Patents by Inventor Tung Yang
Tung Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11843173Abstract: An antenna module and a wireless transceiver device are provided. The wireless transceiver device includes an antenna module. The antenna module includes a circuit board and at least one antenna array. The at least one antenna array defines a midline. The at least one antenna array includes a plurality of antenna elements and a signal feeding line. Each antenna element includes a feeding branch and a radiating portion. The radiating portion is coupling to the feeding branch, and the radiating portion is exposed on the upper surface of the circuit board. The signal feeding line is arranged in the circuit board and is perpendicular to the midline, and the signal feeding line is coupling to the feeding branch. The radiating portion defines an extension line along its extension direction. There is an included angle between the extension line and the midline.Type: GrantFiled: October 20, 2021Date of Patent: December 12, 2023Assignee: WISTRON NEWEB CORPORATIONInventors: Chih-Hsiang Liu, Tsun-Che Huang, Wei-Tung Yang
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Patent number: 11841771Abstract: A data auto-backup system includes a main server and a terminal device. The main server includes a registered account, and the terminal device includes an application connected to the main server. When the application of the terminal device detects a registered portable storage device connected to the connection port, the application reads a local file stored in the registered portable storage device, and uploads the local file to the registered account in the main server as a cloud backup file. As a result, the terminal device automatically backs up the local file of the registered portable storage device to the main server whenever the registered portable storage device is connected, saving the user from manual backup steps, and preventing valuable data from missing. Furthermore, a software solution to encrypt data in the portable devices is employed without introducing any hardware to the existing portable devices.Type: GrantFiled: March 24, 2023Date of Patent: December 12, 2023Assignee: AMARYLLO INC.Inventors: Chao-Tung Yang, Wei-Jen Lee
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Patent number: 11808633Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.Type: GrantFiled: August 16, 2021Date of Patent: November 7, 2023Assignee: ORIENTAL SYSTEM TECHNOLOGY INC.Inventors: Chein-Hsun Wang, Da-Jun Lin, Chun-Chiang Chen, Chih-Yung Tsai, Yu-Chih Liang, Ming Le, Chen-Tang Huang, Tung-Yang Lee, Jenping Ku
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Patent number: 11724348Abstract: A supplementary mechanism that provides a temperature rise and fall effect to a machine tool spindle is mainly used to connect to pipelines between a machine tool spindle and a cooling device. The present invention provides an additional heating function to the spindle of the machine tool that originally has a cooling device, and still retains its original cooling function. The supplementary mechanism can provide the effect of raising and lowering the temperature. When cooling, the liquid provided by the cooling device is passed to directly cool the machine tool spindle. When raising the temperature, the flow path is switched, so that the liquid of the cooling device cannot flow to the machine tool spindle, and the liquid flowing out of the machine tool spindle forms an independent circulation channel, and the supplementary mechanism heats the liquid in the independent circulation channel, achieving the effect of rapid heating.Type: GrantFiled: May 13, 2020Date of Patent: August 15, 2023Assignee: SURPASS WORLD TECHNOLOGY CO., LTD.Inventors: Chun-Hsien Chu, Tung-Yang Lee
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Publication number: 20230232871Abstract: The present invention discloses a UV sterilization fresh-keeping box, including an accommodating box and a UV sterilization device removably disposed on a top side of the accommodating box. The accommodating box includes a box body with a storage space, and a lid disposed on the box body. The lid has a light transmission part to allow UV light to pass through, and a first assembling part disposed on a peripheral side of the light transmission part. The UV sterilization device includes a case, a UV module disposed in the case, a control module electrically connected to the UV module, and a second assembling part disposed on a bottom side of the case. The UV sterilization device is mounted onto the lid by combining the second assembling part with the first assembling part. The UV module is controlled by the control module to emit UV light towards the light transmission part, so as to sterilize the storage space.Type: ApplicationFiled: January 20, 2023Publication date: July 27, 2023Inventors: Tung-Yang Wu, Shih-Yi Chang, Hsuan-Hui Wang
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Publication number: 20230223689Abstract: An antenna system includes a dielectric substrate, a ground element, and a first antenna element. The dielectric substrate has a first surface and a second surface, which are opposite to each other. The ground element is disposed on the first surface of the dielectric substrate. The first antenna element includes a first radiation element, a feeding radiation element, a second radiation element, and a shorting radiation element. The first radiation element has a feeding point, and is disposed on the second surface of the dielectric substrate. The feeding radiation element is adjacent to the first radiation element. The second radiation element is coupled to the feeding radiation element. The second radiation element is further coupled through the shorting radiation element to the ground element.Type: ApplicationFiled: August 8, 2022Publication date: July 13, 2023Inventors: Wei-Tung YANG, Tsun-Che HUANG
