Patents by Inventor Ung Lee
Ung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11953552Abstract: The present disclosure relates to a system and apparatus for monitoring a partial discharge in a switchboard, including a plurality of partial discharge sensors provided in each of a plurality of switchboards to acquire partial discharge data generated in at least one switchboard, and a noise sensor provided in any one of the plurality of switchboards to acquire noise data to be differentiated from the partial discharge data acquired from the at least one partial discharge sensor, and it can be applied to other exemplary embodiments.Type: GrantFiled: July 16, 2019Date of Patent: April 9, 2024Assignee: LS ELECTRIC CO., LTD.Inventors: Chang Hwan Jin, Jong Ung Choi, Hyun Ho Kwon, Gwang Goo Kang, Jin Ho Lee
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Publication number: 20240112864Abstract: A method of manufacturing a multilayer electronic component includes cutting a stack, in which internal electrode patterns and ceramic green sheets are alternately stacked in a stacking direction, to obtain unit chips and attaching a portion of a ceramic green sheet for a side margin portion to the unit chips in a direction, different from the stacking direction. The attaching includes attaching the portion of the ceramic green sheet to the unit chips by compression between a first elastic body on which the ceramic green sheet is disposed and the unit chips. The first elastic body includes a first elastic layer having and a second elastic layer having an elastic modulus different from the first elastic layer, and disposed between the unit chips and the first elastic layer. An elastic modulus of the first elastic body is greater than 50 MPa and less than or equal to 1000 MPa.Type: ApplicationFiled: July 10, 2023Publication date: April 4, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong PARK, Jung Tae PARK, Jong Ho LEE, Eun Jung LEE, Yong Min HONG, Jung Jin PARK, Rak Hyeon BAEK, Sun Mi KIM, Yong Ung LEE
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Publication number: 20240088059Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
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Patent number: 11922404Abstract: Payment methods and systems for processing a payment using a Central Bank Digital Currency (CBDC) without a double payment in an offline situation (e.g., in a situation in which a terminal of a user is unable to be connected) to a server through a network may be provided.Type: GrantFiled: August 24, 2021Date of Patent: March 5, 2024Assignee: LINE PLUS CORPORATIONInventors: Hongsup So, Inseon Ryu, Hwang Wook Kim, Cheol Ung Lee
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Patent number: 11855000Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.Type: GrantFiled: June 6, 2022Date of Patent: December 26, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Young Woo Lee, Jae Ung Lee, Byong Jin Kim, EunNaRa Cho, Ji Hoon Oh, Young Seok Kim, Jin Young Khim, Tae Kyeong Hwang, Jin Seong Kim, Gi Jung Kim
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Patent number: 11834773Abstract: Provided is a washing machine capable of improving solubility of a powder detergent that remains without having been dissolved in mixing water contained in a tub. The washing machine includes a cabinet having a detergent supplier, a tub arranged in the cabinet to be connected to the detergent supplier and containing mixing water in which washing water supplied to the detergent supplier and a powder detergent are mixed, a drum rotatably installed in the tub, a circulation hose connecting between the tub and the drum for the mixing water contained in a lower portion of the tub to be circulated, a detergent dissolution device generating vortex current in mixing water circulated through the circulation hose to improve solubility of the powder detergent, and a circulation pump arranged in the circulation hose and configured to repeatedly supply and discharge mixing water to and from the detergent dissolution device through on/off controlling.Type: GrantFiled: May 13, 2019Date of Patent: December 5, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Geon Ung Lee, Hwang Mook Cho, Jin Baek Kim, Hyun Joo Kim, Jun Hong Park, Eung Ryeol Seo
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Patent number: 11830669Abstract: A casting coil for a motor assembly, which is formed in a multi-layer structure, includes: a first coil formed to extend in one direction; a second coil bent to extend from an end of the first coil; a third coil bent to extend from an end of the second coil in a direction parallel to the first coil; and a fourth coil bent to extend from an end of the third coil in a direction parallel to the second coil. The first coil, the second coil, the third coil, and the fourth coil form one layer so that a hollow multi-layer structure is formed. A larger magnetic field can be formed by securing a slot filling factor of 50% or more of a stator in the same motor package.Type: GrantFiled: September 23, 2021Date of Patent: November 28, 2023Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Jiyong Lee, Cheol-Ung Lee
