Patents by Inventor Tze-Yang Yeh

Tze-Yang Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12289865
    Abstract: A two-phase immersion-cooling heat-dissipation composite structure. The heat-dissipation composite structure includes a heat dissipation base, a plurality of high-thermal-conductivity fins, and at least one high-porosity solid structure. The heat dissipation base has a first surface and a second surface that face away from each other. The second surface of the heat dissipation base is in contact with a heating element immersed in a two-phase coolant. The first surface of the heat dissipation base is connected to the high-thermal-conductivity fins. The at least one high-porosity solid structure is located at the first surface of the heat dissipation base, and is connected and alternately arranged between side walls of two adjacent ones of the high-thermal-conductivity fins. Each of the high-porosity solid structure includes a plurality of closed holes and a plurality of open holes.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: April 29, 2025
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Chun-Te Wu, Ching-Ming Yang, Yu-Wei Chiu, Tze-Yang Yeh
  • Patent number: 12274032
    Abstract: A two-phase immersion-type heat dissipation structure having high density heat dissipation fins is provided. The two-phase immersion-type heat dissipation structure having high density heat dissipation fins includes a heat dissipation substrate, a plurality of sheet-like heat dissipation fins, and a reinforcement structure. A bottom surface of the heat dissipation substrate is in contact with a heating element immersed in a two-phase coolant. The plurality of sheet-like heat dissipation fins are integrally formed on an upper surface of the heat dissipation substrate and arranged in high density. An angle between at least one of the sheet-like heat dissipation fins and the upper surface of the heat dissipation substrate is from 60° to 120°. At least one of the sheet-like heat dissipation fins has a length from 50 mm to 120 mm, a width from 0.1 mm to 0.35 mm, and a height from 2 mm to 8 mm.
    Type: Grant
    Filed: September 14, 2022
    Date of Patent: April 8, 2025
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Tze-Yang Yeh, Ching-Ming Yang, Chun-Te Wu
  • Patent number: 12262511
    Abstract: A two-phase immersion-type heat dissipation device is provided. The two-phase immersion-type heat dissipation device includes a heat dissipation substrate and a plurality of reinforced fins. The heat dissipation substrate has a first surface and a second surface configured to be in contact with a heating element. The first surface is opposite to the second surface and is arranged away from the heating element. The plurality of reinforced fins are integrally formed on the first surface of the heat dissipation substrate, and a thickness of each of the plurality of reinforced fins is less than 1 mm. According to a scanning electron microscopy image of electron backscattered diffraction, a median of local misorientation distribution of the plurality of reinforced fins is greater than 1.6 times a median of local misorientation distribution of the heat dissipation substrate.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: March 25, 2025
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Chun-Te Wu, Ching-Ming Yang, Yu-Wei Chiu, Tze-Yang Yeh
  • Patent number: 12207445
    Abstract: A two-phase immersion-type composite heat dissipation device is provided, which includes a heat dissipation substrate, a plurality of fins, and a surface porous layer. The heat dissipation substrate has a first surface and a second surface. The first surface is configured to be in contact with a heat source, and the second surface is opposite to the first surface and is distant from the heat source. A projection region of the heat dissipation substrate that corresponds to the heat source is defined as a high-temperature region, and a low-temperature region is defined at an outer periphery of the high-temperature region. The fins are opposite to the heat source, and are disposed within the high-temperature region of the second surface of the heat dissipation substrate. The surface porous layer is disposed within a range of the low-temperature region of the heat dissipation substrate.
    Type: Grant
    Filed: January 16, 2023
    Date of Patent: January 21, 2025
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Chun-Te Wu, Ching-Ming Yang, Yu-Wei Chiu, Tze-Yang Yeh
  • Patent number: 12156376
    Abstract: A two-phase immersion-type heat dissipation structure having a porous structure is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, a plurality of fins, and a reinforcement frame. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other, the non-fin surface is configured to be in contact with a heat source immersed in a two-phase coolant, and the fins are integrally formed on the fin surface. A porous structure is covered onto at least one portion of the fin surface and at least one portion of the plurality of fins, and has a porosity of from 10% to 50% and a thickness that is from 0.1 mm to 1 mm. The reinforcement frame is bonded to the heat dissipation substrate and surrounds another one portion of the plurality of fins.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: November 26, 2024
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Ching-Ming Yang, Chun-Te Wu, Tze-Yang Yeh
  • Patent number: 12140386
    Abstract: The heat-dissipating substrate structure includes a base layer and a cold spray coating layer. The cold spray coating layer is formed on a surface of the base layer. The cold spray coating layer is a film formed on the surface of the base layer by spraying a solid-phase metal powder and a high-pressure compressed gas onto the base layer. The solid-phase metal powder at least includes a film-forming powder with an apparent density of 3 to 4 g/cm3 and a median particle diameter (D50) of 30 ?m or less. A maximum depth of a bottom of the cold spray coating layer embedded in the base layer is less than 60 ?m. A cooler contains an internal cooling fin joined to the base layer. An internal coolant passage is defined between the base layer, the internal cooling fin, and an interior of the cooler.
