
    Publication date: July 3, 2014
    Applicant: ZHEN DING TECHNOLOGY CO., LTD.
    Inventors: YONG HA WOO, E-TUNG CHOU, WEN-LUN LO
  • Publication number: 20140165463
    Abstract: The present invention provides a producing method for the artificial peat moss from natural cellulose fiber. The producing method comprises following steps in successive order manner. Firstly, blend natural pulp with N-methylmorpholine N-oxide (NMMO) as dissolving solvent and 1,3-phenylene-bis 2-oxazoline (BOX) as stabilizer in proper mixing ratio to yield a preliminary quasi-dope. Secondly, stir and dehydrate the preliminary quasi-dope to form dope. Thirdly, spin the dope by dry jet wet spinning method to yield filament bundle of cellulose. Fourthly, orderly perform coagulating with regenerating, water rinsing, twisting with plying and cutting processes on the filament bundle of cellulose to yield a preliminary artificial peat moss of natural cellulose fiber. Finally, per drying process of post-treatment on the preliminary artificial peat moss of natural cellulose fiber to obtain final artificial peat moss of natural cellulose fiber of the present invention.
    Type: Application
    Filed: February 26, 2013
    Publication date: June 19, 2014
    Applicant: Acelon Chemicals and Fiber Corporation
    Inventors: Wen-Tung Chou, Ming-Yi Lai, Kun-Shan Huang
  • Publication number: 20140117553
    Abstract: A packaging substrate includes a base layer, a first wiring layer, a second wiring layer, a first solder mask layer, a second solder mask layer and copper portions. The first second wiring layers are arranged on opposite sides of the base layer. The first solder mask layer covers the first wiring layer, and defines plenty of first openings. The first wiring layer exposed through the first openings serves as first contact pads. The second solder mask layer covers the second wiring layer. The second solder mask layer defines plenty of second openings. The second wiring layer exposed through the second openings serves as second contact pads. The copper portions are formed on the second contact pads. The copper portions protrude beyond the second solder mask layer. This disclosure further relates to a method of manufacturing the packaging substrate and a chip packaging body.
    Type: Application
    Filed: August 15, 2013
    Publication date: May 1, 2014
    Applicant: ZHEN DING TECHNOLOGY CO., LTD.
    Inventors: YONG HA WOO, E-TUNG CHOU, WEN-LUN LO
  • Publication number: 20140085833
    Abstract: A chip packaging substrate includes a dielectric layer, a first inner wiring layer embedded in the dielectric layer, an outer wiring layer, and many conductive connection points. The outer wiring layer is formed at one side of the dielectric layer, and is electrically connected to the first inner wiring layer through many first conductive vias in the dielectric layer. The conductive connection points are formed at the other side of the dielectric layer, and are electrically connected to the first inner wiring layer through many second conductive vias in the dielectric layer.
    Type: Application
    Filed: September 17, 2013
    Publication date: March 27, 2014
    Applicant: ZHEN DING TECHNOLOGY CO., LTD.
    Inventors: SHIH-PING HSU, E-TUNG CHOU, CHIH-JEN HSIAO
  • Publication number: 20140078706
    Abstract: A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a solder mask layer. The copper foil is attached on a surface of the supporting sheet through an adhesive sheet. The connecting pads are formed on the copper foil. The solder balls are formed on the connecting pads. The resin layer infills the gaps between the solder balls. The wiring layer is formed on the resin layer and the solder balls. Terminal portions of the solder balls facing away from the connecting pads are electrically connected to the wiring layer. The solder mask layer is formed on the wiring layer. The solder mask layer defines a number of openings exposing portions of the wiring layer. The portions of the wiring layer exposed through the openings serve as contact pads.
    Type: Application
    Filed: August 21, 2013
    Publication date: March 20, 2014
    Applicant: ZHEN DING TECHNOLOGY CO., LTD.
