Patents by Inventor Tze-Yang Yeh

Tze-Yang Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240060729
    Abstract: A liquid-cooling heat dissipation plate with pin-fins and an enclosed liquid cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of rhombus-shaped pin-fins, and a plurality of ellipse-shaped pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface opposite to each other. The first heat dissipation surface is in contact with a heat source, and the second heat dissipation surface is in contact with a cooling fluid. The rhombus-shaped pin-fins and the ellipse-shaped pin-fins are integrally formed on the second heat dissipation surface and in a high density arrangement. The ellipse-shaped pin-fins correspond in position to a relative low temperature region of the heat source, and the rhombus-shaped pin-fins correspond in position to a relative high temperature region of the heat source.
    Type: Application
    Filed: August 18, 2022
    Publication date: February 22, 2024
    Inventors: CHING-MING YANG, CHUN-LUNG WU, TZE-YANG YEH
  • Patent number: 11895778
    Abstract: An etching method for manufacturing a substrate structure having a thick electrically conductive layer, and a substrate structure having a thick electrically conductive layer are provided.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: February 6, 2024
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Shih-Hsi Tai, Tung-Ho Tao, Tze-Yang Yeh
  • Publication number: 20240040747
    Abstract: A two-phase immersion-type heat dissipation structure having skived fins is provided. The two-phase immersion-type heat dissipation structure includes an upper cover structure, a lower cover structure, the plurality of skived fins, and a reinforcement frame. The skived fins are integrally formed on an upper surface of the upper cover structure by a skiving process. A bottom surface of the upper cover structure has an upper sintering structure formed thereon, and an upper surface of the lower cover structure has a lower sintering structure formed thereon. A bottom surface of the lower cover structure contacts a heating element immersed in a two-phase coolant. The lower cover structure is correspondingly bonded to the upper cover structure. An inner chamber that is vacuum-sealed is formed between the bottom surface of the upper cover structure and the upper surface of the lower cover structure, and contains liquid therein.
    Type: Application
    Filed: July 27, 2022
    Publication date: February 1, 2024
    Inventors: CHING-MING YANG, CHUN-TE WU, TZE-YANG YEH
  • Publication number: 20230363111
    Abstract: An immersion-type liquid cooling heat dissipation structure is provided. The immersion-type liquid cooling heat dissipation structure includes a metal heat dissipation substrate layer and a metal film layer. The metal film layer is formed on a surface of the metal heat dissipation substrate layer, and is configured to be immersed in an immersion-type coolant. An effective thickness of the metal film layer is less than 500 µm. A surface of the metal film layer has a plurality of micropores that facilitate generation of vapor bubbles. An effective width of each of the plurality of micropores is between 1 µm and 200 µm, and a depth of each of the plurality of micropores is between 100 nm and 50 µm.
    Type: Application
    Filed: May 8, 2022
    Publication date: November 9, 2023
    Inventors: KUO-WEI LEE, CHING-MING YANG, CHI-AN CHEN, TZE-YANG YEH
  • Publication number: 20230332848
    Abstract: A radiator structure is provided. The radiator structure includes a substrate, a first metal coating layer and a second metal coating layer. The first metal coating layer and the second metal coating layer are made of materials different from one another, and are formed on the substrate by different processes. The first metal coating layer is a non-first masking area formed on the substrate by wet processing. The second metal coating layer is a non-second masking area correspondingly formed on the first metal coating layer and the substrate by sputtering. A first masking area and a second masking area are not necessarily the same.
    Type: Application
    Filed: June 17, 2023
    Publication date: October 19, 2023
    Inventors: KUO-WEI LEE, TSUNG-RUEI SUEI, MIN-HORNG LIU, TZE-YANG YEH
  • Patent number: 11761719
    Abstract: A two-phase immersion-type heat dissipation structure having fins with different thermal conductivities is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, and a plurality of fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other. The non-fin surface is configured to be in contact with a heating element immersed in a two-phase coolant. The fin surface is connected with the plurality of fins. At least one of the plurality of fins is a functional fin that is made of a single metal material and has two or more thermal conductivities. A thermal conductivity of a lower portion of the functional fin that is connected with the heat dissipation substrate is lower than thermal conductivities of other portions of the functional fin.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: September 19, 2023
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Ching-Ming Yang, Chun-Te Wu, Tze-Yang Yeh
  • Publication number: 20230292469
    Abstract: A liquid-cooling heat-dissipation structure is provided, which includes a first structure having a plurality of skived fins and a second structure having a plurality of guide fins. The first structure and the second structure are combined to each other, so that a chamber is formed between the first structure and the second structure for receiving a working fluid, and the skived fins and the guide fins are disposed in the chamber.
