Abstract: A probe card assembly includes a circuit board, a substrate, and at least one passive component. The substrate is disposed opposite and connected to the circuit board. The circuit board has a first opening facing the substrate and/or the substrate has a second opening facing the circuit board. The at least one passive component is disposed between the circuit board and the substrate and is at least partially accommodated in at least one of the first opening and the second opening.

Abstract: A drive system thermal temperature rise test and compensation system. The system has an optical non-contact type sensing head mounted on a main shaft of a machine tool, and a sensing center is formed in the center of the sensing head. A platform driven by a transmission device of the machine tool is provided with plural ball lens devices, and a temperature sensor for transmitting temperature data externally is further provided on the transmission device. After the machine tool sequentially records an original point coordinate for each ball lens center by using the sensing head, the sensing head is cyclically and sequentially moved to the original point coordinate of each ball lens, so as to measure a displacement error between the sensing center and the ball lens center resulted from thermal shifts of the transmission device, as well as capable of measuring multiaxial errors and using various axial temperatures for compensation.

Abstract: A probe card assembly includes a circuit board, a substrate, and at least one passive component. The substrate is disposed opposite and connected to the circuit board. The circuit board has a first opening facing the substrate and/or the substrate has a second opening facing the circuit board. The at least one passive component is disposed between the circuit board and the substrate and is at least partially accommodated in at least one of the first opening and the second opening.

Abstract: A many-to-many state identification system of equipment names broadcasted from Internet-of-Things comprises IoT nodes and IoT mobile devices connecting the IoT nodes wirelessly. Each IoT node receives the sensed value of transducer on a machine element, determining whether the sensed value of transducer is abnormal. Next, the IoT node broadcasts an equipment identification name containing an existing gateway identification code and a state code of transducer showing whether the transducer is abnormal. When the IoT mobile device scans the equipment identification name broadcasted from the IoT node, a visual interface displays the state of IoT node by identifying the gateway identification code and the state code. Accordingly, before connecting the IoT mobile device to the IoT node, the state of transducer in the IoT node is acquired, allowing any IoT mobile device to monitor any transducer in a synchronous and many-to-many manner within the broadcasting area.

Abstract: A many-to-many state identification system of equipment names broadcasted from Internet-of-Things comprises IoT nodes and IoT mobile devices connecting the IoT nodes wirelessly. Each IoT node receives the sensed value of transducer on a machine element, determining whether the sensed value of transducer is abnormal. Next, the IoT node broadcasts an equipment identification name containing an existing gateway identification code and a state code of transducer showing whether the transducer is abnormal. When the IoT mobile device scans the equipment identification name broadcasted from the IoT node, a visual interface displays the state of IoT node by identifying the gateway identification code and the state code. Accordingly, before connecting the IoT mobile device to the IoT node, the state of transducer in the IoT node is acquired, allowing any IoT mobile device to monitor any transducer in a synchronous and many-to-many manner within the broadcasting area.

Abstract: An optical detecting apparatus for detecting a degree of freedom error of a spindle and has a standard bar and a sensor module, and is assembled between a spindle and a rotating platform of a powered machinery. The standard bar has a rod lens and a reflection face. The sensor module has two detecting groups, an oblique laser head, and a reflected spot displacement sensor. Each detecting group emits a laser light through the rod lens along the X-axis and the Y-axis of the powered machinery. The oblique laser head emits an oblique laser light to the reflected spot displacement sensor. When the spindle of the powered machinery generates errors after rotating, the sensor module receives the changes of the laser lights to obtain the displacement change signals of the standard bar for a calculation unit to detect the errors between the spindle and the rotating platform.

Abstract: An RDL structure on a passivation layer includes a first landing pad disposed directly above a first on-chip metal pad; a first via in a passivation layer to electrically connect the first landing pad with the first on-chip metal pad; a second landing pad disposed directly above the second on-chip metal pad; a second via in the passivation layer to electrically connect the second landing pad with the second on-chip metal pad; and at least five traces being disposed on the passivation layer and passing through a space between the first landing pad and the second landing pad.

Abstract: Various structures of a semiconductor package assembly are provided. In one implementation, a semiconductor package assembly includes a redistribution layer (RDL) structure die-attach surface and a bump-attach surface opposite the die-attach surface. A semiconductor die is mounted on the die-attach surface of the redistribution layer (RDL) structure. A first solder mask layer disposed on the die-attach surface, surrounding the semiconductor die. Further, a first conductive bump disposed over the first solder mask, coupled to a first pad of the redistribution layer (RDL) structure through a single circuit structure on a portion the first solder mask layer, wherein a first distance between a center of the first pad and a sidewall of the semiconductor die, which is close to the first pad, is equal to or greater than a second distance between a center of the first conductive bump and the sidewall of the semiconductor die.

Abstract: An optical detecting apparatus for detecting a degree of freedom error of a spindle and has a standard bar and a sensor module, and is assembled between a spindle and a rotating platform of a powered machinery. The standard bar has a rod lens and a reflection face. The sensor module has two detecting groups, an oblique laser head, and a reflected spot displacement sensor. Each detecting group emits a laser light through the rod lens along the X-axis and the Y-axis of the powered machinery. The oblique laser head emits an oblique laser light to the reflected spot displacement sensor. When the spindle of the powered machinery generates errors after rotating, the sensor module receives the changes of the laser lights to obtain the displacement change signals of the standard bar for a calculation unit to detect the errors between the spindle and the rotating platform.