    Inventors: CHU-CHIN HU, SHIH-PING HSU, E-TUNG CHOU, CHIH-JEN HSIAO
  • Publication number: 20140036465
    Abstract: A packaging substrate includes a copper foil substrate, a sputtering copper layer, a dielectric layer, a plurality of electrically conductive connection points, and an electrically conductive pattern layer. The sputtering copper layer is formed on the copper foil substrate. The electrically conductive connection points are formed on a surface of the sputtering copper layer, which is away from the copper foil substrate. The dielectric layer is sandwiched between the electrically conductive pattern layer and the sputtering copper layer. A plurality of first blind via are formed in the first dielectric layer. The electrically conductive pattern layer includes a plurality of electrically conductive traces and a plurality of connection pads. Each electrically conductive connection point is electrically connected to the electrically conductive trace by the first blind via.
    Type: Application
    Filed: April 16, 2013
    Publication date: February 6, 2014
    Applicant: Zhen Ding Technology Co., Ltd.
    Inventors: CHU-CHIN HU, SHIH-PING HSU, E-TUNG CHOU
  • Publication number: 20140027893
    Abstract: A circuit board includes an insulation layer, an electrically conductive layer, and a solder mask layer. The insulation layer has a plurality of through holes passing through. The electrically conductive layer is formed on a surface of the insulation layer and covers the through holes. The electrically conductive layer has a plurality of portions exposed in the through holes to serve as a plurality of first conductive pads. The solder mask layer covers the electrically conductive layer and defines a plurality of openings to expose parts of the electrically conductive layer. Parts of the electrically conductive layer are exposed to the solder mask layer to serve as a plurality of second conductive pads. The second conductive pads are electrically connected to the first conductive pads respectively. This disclosure further relates to a chip package and a method of manufacturing the same.
    Type: Application
    Filed: February 20, 2013
    Publication date: January 30, 2014
    Applicant: Zhen Ding Technology Co., Ltd.
    Inventors: E-TUNG CHOU, CHIH-JEN HSIAO
  • Publication number: 20140008577
    Abstract: A method of recovering aqueous N-Methylmorpholine-N-Oxide solution used in production of Lyocell fiber comprises following steps. Bleach means for decoloring coloration in aqueous NMMO solution via alternate blow-mixing adsorption mode and static suspending adsorption mode reiteration. Filtration means for purifying the activated carbon powder and impurities by two filtering stages of first coarse filtering stage and second fine filtering stage. Concentration means for intensifying aqueous NMMO solution to obtain a condensed aqueous solution without NMMO solvent and a concentrated aqueous solution with NMMO solvent respectively by a sequential multi-stage evaporating system. Refinement means for purifying aqueous NMMO solution with promoting purity of concentrated aqueous solution to obtain required recovered aqueous solution by adding suitable agents in the redox reactions involved.
    Type: Application
    Filed: July 29, 2013
    Publication date: January 9, 2014
    Applicant: Acelon Chemicals and Fiber Corporation
    Inventors: Wen-Tung CHOU, Ming-Yi LAI, Kun-Shan HUANG
  • Publication number: 20130313750
    Abstract: A process for producing an antistatic yarn includes the steps of: (a) providing antistatic composite filaments having carbon black dispersed therein; (b) advancing the antistatic composite filaments to a first heating zone at a first advancing speed which ranges from 230 m/min to 330 m/min; (c) drawing the antistatic composite filaments from the first heating zone to a false twist zone at a second advancing speed such that a draw ratio of the second advancing speed to the first advancing speed ranges from 1.5 to 1.75, thereby obtaining false twisted filaments; and (d) heat-setting the false twisted filaments so as to obtain a permanent antistatic crimped yarn.
    Type: Application
    Filed: January 24, 2013
    Publication date: November 28, 2013
    Applicant: Acelon Chemicals & Fiber Coporation
    Inventors: Wen-Tung Chou, Ming-Yi Lai, Kun-Shan Huang, Hsiao-Chi Tsai, Chien-Yuan Wang
  • Patent number: 8554884
    Abstract: A setting and modifying method of a user operating interface is used between a user device and a digital audio/video signal receiving and processing device through a network. The setting and modifying method includes the following steps. Firstly, the user device acquires a first user operating interface setting information from the digital audio/video signal receiving and processing device. Then, the contents of the first user operating interface setting information are modified to generate a second user operating interface setting information. Afterwards, the second user operating interface setting information is transmitted from the user device to the digital audio/video signal receiving and processing device through the network for setting the user operating interface.
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: October 8, 2013
    Assignee: Alpha Networks Inc.