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Patent number: 11788222Abstract: A washing machine having a bubble generator includes a bubble spray part provided at an upper side of a tub and configured to discharge bubbles from a top to a bottom inside the tub; a wash liquid jet nozzle provided inside the bubble spray part and configured to jet wash liquid; a blowing fan provided in the bubble spray part and configured to blow air in a direction in which the wash liquid jet nozzle jets the wash liquid; and a porous plate member provided at a front end of the bubble spray part and including a plurality of holes, wherein when the wash liquid jetted from the wash liquid jet nozzle collides with the porous plate member, bubbles are generated.Type: GrantFiled: May 6, 2021Date of Patent: October 17, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Hwang-mook Cho, Geon-ung Lee, Eun-suk Bang, Dong-pil Seo, Eung-ryeol Seo
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Publication number: 20230257257Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.Type: ApplicationFiled: February 6, 2023Publication date: August 17, 2023Inventors: Yung Woo Lee, Byung Jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee
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Publication number: 20230183012Abstract: Provided is a transport system to facilitate interlayer movement of a transported object. The transport system comprises: a rail device; and a transport vehicle moving in the rail device, wherein the rail device comprises: a first rail with a first inclination angle; a second rail with a second inclination angle larger than the first inclination angle; a first connection rail configured to connect the first rail to the second rail; and a rack rail installed along the first connection rail and the second rail, wherein the transport vehicle comprises: a frame; a driving wheel connected to the frame and moving the first rail, the first connection rail and the second rail; and a pinion gear connected to the frame and moving along the rack rail.Type: ApplicationFiled: November 2, 2022Publication date: June 15, 2023Inventors: Dong Won YUN, Doo Bong KIM, Su Ung LEE
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Publication number: 20230174443Abstract: Disclosed is a methanol and sulfuric acid co-production system capable of producing methanol and sulfuric acid in equal equivalents. Specifically, the system includes an oxidation reaction unit configured to produce methyl bisulfate (CH3OSO3H) by reacting methane gas with an acid solution in the presence of a catalyst, a reactive distillation unit disposed downstream of the oxidation reaction unit and configured to esterify methyl bisulfate (CH3OSO3H) supplied from the oxidation reaction unit with trifluoroacetic acid (CF3COOH) to obtain a product and to separate the product into methyl trifluoroacetate (CF3COOCH3) and sulfuric acid (H2SO4) through thermal distillation, and a hydrolysis reaction unit disposed downstream of the reactive distillation unit and configured to produce methanol by hydrolyzing methyl trifluoroacetate (CF3COOCH3) supplied from the reactive distillation unit, in which the reactive distillation unit recirculates the sulfuric acid resulting from separation to the oxidation reaction unit.Type: ApplicationFiled: September 15, 2022Publication date: June 8, 2023Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Ung LEE, Hyun Joo LEE, Hong Gon KIM, Kyeong Su KIM, Jae Hyung IM, He Won LEE
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Publication number: 20230136651Abstract: According to one embodiment of the present invention, there is provided a catalyst compound, which comprises a compound of Chemical Formula 1 below and catalyzes the process of oxidizing 5-hydroxymethylfurfural (HMF) to 2,5-furandicarboxylic acid (FDCA): NiCoxPy??[Chemical Formula 1] (wherein x and y are the molar ratio for Ni contained in the catalyst compound, 0<x<1, 0<y<1).Type: ApplicationFiled: June 15, 2022Publication date: May 4, 2023Inventors: Dong Ki LEE, Jai Hyun KOH, Dahye WON, Ung LEE, Hyung-Suk OH, Byoung Koun MIN, JongIn WOO, Byeong Cheul MOON
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Publication number: 20230118400Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.Type: ApplicationFiled: October 31, 2022Publication date: April 20, 2023Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
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Publication number: 20230107620Abstract: It has been established that optimizing cell seeding onto tissue engineering vascular grafts (TEVG) is associated with reduced inflammatory responses and reduced post-operative stenosis of TEVG. Cell seeding increased TEVG patency in a dose dependent manner, and TEVG patency improved when more cells were seeded, however duration of incubation time showed minimal effect on TEVG patency. Methods of engineering patient specific TEVG including optimal numbers of cells to maintain graft patency and reduce post-operative stenosis are provided. Closed, single-use customizable systems for seeding TEVG are also provided. Preferably the systems are custom-designed based on morphology of the patient specific graft, to enhance the efficacy of cell seeding.Type: ApplicationFiled: December 8, 2022Publication date: April 6, 2023Inventors: Christopher Breuer, Robert Strouse, Yong Ung-Lee, Cameron Best, Narutoshi Hibino