    Type: Application
    Filed: March 8, 2022
    Publication date: September 14, 2023
    Inventors: CHING-MING YANG, CHENG-SHU PENG, TZE-YANG YEH
  • Publication number: 20230284417
    Abstract: An immersion-type liquid cooling heat dissipation sink is provided. The immersion-type liquid cooling heat dissipation sink includes a heat dissipation substrate layer and a surface film layer. The surface film layer is formed on the heat dissipation substrate layer. The heat dissipation substrate layer is a porous substrate that is immersed in an immersion-type coolant. A contact angle between the surface film layer and the immersion-type coolant is less than a contact angle between the heat dissipation substrate layer and the immersion-type coolant. A thickness of the surface film layer is less than an effective thickness of 5 ?m.
    Type: Application
    Filed: March 3, 2022
    Publication date: September 7, 2023
    Inventors: CHI-AN CHEN, TZE-YANG YEH
  • Publication number: 20230240044
    Abstract: An immersion-type heat dissipation structure and a method for manufacturing the same are provided. The immersion-type heat dissipation structure includes a first heat dissipation member and a second heat dissipation member that has a plurality of heat dissipation columns and is disposed on the first heat dissipation member. The second heat dissipation member has a porous structure, the first heat dissipation member has a solid structure, and a thermal conductivity of the first heat dissipation member is greater than that of the second heat dissipation member. A shortest distance between two bottoms of any two adjacent ones of the heat dissipation columns is between 0.2 mm and 1.2 mm, a minimum diameter of a top surface of the heat dissipation column is between 0.2 mm and 1.2 mm, and a draft angle formed on a side surface of the heat dissipation column is between 1° and 5°.
    Type: Application
    Filed: January 24, 2022
    Publication date: July 27, 2023
    Inventors: CHING-MING YANG, CHENG-SHU PENG, TZE-YANG YEH
  • Publication number: 20230235978
    Abstract: A heat-dissipating substrate with a coating structure is provided. The heat-dissipating substrate includes at least two layers. A base layer is configured to dissipate heat, and one or more sputtered layers are formed on the base layer. The sputtered layer has a corrosion resistant property, a soldering ability, or a sintering ability. A thickness of the sputtered layer is less than 5 ?m.
    Type: Application
    Filed: April 5, 2023
    Publication date: July 27, 2023
    Inventors: MIN-HORNG LIU, TZE-YANG YEH
  • Publication number: 20230227959
    Abstract: A method for manufacturing a patterned surface coating of an automobile heat dissipation device and an automobile heat dissipation device having a patterned surface coating are provided. The method for manufacturing the patterned surface coating of the automobile heat dissipation device includes providing a metal heat dissipation device, and forming a sputtered metal layer that is patterned on an upper surface of the metal heat dissipation device by sputtering, allowing a thickness of the sputtered metal layer to be between 1 ?m and 3 ?m, and allowing the sputtered metal layer to cover an area less than 90% of an area of the upper surface of the metal heat dissipation device.
    Type: Application
    Filed: January 17, 2022
    Publication date: July 20, 2023
    Inventors: Yi-Hsin HUANG, Ching-Ming YANG, Tze-Yang YEH
  • Publication number: 20230230897
    Abstract: A surface modification and joint method for an automobile heat dissipation device and an automobile heat dissipation device having a modified surface are provided. The surface modification and joint method includes providing a metal heat dissipation device, forming a sputtered metal layer that is patterned on a surface of the metal heat dissipation device by sputtering to form a modification area of the metal heat dissipation device so as to modify the surface of the metal heat dissipation device, and jointing a surface of the sputtered metal layer to at least one automobile electronic module by sintering, so that the metal heat dissipation device is thermally coupled to the at least one automobile electronic module.
    Type: Application
    Filed: January 17, 2022
    Publication date: July 20, 2023
    Inventors: YI-HSIN HUANG, CHING-MING YANG, TZE-YANG YEH
  • Publication number: 20230199968
    Abstract: A method for forming a pattern on a substrate structure without using a mask layer and a substrate structure are provided. The method includes providing an electrically insulating substrate structure including a thermally conductive and electrically insulating layer, forming at least one electrically conductive recess by removing one part of the electrically conductive layer by a machining process so as to form a predetermined thickness ratio between a thickness of the electrically conductive recess and a thickness of the electrically conductive layer, and removing another part of the electrically conductive layer that is reserved below the electrically conductive recess so that the electrically conductive recess forms an electrically conductive groove.
    Type: Application
    Filed: December 16, 2021
    Publication date: June 22, 2023
    Inventors: SHIH-HSI TAI, TUNG-HO TAO, TZE-YANG YEH
  • Publication number: 20230199969
    Abstract: An etching method for manufacturing a substrate structure having a thick electrically conductive layer, and a substrate structure having a thick electrically conductive layer are provided.