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Patent number: 11602076Abstract: The disclosure provides a liquid-cooling heat dissipation device. The liquid-cooling heat dissipation device is configured to be in thermal contact with an expansion card. The liquid-cooling heat dissipation device includes a base plate, a thermally-conductive component and a heat exchanger. The base plate is configured to be mounted on the expansion card. The thermally-conductive component is mounted on the base plate. The thermally-conductive component and the base plate together form a liquid chamber therebetween. The heat exchanger is mounted on the base plate and connected to the liquid chamber.Type: GrantFiled: January 29, 2020Date of Patent: March 7, 2023Assignee: COOLER MASTER CO., LTD.Inventor: Tung-Yang Shieh
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Publication number: 20230047601Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. The conversion from wrist temperature to body core temperature uses detected ambient temperature and fixed humidity or imported humidity level to calculate the body core temperature based on experimental data and curve fitting. The skin temperature compensation can be set differently for different sex gender, different standard deviation of wrist temperature and external relative humidity reading.Type: ApplicationFiled: August 16, 2021Publication date: February 16, 2023Inventors: Chein-Hsun WANG, Da-Jun LIN, Chun-Chiang CHEN, Chih-Yung TSAI, Yu-Chih LIANG, Ming LE, Chen-Tang HUANG, Tung-Yang LEE, Jenping KU
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Publication number: 20230027808Abstract: A safe sterilization unit includes a bearing portion, a light source portion and at least one safety switch. The bearing portion includes two surfaces corresponding to each other; the light source portion is configured to generate sterilization light, and is disposed on one surface of the bearing portion; and the safety switch is disposed on one side surface, provided with the light source portion, of the bearing portion, and is connected with the light source portion. The safety switch is disposed to sense light to generate a sensing message, and to regulate power supply of the light source portion according to the sensing message.Type: ApplicationFiled: July 22, 2022Publication date: January 26, 2023Inventors: Hsuan-Hui Wang, Shih-Yi Chang, Jung-Chen Liao, Tung-Yang Wu
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Publication number: 20230014120Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a semiconductor substrate having a device substrate overlying a handle substrate and an insulator layer disposed between the device substrate and the handle substrate. A gate electrode overlies the device substrate between a drain region and a source region. A conductive via extends through the device substrate and the insulator layer to contact the handle substrate. A first isolation structure is disposed within the device substrate and comprises a first isolation segment disposed laterally between the gate electrode and the conductive via. A contact region is disposed within the device substrate between the first isolation segment and the conductive via. A conductive gate electrode directly overlies the first isolation segment and is electrically coupled to the contact region.Type: ApplicationFiled: September 21, 2022Publication date: January 19, 2023Inventors: Hsin-Chih Chiang, Tung-Yang Lin, Ruey-Hsin Liu, Ming-Ta Lei
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Publication number: 20220416435Abstract: An antenna module and a wireless transceiver device are provided. The wireless transceiver device includes an antenna module. The antenna module includes a circuit board and at least one antenna array. The at least one antenna array defines a midline. The at least one antenna array includes a plurality of antenna elements and a signal feeding line. Each antenna element includes a feeding branch and a radiating portion. The radiating portion is coupling to the feeding branch, and the radiating portion is exposed on the upper surface of the circuit board. The signal feeding line is arranged in the circuit board and is perpendicular to the midline, and the signal feeding line is coupling to the feeding branch. The radiating portion defines an extension line along its extension direction. There is an included angle between the extension line and the midline.Type: ApplicationFiled: October 20, 2021Publication date: December 29, 2022Inventors: CHIH-HSIANG LIU, TSUN-CHE HUANG, WEI-TUNG YANG
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Patent number: 11532701Abstract: A semiconductor isolation structure includes a handle layer, a buried insulation layer, a semiconductor layer, a deep trench isolation structure, and a heavy doping region. The buried insulation layer is disposed on the handle layer. The semiconductor layer is disposed on the buried insulation layer and has a doping type. The semiconductor layer has a functional area in which doped regions of a semiconductor device are to be formed. The deep trench isolation structure penetrates the semiconductor layer and the buried insulation layer, and surrounds the functional area. The heavy doping region is formed in the semiconductor layer, is disposed between the functional area and the deep trench isolation structure, and is surrounded by the deep trench isolation structure. The heavy doping region has the doping type. A doping concentration of the heavy doping region is higher than that of the semiconductor layer.Type: GrantFiled: March 11, 2021Date of Patent: December 20, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hsin-Fu Lin, Tsung-Hao Yeh, Chien-Hung Liu, Shiang-Hung Huang, Chih-Wei Hung, Tung-Yang Lin, Ruey-Hsin Liu, Chih-Chang Cheng
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Patent number: 11508757Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a semiconductor substrate having a device substrate overlying a handle substrate and an insulator layer disposed between the device substrate and the handle substrate. A gate electrode overlies the device substrate between a drain region and a source region. A conductive via extends through the device substrate and the insulator layer to contact the handle substrate. A first isolation structure is disposed within the device substrate and comprises a first isolation segment disposed laterally between the gate electrode and the conductive via. A contact region is disposed within the device substrate between the first isolation segment and the conductive via. A conductive gate electrode directly overlies the first isolation segment and is electrically coupled to the contact region.Type: GrantFiled: May 18, 2021Date of Patent: November 22, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hsin-Chih Chiang, Tung-Yang Lin, Ruey-Hsin Liu, Ming-Ta Lei