Abstract: A semiconductor chip package assembly includes a package substrate having a chip mounting surface; a plurality of solder pads disposed on the chip mounting surface; a first dummy pad and a second dummy pad spaced apart from the first dummy pad disposed on the chip mounting surface; a solder mask on the chip mounting surface and partially covering the solder pads, the first dummy pad, and the second dummy pad; a chip package mounted on the chip mounting surface and electrically connected to the package substrate through a plurality of solder balls on respective said solder pads; a discrete device having a first terminal and a second terminal disposed between the chip package and the package substrate; a first solder connecting the first terminal with the first dummy pad and the chip package; and a second solder connecting the second terminal with the second dummy pad and the chip package.

Abstract: Various structures of a semiconductor package assembly are provided. In one implementation, a semiconductor package assembly includes a redistribution layer (RDL) structure die-attach surface and a bump-attach surface opposite the die-attach surface. A semiconductor die is mounted on the die-attach surface of the redistribution layer (RDL) structure. A first solder mask layer disposed on the die-attach surface, surrounding the semiconductor die. Further, a first conductive bump disposed over the first solder mask, coupled to a first pad of the redistribution layer (RDL) structure through a single circuit structure on a portion the first solder mask layer, wherein a first distance between a center of the first pad and a sidewall of the semiconductor die, which is close to the first pad, is equal to or greater than a second distance between a center of the first conductive bump and the sidewall of the semiconductor die.

Abstract: An RDL structure on a passivation layer includes a first landing pad disposed directly above a first on-chip metal pad; a first via in a passivation layer to electrically connect the first landing pad with the first on-chip metal pad; a second landing pad disposed directly above the second on-chip metal pad; a second via in the passivation layer to electrically connect the second landing pad with the second on-chip metal pad; and at least five traces being disposed on the passivation layer and passing through a space between the first landing pad and the second landing pad.

Abstract: The invention provides a semiconductor package. The semiconductor package includes a lead frame including a die paddle. A supporting bar connects to the die paddle, extending in an outward direction from the die paddle. At least two power leads are separated from the die paddle and the supporting bar, having first terminals close to the die paddle and second terminals extending outward from the die paddle. A power bar connects to the at least two power leads, having a supporting portion. A molding material encapsulates the lead frame leaving the supporting portion exposed.

Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a redistribution layer (RDL) structure die-attach surface and a bump-attach surface opposite the die-attach surface. A semiconductor die is mounted on the die-attach surface of the redistribution layer (RDL) structure. A first solder mask layer is disposed on the die-attach surface. The first solder mask layer surrounds the semiconductor die. An additional circuit structure is disposed on a portion of the first solder mask, surrounding the semiconductor die. The additional circuit structure includes a pad portion having a first width and a via portion has a second width that is less than the first width. The via portion passes through the first solder mask layer to be coupled the redistribution layer (RDL) structure.

Abstract: An RDL structure on a passivation layer includes a first landing pad disposed directly above a first on-chip metal pad; a first via in a passivation layer to electrically connect the first landing pad with the first on-chip metal pad; a second landing pad disposed directly above the second on-chip metal pad; a second via in the passivation layer to electrically connect the second landing pad with the second on-chip metal pad; and at least five traces being disposed on the passivation layer and passing through a space between the first landing pad and the second landing pad.

Abstract: A semiconductor chip package assembly includes a package substrate having a chip mounting surface; a plurality of solder pads disposed on the chip mounting surface; a first dummy pad and a second dummy pad spaced apart from the first dummy pad disposed on the chip mounting surface; a solder mask on the chip mounting surface and partially covering the solder pads, the first dummy pad, and the second dummy pad; a chip package mounted on the chip mounting surface and electrically connected to the package substrate through a plurality of solder balls on respective said solder pads; a discrete device having a first terminal and a second terminal disposed between the chip package and the package substrate; a first solder connecting the first terminal with the first dummy pad and the chip package; and a second solder connecting the second terminal with the second dummy pad and the chip package.

Abstract: An RDL structure on a passivation layer includes a first landing pad disposed directly above a first on-chip metal pad; a first via in a passivation layer to electrically connect the first landing pad with the first on-chip metal pad; a second landing pad disposed directly above the second on-chip metal pad; a second via in the passivation layer to electrically connect the second landing pad with the second on-chip metal pad; and at least five traces being disposed on the passivation layer and passing through a space between the first landing pad and the second landing pad.

Abstract: The invention provides a semiconductor package assembly. The semiconductor package assembly includes a redistribution layer (RDL) structure die-attach surface and a bump-attach surface opposite the die-attach surface. A semiconductor die is mounted on the die-attach surface of the redistribution layer (RDL) structure. A first solder mask layer is disposed on the die-attach surface. The first solder mask layer surrounds the semiconductor die. An additional circuit structure is disposed on a portion of the first solder mask, surrounding the semiconductor die. The additional circuit structure includes a pad portion having a first width and a via portion has a second width that is less than the first width. The via portion passes through the first solder mask layer to be coupled the redistribution layer (RDL) structure.

Abstract: The invention provides a semiconductor package. The semiconductor package includes a lead frame including a die peddle. A supporting bar connects to the die peddle, extending in an outward direction from the die peddle. At least two power leads are separated from the die peddle and the supporting bar, having first terminals close to the die peddle and second terminals extending outward from the die peddle. A power bar connects to the at least two power leads, having a supporting portion. A molding material encapsulates the lead frame leaving the supporting portion exposed.

Abstract: A semiconductor package assembly includes a first semiconductor package. The first semiconductor package includes a first body having a first device-attach surface and a first bump-attach surface opposite to the first device-attach surface. A second semiconductor package is bonded to the first device-attach surface of the first semiconductor package. The second package includes a second body having a second device-attach surface and a second bump-attach surface opposite to the second device-attach surface. A dynamic random access memory (DRAM) device is mounted on the second device-attach surface. A decoupling capacitor is mounted on the second device-attach surface. Conductive structures are disposed on the second bump-attach surface of the second package, connecting to the first bump-attach surface of the first body of the first semiconductor package.