    Type: Application
    Filed: December 16, 2021
    Publication date: June 22, 2023
    Inventors: SHIH-HSI TAI, TUNG-HO TAO, TZE-YANG YEH
  • Publication number: 20230184498
    Abstract: An immersion-type heat dissipation substrate having a microporous structure is provided. The immersion-type heat dissipation substrate includes a surface having a plurality of micropores for facilitating generation of vapor bubbles. A pore diameter of each of the plurality of micropores is between 5 ?m and 150 ?m, and the plurality of micropores cover 3% to 40% of an area of the surface.
    Type: Application
    Filed: December 14, 2021
    Publication date: June 15, 2023
    Inventors: CHENG-SHU PENG, TZE-YANG YEH
  • Publication number: 20230189475
    Abstract: An immersion-type porous heat dissipation structure is provided. The immersion-type porous heat dissipation structure includes a porous heat dissipation substrate, a macroscopic fin structure, and at least one reinforcement structure. The porous heat dissipation substrate has a porosity greater than 8%, and has a fin surface and a non-fin surface that are opposite to each other. The fin surface is connected to the macroscopic fin structure, and the macroscopic fin structure includes at least one macroscopic fin. The at least one reinforcement structure protrudes from the fin surface, and is connected to and integrated with the fin surface. A ratio of an area of a connecting part between the at least one reinforcement structure and the fin surface to an area of a connecting part between the at least one macroscopic fin and the fin surface is two or more.
    Type: Application
    Filed: December 14, 2021
    Publication date: June 15, 2023
    Inventors: CHING-MING YANG, CHENG-SHU PENG, TZE-YANG YEH
  • Publication number: 20230180435
    Abstract: An immersion-type porous heat dissipation structure is provided. The immersion-type porous heat dissipation structure includes a porous heat dissipation material in a form of a sheet. A surface of the porous heat dissipation material has a plurality of open pores that are configured to generate air bubbles. A 1 mm2 cross-sectional area of the surface of the porous heat dissipation has at least five of the open pores each having a depth greater than 25 ?m.
    Type: Application
    Filed: December 8, 2021
    Publication date: June 8, 2023
    Inventors: CHING-MING YANG, CHENG-SHU PENG, TZE-YANG YEH
  • Publication number: 20230168049
    Abstract: A heat-dissipation substrate structure with high adhesive strength is provided. The heat-dissipation substrate structure includes a heat-dissipation base layer, a functional layer, and a matching layer. The functional layer is formed by sputtering, and has a single layer structure or a multi-layer structure. A thickness of each layer of the functional layer is less than 3 ?m. The matching layer has a single layer structure or a multi-layer structure, and a thickness of each layer of the multi-layer structure of the matching layer is less than 1 ?m. The matching layer is formed by sputtering of one or any two of titanium, titanium alloy, nickel, and nickel alloy. The functional layer and the heat-dissipation base layer are two heterogeneous metal layers, and the matching layer is located between the functional layer and the heat-dissipation base layer.
    Type: Application
    Filed: December 1, 2021
    Publication date: June 1, 2023
    Inventors: TSUNG-RUEI SUEI, TZE-YANG YEH, MIN-HORNG LIU
  • Publication number: 20230160646
    Abstract: An immersion heat dissipation structure is provided. The immersion heat dissipation structure includes a porous metal heat dissipation material, an integrated heat spreader, and a thermal interface material. The porous metal heat dissipation material has a porosity greater than 8%. The porous metal heat dissipation material and the integrated heat spreader have the thermal interface material arranged therebetween so that a thermal connection is formed therebetween. A connection surface of the porous metal heat dissipation material and a connection surface of the thermal interface material have a sealing layer or a sealing material arranged therebetween.
    Type: Application
    Filed: November 19, 2021
    Publication date: May 25, 2023
    Inventors: CHING-MING YANG, CHENG-SHU PENG, TZE-YANG YEH
  • Publication number: 20230152045
    Abstract: A liquid cooling heat dissipation substrate with partial compression reinforcement is provided. The liquid cooling heat dissipation substrate with partial compression reinforcement includes a heat dissipation base and a compression reinforcement structure. The heat dissipation base integrally has an upper surface and a lower surface opposite to each other, and the compression reinforcement structure is partially formed on at least one of the upper surface and the lower surface. A ratio of a sum of an area of an orthogonal projection of the compression reinforcement structure on the upper surface and an area of an orthogonal projection of the compression reinforcement structure on the lower surface to a sum of an area of the upper surface and an area of the lower surface is from 10% to 60%.
    Type: Application
    Filed: November 15, 2021
    Publication date: May 18, 2023
    Inventors: CHENG-SHU PENG, YEN-CHUN LIN, TZE-YANG YEH