Abstract: A cooling system for a heterogeneous integrated semiconductor package structure is disclosed. The heterogeneous integrated semiconductor package structure is arranged on a circuit board. The cooling system may include a cooling component. The cooling component may be arranged on the heterogeneous integrated semiconductor package structure, and is configured to dissipate heat from the heterogeneous integrated semiconductor package structure by using a cooling fluid.

Abstract: A cooling module for a heterogeneous integrated semiconductor package structure is disclosed. The heterogeneous integrated semiconductor package structure is arranged on a circuit board. The cooling module includes a cooling plate and a plurality of nanowires. The nanowires may be configured to be bonded to the cooling plate, or may be configured to bond the cooling plate to the heterogeneous integrated semiconductor package structure, or may be configured to bond the cooling plate to the circuit board, or may be configured to bond the cooling plate to both the heterogeneous integrated semiconductor package structure and the circuit board.

Abstract: A transparent electromagnetic wave focusing device is provided, which includes a plurality of metamaterial unit cells arranged to form a metamaterial array plate, and each metamaterial unit cell includes a plurality of metal layers and a plurality of transparent substrates stacked alternately. Each of the metal layers has a comb-tooth pattern, and the plurality of metamaterial unit cells correspond to a plurality of comb-tooth pattern combinations, respectively. The metamaterial array plate has an incident surface and an exit surface opposite to each other, and for an incident electromagnetic wave with a predetermined operating frequency band incident from the incident surface, the metamaterial unit cells correspond to a plurality of compensation phase differences, such that the incident electromagnetic wave that passes through the exit surface are focused on a reference point. The comb-tooth pattern combinations vary with the corresponding compensation phase differences.

Abstract: Present disclosure provides a transistor structure, including a substrate, a first gate extending along a longitudinal direction over the substrate, the first gate including a gate electrode, a second gate over the substrate and apart from the first gate, a source region of a first conductivity type in the substrate, aligning to an edge in proximity to a side of the first gate, a P-type well surrounding the source region, a drain region of the first conductivity type in the substrate, an N-type well surrounding the drain region, the second gate is entirely within a vertical projection area of the N-type well and a bottom surface of the P-type well and a bottom surface of the N-type well are substantially at a same depth from the first gate.

Abstract: A computing system is disclosed. The computing system includes a housing configured to receive a plurality of electronic components including a first electronic component and a second electronic component; and a divider wall assembly mounted to the housing to separate the first electronic component from the second electronic component. The divider wall assembly includes a plurality of sheets including a first sheet and a second sheet, each sheet of the plurality of sheets having a sheet through-hole, a coupling rod positioned between the first and second sheets, the coupling rod having a flat surface formed between cylindrical ends, the coupling rod having a rod through-hole on the flat surface, the rod through-hole being perpendicular to an axis of the coupling rod, and a fastener fixedly attaching the plurality of sheets and the coupling rod, the fastener being inserted through the sheet through-hole of each sheet and the rod through-hole.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a first well region, a second well region, and a third well region disposed within a semiconductor substrate. The second well region is disposed between the first and second well regions. A first source/drain region is in the first well region. A second source/drain region is in the second well region. A gate structure is on the semiconductor substrate and spaced laterally between the first and second source/drain regions. A contact region is disposed in the third well region. A conductive structure is on the semiconductor substrate and spaced laterally between the second source/drain region and the contact region.

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.

Abstract: An antenna system includes a dielectric substrate, a ground element, and a first antenna element. The dielectric substrate has a first surface and a second surface, which are opposite to each other. The ground element is disposed on the first surface of the dielectric substrate. The first antenna element includes a first radiation element, a feeding radiation element, a second radiation element, and a shorting radiation element. The first radiation element has a feeding point, and is disposed on the second surface of the dielectric substrate. The feeding radiation element is adjacent to the first radiation element. The second radiation element is coupled to the feeding radiation element. The second radiation element is further coupled through the shorting radiation element to the ground element.

Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a semiconductor substrate having a device substrate overlying a handle substrate and an insulator layer disposed between the device substrate and the handle substrate. A gate electrode overlies the device substrate between a drain region and a source region. A conductive via extends through the device substrate and the insulator layer to contact the handle substrate. A first isolation structure is disposed within the device substrate and comprises a first isolation segment disposed laterally between the gate electrode and the conductive via. A contact region is disposed within the device substrate between the first isolation segment and the conductive via. A conductive gate electrode directly overlies the first isolation segment and is electrically coupled to the contact region.

Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

Abstract: Example methods are provided to improve placement of an adaptor (210,220) to a mobile computing device (100) to measure a test strip (221) coupled to the adaptor (220) with a camera (104) and a screen (108) on a face of the mobile computing device (100). The method may include displaying a light area on a first portion of the screen (108). The first portion may be adjacent to the camera (104). The light area and the camera (104) may be aligned with a key area of the test strip (221) so that the camera (104) is configured to capture an image of the key area. The method may further include providing first guiding information for a user to place the adaptor (210,220) to the mobile computing device (100) according to a position of the light area on the screen (108).

Abstract: A transparent electromagnetic wave focusing device is provided, which includes a plurality of metamaterial unit cells arranged to form a metamaterial array plate, and each metamaterial unit cell includes a plurality of metal layers and a plurality of transparent substrates stacked alternately. Each of the metal layers has a comb-tooth pattern, and the plurality of metamaterial unit cells correspond to a plurality of comb-tooth pattern combinations, respectively. The metamaterial array plate has an incident surface and an exit surface opposite to each other, and for an incident electromagnetic wave with a predetermined operating frequency band incident from the incident surface, the metamaterial unit cells correspond to a plurality of compensation phase differences, such that the incident electromagnetic wave that passes through the exit surface are focused on a reference point. The comb-tooth pattern combinations vary with the corresponding compensation phase differences.

Abstract: A data auto-backup system includes a main server and a terminal device. The main server includes a registered account, and the terminal device includes an application connected to the main server. When the application of the terminal device detects a registered portable storage device connected to the connection port, the application reads a local file stored in the registered portable storage device, and uploads the local file to the registered account in the main server as a cloud backup file. As a result, the terminal device automatically backs up the local file of the registered portable storage device to the main server whenever the registered portable storage device is connected, saving the user from manual backup steps, and preventing valuable data from missing. Furthermore, a software solution to encrypt data in the portable devices is employed without introducing any hardware to the existing portable devices.

Abstract: An antenna module and a wireless transceiver device are provided. The wireless transceiver device includes an antenna module. The antenna module includes a circuit board and at least one antenna array. The at least one antenna array defines a midline. The at least one antenna array includes a plurality of antenna elements and a signal feeding line. Each antenna element includes a feeding branch and a radiating portion. The radiating portion is coupling to the feeding branch, and the radiating portion is exposed on the upper surface of the circuit board. The signal feeding line is arranged in the circuit board and is perpendicular to the midline, and the signal feeding line is coupling to the feeding branch. The radiating portion defines an extension line along its extension direction. There is an included angle between the extension line and the midline.

Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.

Abstract: A supplementary mechanism that provides a temperature rise and fall effect to a machine tool spindle is mainly used to connect to pipelines between a machine tool spindle and a cooling device. The present invention provides an additional heating function to the spindle of the machine tool that originally has a cooling device, and still retains its original cooling function. The supplementary mechanism can provide the effect of raising and lowering the temperature. When cooling, the liquid provided by the cooling device is passed to directly cool the machine tool spindle. When raising the temperature, the flow path is switched, so that the liquid of the cooling device cannot flow to the machine tool spindle, and the liquid flowing out of the machine tool spindle forms an independent circulation channel, and the supplementary mechanism heats the liquid in the independent circulation channel, achieving the effect of rapid heating.

Abstract: The present invention discloses a UV sterilization fresh-keeping box, including an accommodating box and a UV sterilization device removably disposed on a top side of the accommodating box. The accommodating box includes a box body with a storage space, and a lid disposed on the box body. The lid has a light transmission part to allow UV light to pass through, and a first assembling part disposed on a peripheral side of the light transmission part. The UV sterilization device includes a case, a UV module disposed in the case, a control module electrically connected to the UV module, and a second assembling part disposed on a bottom side of the case. The UV sterilization device is mounted onto the lid by combining the second assembling part with the first assembling part. The UV module is controlled by the control module to emit UV light towards the light transmission part, so as to sterilize the storage space.

Abstract: An antenna system includes a dielectric substrate, a ground element, and a first antenna element. The dielectric substrate has a first surface and a second surface, which are opposite to each other. The ground element is disposed on the first surface of the dielectric substrate. The first antenna element includes a first radiation element, a feeding radiation element, a second radiation element, and a shorting radiation element. The first radiation element has a feeding point, and is disposed on the second surface of the dielectric substrate. The feeding radiation element is adjacent to the first radiation element. The second radiation element is coupled to the feeding radiation element. The second radiation element is further coupled through the shorting radiation element to the ground element.

Abstract: The disclosure provides a liquid-cooling heat dissipation device. The liquid-cooling heat dissipation device is configured to be in thermal contact with an expansion card. The liquid-cooling heat dissipation device includes a base plate, a thermally-conductive component and a heat exchanger. The base plate is configured to be mounted on the expansion card. The thermally-conductive component is mounted on the base plate. The thermally-conductive component and the base plate together form a liquid chamber therebetween. The heat exchanger is mounted on the base plate and connected to the liquid chamber.