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Patent number: 11592030Abstract: The washing machine includes a cabinet, a drum installed inside the cabinet, and a fan assembly to guide heated air into the drum. A fan assembly includes a shroud provided with an air inlet hole, a hub rotated by a driving motor, a plurality of blades provided along a circumferential direction of the hub to guide the air introduced through the air inlet hole in the circumferential direction of the hub, and a scroll guiding the air guided in the circumferential direction of the hub into the drum. A partition wall prevents the air guided in the circumferential direction of the hub from being re-introduced into the air inlet hole. The blade includes a shroud contact portion in contact with the shroud and a hub contact portion in contact with the hub. An inflection point is formed between the shroud contact portion and the hub contact portion.Type: GrantFiled: December 7, 2017Date of Patent: February 28, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Yong Hun Kang, Geon Ung Lee, Hwang Mook Cho, Jin Baek Kim, Eung Ryeol Seo
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Publication number: 20230057916Abstract: A system of utilizing carbon dioxide comprises a carbon dioxide capturing device for capturing carbon dioxide, an electrochemical reaction device for producing synthetic gas by reducing the carbon dioxide captured by the carbon dioxide capturing device, a hydrogen carrier manufacturing device for manufacturing a hydrogen carrier material by using the synthetic gas produced by the electrochemical reaction device, a dehydrogenation device for producing hydrogen from the hydrogen carrier material manufactured by the hydrogen carrier manufacturing device, and a hydrogen utilization device for utilizing hydrogen produced by the dehydrogenation device, wherein the dehydrogenation device further produces carbon dioxide from the hydrogen carrier material and supplies the carbon dioxide to the carbon dioxide capturing device.Type: ApplicationFiled: April 20, 2022Publication date: February 23, 2023Inventors: Ung LEE, Da Hye WON, Jai Hyun KOH, Dong Ki LEE, Hyung Suk OH, Byoung Koun MIN
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Patent number: 11588157Abstract: Proposed is an iridium alloy catalyst having reversible catalytic activity for an oxygen evolution reaction (OER), a hydrogen evolution reaction (HER), and a hydrogen oxidation reaction (HOR) by including an iridium alloy including iridium (Ir) and nickel (Ni). The iridium alloy catalyst according to the present disclosure is rapidly converted to an iridium alloy catalyst in an oxide form and an iridium alloy catalyst in a metallic form according to applied voltage by controlling its crystallinity. Thus, even in case an oxide layer is formed after the OER, the oxidation layer disappears during the HER and HOR and the properties of an iridium metal catalyst remain, thereby maintaining HER/HOR performance.Type: GrantFiled: March 10, 2021Date of Patent: February 21, 2023Assignee: Korea Institute of Science and TechnologyInventors: Hyung Suk Oh, Woong Hee Lee, Byoung Koun Min, Yun Jeong Hwang, Ung Lee, Dong Ki Lee, Da Hye Won, Jai Hyun Koh
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Patent number: 11572269Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.Type: GrantFiled: November 2, 2020Date of Patent: February 7, 2023Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Yung Woo Lee, Byung Jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee
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Publication number: 20230026729Abstract: A casting coil for a motor assembly, which is formed in a multi-layer structure, includes: a first coil formed to extend in one direction; a second coil bent to extend from an end of the first coil; a third coil bent to extend from an end of the second coil in a direction parallel to the first coil; and a fourth coil bent to extend from an end of the third coil in a direction parallel to the second coil. The first coil, the second coil, the third coil, and the fourth coil form one layer so that a hollow multi-layer structure is formed. A larger magnetic field can be formed by securing a slot filling factor of 50% or more of a stator in the same motor package.Type: ApplicationFiled: September 23, 2021Publication date: January 26, 2023Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Jiyong Lee, Cheol-Ung Lee
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Patent number: 11541149Abstract: It has been established that optimizing cell seeding onto tissue engineering vascular grafts (TEVG) is associated with reduced inflammatory responses and reduced post-operative stenosis of TEVG. Cell seeding increased TEVG patency in a dose dependent manner, and TEVG patency improved when more cells were seeded, however duration of incubation time showed minimal effect on TEVG patency. Methods of engineering patient specific TEVG including optimal numbers of cells to maintain graft patency and reduce post-operative stenosis are provided. Closed, single-use customizable systems for seeding TEVG are also provided. Preferably the systems are custom-designed based on morphology of the patient specific graft, to enhance the efficacy of cell seeding.Type: GrantFiled: December 12, 2016Date of Patent: January 3, 2023Assignee: Research Institute at Nationwide Children's HospitalInventors: Christopher Breuer, Cameron Best, Robert Strouse, Narutoshi Hibino, Yong Ung-Lee