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Publication number: 20220359750Abstract: Present disclosure provides a transistor structure, including a substrate, a first gate extending along a longitudinal direction over the substrate, the first gate including a gate electrode, a second gate over the substrate and apart from the first gate, a source region of a first conductivity type in the substrate, aligning to an edge in proximity to a side of the first gate. a P-type well surrounding the source region, a drain region of the first conductivity type in the substrate, an N-type well surrounding the drain region, the second gate is entirely within a vertical projection area of the N-type well and a bottom surface of the P-type well and a bottom surface of the N-type well are substantially at a same depth from the first gate.Type: ApplicationFiled: July 27, 2022Publication date: November 10, 2022Inventors: TUNG-YANG LIN, HSUEH-LIANG CHOU
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Publication number: 20220341789Abstract: An infrared thermopile sensor includes a silicon cover having an infrared lens, an infrared sensing chip having duo-thermopile sensing elements, and a microcontroller chip calculating a temperature of an object. The components are in a stacked 3D package to decrease the size of the infrared thermopile sensor. The infrared sensing chip and the microcontroller chip have metal layers to shield the thermal radiation. To measure object temperature accurately under acute change in environmental temperature, this disclosure uses the duo-thermopile sensing elements, that one is the active unit for measuring the object temperature and another one is the dummy unit for compensating the effect from the package structure.Type: ApplicationFiled: May 20, 2021Publication date: October 27, 2022Inventors: Wen-Chie HUANG, Yu-Chih LIANG, Chein-Hsun WANG, Ming LE, Chen-Tang HUANG, Chein-Hsing YU, Tung-Yang LEE, Jenping KU
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Patent number: 11456380Abstract: Present disclosure provides a transistor structure, including a substrate, a first gate over the substrate, a second gate over the substrate and laterally in contact with the first gate, a first conductive region of a first conductivity type in the substrate, self-aligning to a side of the first gate, and a second conductive region of the first conductivity type in the substrate, self-aligning to a side of the second gate. A method for manufacturing the transistor structure is also disclosed.Type: GrantFiled: March 21, 2017Date of Patent: September 27, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Tung-Yang Lin, Hsueh-Liang Chou
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Publication number: 20220293723Abstract: A semiconductor isolation structure includes a handle layer, a buried insulation layer, a semiconductor layer, a deep trench isolation structure, and a heavy doping region. The buried insulation layer is disposed on the handle layer. The semiconductor layer is disposed on the buried insulation layer and has a doping type. The semiconductor layer has a functional area in which doped regions of a semiconductor device are to be formed. The deep trench isolation structure penetrates the semiconductor layer and the buried insulation layer, and surrounds the functional area. The heavy doping region is formed in the semiconductor layer, is disposed between the functional area and the deep trench isolation structure, and is surrounded by the deep trench isolation structure. The heavy doping region has the doping type. A doping concentration of the heavy doping region is higher than that of the semiconductor layer.Type: ApplicationFiled: March 11, 2021Publication date: September 15, 2022Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Hsin-Fu LIN, Tsung-Hao YEH, Chien-Hung LIU, Shiang-Hung HUANG, Chih-Wei HUNG, Tung-Yang LIN, Ruey-Hsin LIU, Chih-Chang CHENG
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Patent number: 11408781Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.Type: GrantFiled: June 14, 2019Date of Patent: August 9, 2022Assignee: ORIENTAL SYSTEM TECHNOLOGY INC.Inventors: Chein-Hsun Wang, Ming Le, Yu-Chih Liang, Tung Yang Lee, Chih-Yung Tsai
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Publication number: 20220223625Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a semiconductor substrate having a device substrate overlying a handle substrate and an insulator layer disposed between the device substrate and the handle substrate. A gate electrode overlies the device substrate between a drain region and a source region. A conductive via extends through the device substrate and the insulator layer to contact the handle substrate. A first isolation structure is disposed within the device substrate and comprises a first isolation segment disposed laterally between the gate electrode and the conductive via. A contact region is disposed within the device substrate between the first isolation segment and the conductive via. A conductive gate electrode directly overlies the first isolation segment and is electrically coupled to the contact region.Type: ApplicationFiled: May 18, 2021Publication date: July 14, 2022Inventors: Hsin-Chih Chiang, Tung-Yang Lin, Ruey-Hsin Liu, Ming-Ta Lei
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Patent number: 11114134Abstract: A holding bracket includes a frame body, an elastic rib, a stopping block and a cover plate. The frame body is formed with a holding space for holding a loaded object such as a hard disk. One end of the elastic rib is connected to the frame body, and the other end is a free end. The stopping block is protrusively formed on one surface of the elastic rib facing away from the holding space, and is located at the free end. The cover plate is pivotally connected to one end of the frame body.Type: GrantFiled: May 21, 2020Date of Patent: September 7, 2021Assignee: CHENBRO MICOM CO., LTD.Inventors: Chien-Wen Wang, Tung-Yang Hu, Cheng-Yung Tsai