    Type: Grant
    Filed: September 6, 2022
    Date of Patent: November 12, 2024
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Ching-Ming Yang, Tze-Yang Yeh
  • Publication number: 20240344783
    Abstract: A cooling structure having a metal plating layer is provided with a substrate, a first metal plating layer and a second metal plating layer that are made of materials different from each other and formed on the substrate by different processes. The first metal plating layer is formed on the substrate by a wetting process. The second metal plating layer having a thickness ranging from 0.1 ?m to 5 ?m is formed on the first metal plating layer by a sputtering process. The second metal plating layer includes at least three blocks arranged at intervals, and at least two adjacent ones of the at least three blocks have a distance therebetween that is not equal to a distance between another two adjacent ones of the at least three blocks.
    Type: Application
    Filed: April 13, 2023
    Publication date: October 17, 2024
    Inventors: CHING-MING YANG, KUN-LIN CHIH, YI-SHENG LU, TZE-YANG YEH
  • Patent number: 12120845
    Abstract: A liquid-cooling heat dissipation plate with unequal height pin-fins and an enclosed liquid-cooling cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of full-height pin-fins, and a plurality of non-full-height pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that face away from each other, the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid. The full-height and non-full-height pin-fins are formed at the second heat dissipation surface of the heat dissipation plate body. A first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid.
    Type: Grant
    Filed: December 28, 2022
    Date of Patent: October 15, 2024
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Yi-Hsin Huang, Chun-Lung Wu, Kuo-Wei Lee, Tze-Yang Yeh
  • Patent number: 12108574
    Abstract: A two-phase immersion-type heat dissipation structure having fins for facilitating bubble generation is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate, and a plurality of fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other, the non-fin surface is configured to be in contact with a heat source immersed in a two-phase coolant, and the fin surface is connected with the plurality of fins. More than half of the fins are functional fins, and at least one side surface of each of the functional fins and the fin surface have an included angle therebetween that is from 80 degrees to 100 degrees. A center line average roughness (Ra) of the side surface is less than 3 ?m, and a ten-point average roughness (Rz) of the side surface is not less than 12 ?m.
    Type: Grant
    Filed: November 6, 2022
    Date of Patent: October 1, 2024
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Chun-Te Wu, Ching-Ming Yang, Yu-Wei Chiu, Tze-Yang Yeh
  • Publication number: 20240318927
    Abstract: A large-size liquid-cooling cooler for an electric vehicle includes a liquid-cooling cooler body and at least one bonding interface layer. The liquid-cooling cooler body has a projection area greater than 150 cm2, and a cooling flow channel is formed inside the liquid-cooling cooler body for allowing cooling fluid to flow through the cooling flow channel. The at least one bonding interface layer is a cold spray coating layer formed on the liquid-cooling cooler body by cold spraying and corresponds in position to the cooling flow channel. A projection area of the at least one bonding interface layer is greater than 30 cm2, a thickness of the at least one bonding interface layer is between 0.03 mm and 0.25 mm, and a ten-point average roughness (Rz) of a surface of the at least one bonding interface layer is from 30 ?m to 90 ?m.