    Inventor: Tung-Chou Lee
  • Publication number: 20130234354
    Abstract: A Meltblown process for producing non-woven fabrics with flame-retarding capability from natural cellulose comprises following steps. Blend pulp and solvent of N-methylmorpholine N-oxide (NMMO) to form slurry. Evaporate water content from slurry by a Thin Film Evaporator to form dope. Extrude the dope off spinneret bank to form filament bundle via meltblown process. Coagulating regenerate, water rinse, hydro-entangled needle-punch and dry the filament bundle to form normal natural cellulose nonwoven. Soaking roll formed nonwoven by flame retardant of N-(hydroxymethyl)-3-(methoxy phosphorus acyl). Orderly dry, bake, neutralize, soaping clean, water rinse, baking dry, soaking roll, alkaline clean, water rinse, dry and coil the nonwoven to produce modified natural cellulose nonwoven of flame retarding capacity.
    Type: Application
    Filed: March 8, 2012
    Publication date: September 12, 2013
    Applicant: Acelon Chemical and Fiber Corporation
    Inventors: Wen-Tung CHOU, Ming-Yi Lai, Kun-Shan Huang
  • Publication number: 20130228949
    Abstract: A fabrication of natural cellulose fiber with flame-retarding capability comprises following steps. Blend pulp and solvent of N-methylmorpholine N-oxide (NMMO) to form slurry. Evaporate extra water content from slurry by a Thin Film Evaporator (TFE) to form dope. By Dry-Jet Wet Spinning, spin and extrude dope for coagulating and regenerating. Water-rinse and dry to form natural cellulose fiber. Soaking roll natural cellulose fiber by flame retardant of N-(hydroxymethyl)-3-(methoxy phosphorus acyl). Orderly dry, bake, neutralize, soaping clean, water rinse, baking dry, soaking rolled, alkaline clean, water rinse, dry and oil the natural cellulose fiber to produce natural cellulose fiber of flame retarding capacity. Because of cross-linking reaction for the flame retardant of N-(hydroxymethyl)-3-(methoxy phosphorus acyl) with natural cellulose fiber, the flame-retarding capability thereof meet requirements of testing standards in American ASTM D6413-1999 and ASTM D2863-1995.
    Type: Application
    Filed: March 5, 2012
    Publication date: September 5, 2013
    Applicant: Acelon Chemical and Fiber Corporation
    Inventors: Wen-Tung CHOU, Ming-Yi Lai, Kun-Shan Huang
  • Patent number: 8420004
    Abstract: The present invention provides a meltblown wetlaid method for producing non-woven fabrics from natural cellulose using pulp as raw material and N-methylmorpholine N-oxide (NMMO) as solvent for dissolving into dope. The dope is then extruded out of a spinneret to form filament bundle by meltblown method. Subsequently, by means of ejecting mist aerosol of water, the filament bundle is coagulated with regeneration. Via post treatments of water rinsing, hydro-entangled needle punching, drying, winding-up and the like have been orderly applied, then final product of nonwoven fabrics with continuous filament are produced from natural cellulose.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: April 16, 2013
    Assignee: Acelon Chemical and Fiber Corporation
    Inventors: Wen-Tung Chou, Ming-Yi Lai, Kun-Shan Huang
  • Patent number: 8420005
    Abstract: The present invention provides a meltblown wetlaid method for producing non-woven fabrics with anti-mildew, anti-bacteria and deodorizing capabilities from natural cellulose. The method comprises selecting wood pulp as raw material and using N-methylmorpholine N-oxide (NMMO) as dissolving solvent and 1,3-phenylene-bis 2-oxazoline (BOX) as stabilizer to form mixed cellulose mucilage as well as using modified and nano-miniaturized natural chitosan as additive for blending and dissolution to form cellulose dope. By meltblown method, the dope is extruded out of spinnerets to form filament bundle, then by ejecting mist aerosol of water, the filament bundle is coagulated with regeneration. After post treatments of water rinsing, hydro-entangled needle punching, drying, winding-up and the like having been orderly applied, then final product for nonwoven fabric of continuous filament with anti-mildew, anti-bacteria and deodorizing capabilities is produced.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: April 16, 2013
    Assignee: Acelon Chemical and Fiber Corporation
    Inventors: Wen-Tung Chou, Ming-Yi Lai, Kun-Shan Huang
  • Publication number: 20130062566
    Abstract: This disclosure relates to a method of recovering and concentrating an aqueous N-methylmorpholine-N-oxide (NMMO) solution.
