Abstract: A reconfigurable missile launcher that avoids some of the costs and disadvantages associated with missile launchers in the prior art. In particular, the illustrative embodiment of the present invention uses a variable-size receptacle for locating and holding a missile canister chosen from a set of missile canister types. The illustrative embodiment also includes a controller that includes data sets that are specific to each of a plurality of missile types.

Abstract: A Doherty amplifier that includes a main amplifier device and an auxiliary amplifier device. The main amplifier device includes a plurality of independently controllable amplifier segments. The system further includes a coupler for coupling an input signal to each of the main amplifier device and the auxiliary amplifier device. The system further includes an impedance inverter for power combining an output signal of the main amplifier device with an output signal of the auxiliary amplifier device.

Abstract: The present system for providing presence enabled call forwarding serves to pass presence and supervision information relating to a user's wireless station set between a cellular communication network and an enterprise communication network, which typically includes a Private Branch Exchange system. The user is provided with the ability to control the forwarding of calls from the enterprise communication network to their cell phone. The user receives a query from the presence system when they activate their cell phone to indicate the availability of call forwarding blocking. The user can update their presence information to indicate that their cell phone is available to receive incoming calls directed to the cell phone, but not available to receive incoming calls that are forwarded from the enterprise communication network.

Abstract: Wire bond pad and solder ball or controlled collapse chip connections C4 are combined on a planar surface of a an integrated circuit device to provide a die. Known good die (KGD) testing is optionally performed using wire bond connections or stress tolerant solder ball connections. The KGD testing is conducted after the integrated circuit dies are diced from a wafer. Solder ball or C4 array connections which withstand thermal stress are used to KGD test the die prior to final use of the wire bond pad connections to an end use device. Alternatively, wire bond pads are used to test the die while maintaining the solder ball or C4 array in a pristine condition for bonding to a final end product device. Both testing with the solder ball C4 array contacts and with the wire bond connections provides metallurgical connections for the KGD test. The solder ball or C4 array is connected to the wire bond pads and either connection can be used to burn-in test the die.

Abstract: Speech recognition technology is used to review voice communications directed to a party for targeted information (e.g., telephone number, URL, e-mail address) and, if the information is identified, the party may invoke a connection option and/or delivery option as may be appropriate. Connection options enable the party to initiate a connection (or “call,” in the case of a telephone number) to a communication device associated with the targeted information. Delivery options enable the party to receive a text message including the targeted information.

Abstract: A method for an adaptive equalization apparatus in a multiple-link hopping radio system includes hopping among a plurality of radio links to receive variable-length bursts of radio signals on the plurality of radio links and equalizing amplitude and phase variations of a slow channel for each radio link from a received burst on the radio link. Further, the method includes storing the estimated tap coefficients pertinent to each radio link and using the tap weights of the current burst of the radio link to reliably pre-compensate the channel amplitude and phase distortion of a next received burst on the radio link.

Abstract: A method for an adaptive equalization apparatus in a multiple-link hopping radio system includes hopping among a plurality of radio links to receive variable-length bursts of radio signals on the plurality of radio links and equalizing amplitude and phase variations of a slow channel for each radio link from a received burst on the radio link. Further, the method includes storing the estimated tap coefficients pertinent to each radio link and using the tap weights of the current burst of the radio link to reliably pre-compensate the channel amplitude and phase distortion of a next received burst on the radio link.

Abstract: A method for a carrier phase recovery apparatus in a multiple-link hopping radio system includes hopping among a plurality of radio links to receive bursts of radio signals on the plurality of radio links and determining channel information for each radio link from a received burst on the radio link. Further, the method includes storing the determined channel information and using the determined channel information for the radio link to reliably recover the carrier phase of a next received burst on the radio link.

Abstract: Wire bond pad and solder ball or controlled collapse chip connections C4 are combined on a planar surface of a an integrated circuit device to provide a die. Known good die (KGD) testing is optionally performed using wire bond connections or stress tolerant solder ball connections. The KGD testing is conducted after the integrated circuit dies are diced from a wafer. Solder ball or C4 array connections which withstand thermal stress are used to KGD test the die prior to final use of the wire bond pad connections to an end use device. Alternatively, wire bond pads are used to test the die while maintaining the solder ball or C4 array in a pristine condition for bonding to a final end product device. Both testing with the solder ball C4 array contacts and with the wire bond connections provides metallurgical connections for the KGD test. The solder ball or C4 array is connected to the wire bond pads and either connection can be used to burn-in test the die.

Abstract: Wire bond pad and solder ball or controlled collapse chip connections C4 are combined on a planar surface of a an integrated circuit device to provide a die. Known good die (KGD) testing is optionally performed using wire bond connections or stress tolerant solder ball connections. The KGD testing is conducted after the integrated circuit dies are diced from a wafer. Solder ball or C4 array connections which withstand thermal stress are used to KGD test the die prior to final use of the wire bond pad connections to an end use device. Alternatively, wire bond pads are used to test the die while maintaining the solder ball or C4 array in a pristine condition for bonding to a final end product device. Both testing with the solder ball C4 array contacts and with the wire bond connections provides metallurgical connections for the KGD test. The solder ball or C4 array is connected to the wire bond pads and either connection can be used to burn-in test the die.

Abstract: An in-circuit processor emulator for a computer system that provides a go until system management interrupt command to perform processor emulation until the computer system enters a system management mode during a system management interrupt. The in-circuit processor emulator also provides an enable system management memory command for enabling and disabling access to a system management overlay memory, and an unlock control register command for unlocking a set of control registers in an input/output and power control circuit in the computer system. The commands enable development and debug of system management mode power control functions.