    Type: Application
    Filed: March 20, 2023
    Publication date: September 26, 2024
    Inventors: TZE-YANG YEH, SHIH-MING CHAN
  • Patent number: 12092406
    Abstract: A two-phase immersion-type heat dissipation structure is provided. The two-phase immersion-type heat dissipation structure includes a heat dissipation substrate and a plurality of non-vertical fins. The heat dissipation substrate has a fin surface and a non-fin surface that face away from each other. The non-fin surface is configured to be in contact with a heating element immersed in a two-phase coolant. The fin surface is connected with the non-vertical fins, a cross-sectional contour of one of the non-vertical fins has a top end point and a bottom end point connected with the fin surface, and the top and bottom end points are opposite to each other. A length of a cross-sectional contour line defined from the top end point to the bottom end point is greater than a perpendicular line length of a perpendicular line defined from the top end point to the fin surface.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: September 17, 2024
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Ching-Ming Yang, Chun-Te Wu, Tze-Yang Yeh
  • Publication number: 20240295371
    Abstract: An immersion-type liquid cooling heat dissipation structure is provided. The immersion-type liquid cooling heat dissipation structure includes a metal heat dissipation substrate layer and a metal film layer. The metal film layer is formed on a surface of the metal heat dissipation substrate layer, and is configured to be immersed in an immersion-type coolant. An effective thickness of the metal film layer is less than 500 ?m. A surface of the metal film layer has a plurality of micropores that facilitate generation of vapor bubbles. An effective width of each of the plurality of micropores is between 1 ?m and 200 ?m, and a depth of each of the plurality of micropores is between 100 nm and 50 ?m.
    Type: Application
    Filed: April 25, 2024
    Publication date: September 5, 2024
    Inventors: KUO-WEI LEE, CHING-MING YANG, CHI-AN CHEN, TZE-YANG YEH
  • Publication number: 20240280332
    Abstract: A two-phase immersion-cooling heat-dissipation structure having skived fins with high surface roughness includes an immersion-cooling substrate and a plurality of skived fins. The immersion-cooling substrate has a top surface and a bottom surface that are opposite to each other, the bottom surface is used for contacting a heat source immersed in a two-phase coolant, the top surface is connected with the plurality of skived fins, a center line average roughness Ra of a surface of the plurality of skived fins is greater than 10 ?m, and a ten point average roughness Rz of the surface of the plurality of skived fins is greater than 20 ?m, such that a ratio between a surface area of the plurality of skived fins in contact with the two-phase coolant and a volume of the plurality of skived fins is greater than 400.
    Type: Application
    Filed: February 17, 2023
    Publication date: August 22, 2024
    Inventors: YU-WEI CHIU, CHING-MING YANG, CHUN-TE WU, TZE-YANG YEH
  • Publication number: 20240276676
    Abstract: A two-phase immersion-cooling heat-dissipation structure having shortened evacuation route for vapor bubbles includes an immersion-cooling substrate having a first surface and a second surface that are opposite to each other and immersion-cooling fins. The second surface contacts a heat source immersed in a two-phase coolant, and the first surface connects to the immersion-cooling fins. The immersion-cooling fins include at least one skived fin integrally formed on the first surface of the immersion-cooling substrate by skiving, and further include at least one functional fin. The functional fin is a single continuous fin extends lengthwise in a vapor bubbles evacuation direction, has a central portion corresponding in position to the heat source and upper and lower end portions located away from the heat source, and a height of the central portion is greater than at least one of a height of the upper and lower end portions.
    Type: Application
    Filed: February 10, 2023
    Publication date: August 15, 2024
    Inventors: CHING-MING YANG, CHUN-TE WU, YU-WEI CHIU, TZE-YANG YEH
  • Publication number: 20240268078
    Abstract: A two-phase immersion-cooling heat-dissipation structure having skived fins includes an immersion-cooling substrate and a plurality of immersion-cooling fins. The immersion-cooling substrate has a top surface and a bottom surface that are opposite to each other, the bottom surface is used for contacting a heat-generating component immersed in a two-phase coolant, the top surface is connected with the plurality of immersion-cooling fins, the plurality of immersion-cooling fins include at least one skived fin integrally formed on the top surface of the immersion-cooling substrate, and the plurality of immersion-cooling fins are non-linearly arranged. A thickness of any one of the plurality of immersion-cooling fins ranges from 0.1 mm to 0.35 mm, a height of any one of the plurality of immersion-cooling fins ranges from 5 mm to 10 mm, and a gap between any two of the plurality of immersion-cooling fins ranges from 0.1 mm to 0.35 mm.