    Type: Application
    Filed: September 9, 2011
    Publication date: March 14, 2013
    Applicant: Acelon Chemicals & Fiber Corporation
    Inventors: Wen-Tung Chou, Ming-Yi Lai, Kun-Shan Huang, Hsiao-Chi Tsai, Chih-Chung Kuo
  • Patent number: 8366988
    Abstract: The present invention provides a “spunbond wetlaid method for producing non-woven fabrics from natural cellulose” using pulp as raw material and N-methylmorpholine N-oxide (NMMO) as solvent for dissolving into dope. Then, the dope is extruded out of a spinneret to form filament bundle by spunbond method. The dope is extruded out of a spinneret bank of grouped spinnerets to form filament bundle for further stretching process under quench condition. The filament bundle is coagulated with regeneration in a coagulating solution. The coagulated filament bundle is rapidly stretched under high pressure by an air draw-off machine. The stretched filament bundle is collected and stacked on a collecting net as web nonwoven. After post treatments of water rinsing, hydro-entangled needle punching, drying, winding-up and the like have been orderly applied then final product of nonwoven fabrics with continuous filament are produced from natural cellulose.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: February 5, 2013
    Assignee: Acelon Chemical and Fiber Corporation
    Inventors: Wen-Tung Chou, Ming-Yi Lai, Kun-Shan Huang
  • Publication number: 20120317710
    Abstract: A water-saving toilet contains a base including a cavity, an outlet, a U-shaped tube, a cushion, a stopping member, and a flush button; the stopping member including an inlet pipe to connect with a first flow pipe and a second flow pipe, the first and the second flow pipes respectively including a plurality of outflow holes; wherein lengths of the first and the second flow pipes are equal when flushing the water, the water flows from the stopping member to the cavity via a first predetermined section of the first flow pipe without the outflow holes, and on a second predetermined section of the second flow pipe relative to a third predetermined section of the first flow pipe with the outflow holes is not provided with the outflow holes.
    Type: Application
    Filed: June 16, 2011
    Publication date: December 20, 2012
    Inventor: TUNG- CHOU, SHIAO
  • Patent number: 8193325
    Abstract: The present invention relates a processing method for nano-miniaturizing chitosan of modifying property, which degrades the chitosan of high molecular weight down to the chitosan of middle and low molecular weight, then primarily nano-miniaturizes the interim chitosan by quaternary ammonium salt/synthesis, finally yield the nano-miniaturized chitosan of modified property by sol-gel method to have features in good biocompatibility and bioactivity to be served as additive material in products of cosmetics, medical treatment, hygiene, health care, biomedicine, agriculture, textile, food and so like so that not only the antiseptic, moisture-retentive and deodorizing capabilities can be promoted but also the processing cost can be reduced due to easiness of the mass production.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: June 5, 2012
    Assignee: Acelon Chemical and Fiber Corporation
    Inventors: Wen-Tung Chou, Ming-Yi Lai, Kun-Shan Huang, Wei-Chun Chen
  • Patent number: 8092732
    Abstract: The present invention provides a processing method of the natural cellulose fiber with feature for enhancing the capability of antifungi, antibacteria and deodorization. The procedure is that firstly modify and reduce the properties of the natural chitosan of high polymer material to nanometer scale; secondly dunk the chitosan into the syrup-like mixture of wood pulp and NMMO solvent to yield quasi-dope; thirdly dehydrate the quasi-dope of paste mixture to form the mud-like dope; fourthly spin the dope by dryjet wet spinning method; fifthly regenerate the filament in coagulation bath, water rinse and dry; finally water rinse, dry, apply the lubricant to finish. The water soluble chitosan, which has been treated by property modification and reduced to nanometer scale, can effectively and completely solve in the cellulose of low DP to offer wider extent of selection in the DP and better flexibility of adding percentage in content of modified chitosan.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: January 10, 2012
    Assignee: Acelon Chemical and Fiber Corporation
    Inventors: Wen-Tung Chou, Ming-Yi Lai, Kun-Shan Huang