    Type: Application
    Filed: February 2, 2023
    Publication date: August 8, 2024
    Inventors: CHING-MING YANG, CHUN-TE WU, TZE-YANG YEH, YU-WEI CHIU
  • Publication number: 20240266921
    Abstract: A cooler having an optimized coating structure for an electric vehicle power module is provided. The cooler includes a metal cooling substrate and a coating structure. The coating structure has at least a barrier layer and a function layer. The barrier layer is formed on the metal cooling substrate. The barrier layer is a nickel coating layer or a nickel alloy coating layer having a thickness of between 0.1 ?m and 0.5 ?m. The function layer is a silver/silver alloy coating layer, or a copper/copper alloy coating layer having a thickness of between 0.1 ?m and 0.5 ?m.
    Type: Application
    Filed: February 2, 2023
    Publication date: August 8, 2024
    Inventors: TZE-YANG YEH, YU-HSIANG LEE, HSUEH-LIN LU, KUN-LIN CHIH
  • Publication number: 20240247882
    Abstract: A liquid-cooling heat dissipation structure having a nonlinear fin array and a method for manufacturing the same are provided. The liquid-cooling heat dissipation structure includes an upper plate, a lower plate, and a flow guide member. The upper plate has an accommodating groove of which an inner side has an upper joint area formed thereon. The lower plate has a lower joint area. The flow guide member disposed between the upper plate and the lower plate includes a heat dissipation plate body having a first surface and a second surface, and a plurality of heat dissipation columns integrally disposed on the second surface. The upper brazing area is connected to the lower brazing area, and two ends of the flow guide member are respectively connected to the upper joint area and the lower joint area to form an enclosed cavity for accommodating the heat dissipation columns.
    Type: Application
    Filed: January 23, 2023
    Publication date: July 25, 2024
    Inventors: KUO-WEI LEE, CHIEN-CHENG WU, CHUN-LUNG WU, TZE-YANG YEH
  • Patent number: 12048119
    Abstract: An immersion-type liquid cooling heat dissipation sink is provided. The immersion-type liquid cooling heat dissipation sink includes a heat dissipation substrate layer and a surface film layer. The surface film layer is formed on the heat dissipation substrate layer. The heat dissipation substrate layer is a porous substrate that is immersed in an immersion-type coolant. A contact angle between the surface film layer and the immersion-type coolant is less than a contact angle between the heat dissipation substrate layer and the immersion-type coolant. A thickness of the surface film layer is less than an effective thickness of 5 ?m.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: July 23, 2024
    Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.
    Inventors: Chi-An Chen, Tze-Yang Yeh
  • Publication number: 20240244797
    Abstract: A two-phase immersion-type composite heat dissipation device is provided, which includes a heat dissipation substrate, a plurality of fins, and a surface porous layer. The heat dissipation substrate has a first surface and a second surface. The first surface is configured to be in contact with a heat source, and the second surface is opposite to the first surface and is distant from the heat source. A projection region of the heat dissipation substrate that corresponds to the heat source is defined as a high-temperature region, and a low-temperature region is defined at an outer periphery of the high-temperature region. The fins are opposite to the heat source, and are disposed within the high-temperature region of the second surface of the heat dissipation substrate. The surface porous layer is disposed within a range of the low-temperature region of the heat dissipation substrate.
    Type: Application
    Filed: January 16, 2023
    Publication date: July 18, 2024
    Inventors: CHUN-TE WU, CHING-MING YANG, YU-WEI CHIU, TZE-YANG YEH
  • Publication number: 20240244793
    Abstract: A two-phase immersion-type heat dissipation device is provided. The two-phase immersion-type heat dissipation device includes a heat dissipation substrate and a plurality of reinforced fins. The heat dissipation substrate has a first surface and a second surface configured to be in contact with a heating element. The first surface is opposite to the second surface and is arranged away from the heating element. The plurality of reinforced fins are integrally formed on the first surface of the heat dissipation substrate, and a thickness of each of the plurality of reinforced fins is less than 1 mm. According to a scanning electron microscopy image of electron backscattered diffraction, a median of local misorientation distribution of the plurality of reinforced fins is greater than 1.6 times a median of local misorientation distribution of the heat dissipation substrate.
    Type: Application
    Filed: January 17, 2023
    Publication date: July 18, 2024
    Inventors: CHUN-TE WU, CHING-MING YANG, YU-WEI CHIU, TZE-YANG YEH