Patents by Inventor Ung Lee
Ung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11541149Abstract: It has been established that optimizing cell seeding onto tissue engineering vascular grafts (TEVG) is associated with reduced inflammatory responses and reduced post-operative stenosis of TEVG. Cell seeding increased TEVG patency in a dose dependent manner, and TEVG patency improved when more cells were seeded, however duration of incubation time showed minimal effect on TEVG patency. Methods of engineering patient specific TEVG including optimal numbers of cells to maintain graft patency and reduce post-operative stenosis are provided. Closed, single-use customizable systems for seeding TEVG are also provided. Preferably the systems are custom-designed based on morphology of the patient specific graft, to enhance the efficacy of cell seeding.Type: GrantFiled: December 12, 2016Date of Patent: January 3, 2023Assignee: Research Institute at Nationwide Children's HospitalInventors: Christopher Breuer, Cameron Best, Robert Strouse, Narutoshi Hibino, Yong Ung-Lee
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Publication number: 20220374680Abstract: A deep learning device and system including the same is provided. The deep learning device comprising processing circuitry configured to determine whether a received image is abnormal using an anomaly detection model; merge at least some vectors extracted from the anomaly detection model; input, to a probability approximation model, principal components generated by a principal component analysis (PCA) to detect whether out of distribution (OOD) occurs in data of the received image; store a result of the determinations; and extract at least some the data in which the OOD occurs, as target labeling, using a target labeling extraction model when a rate of the data in which the OOD occurs is greater than or equal to a threshold value, wherein the anomaly detection model determines whether the received image is abnormal using the target labeling.Type: ApplicationFiled: November 18, 2021Publication date: November 24, 2022Applicant: Samsung Electronics Co., Ltd.Inventors: Young Jae KIM, Kae Weon YOU, Ji Ung LEE, Jun Haeng LEE, Kyoung Hoon KANG, Young Hak LEE
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Publication number: 20220355417Abstract: An apparatus for manufacturing a display device and a method for manufacturing a display device are provided. The apparatus includes a stage; a laser module disposed above the stage and configured to output a laser beam; a scanner configured to receive the laser beam output from the laser module and irradiate the laser beam onto the stage; and a controller configured to control the laser module to irradiate the laser beam to a processing position while moving both the scanner and the stage in a first direction according to the processing position and a shape of a processing pattern.Type: ApplicationFiled: May 3, 2022Publication date: November 10, 2022Inventors: Hyun Ung LEE, Je Yun RYU, Jin Soo KIM
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Patent number: 11492519Abstract: Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.Type: GrantFiled: June 18, 2019Date of Patent: November 8, 2022Assignee: IPI TECH INCInventors: Kye Ung Lee, Ju Hwan Chun, Ho Young Park, Tae Seok Lee
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Patent number: 11488934Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.Type: GrantFiled: December 21, 2020Date of Patent: November 1, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
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Patent number: 11459697Abstract: A clothes care apparatus comprises a main body including a clothes care compartment, a clothes support member disposed in the clothes care compartment and including an air supply port provided to allow air to flow therein, a blower configured to form an airflow to be supplied to the clothes support member, and a nozzle provided to guide the airflow formed by the blower to the clothes support member, and including an airflow outlet disposed to face the air supply port, the airflow outlet provided to supply an airflow to an inside and an outside of the clothes support member.Type: GrantFiled: June 28, 2019Date of Patent: October 4, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Geon Ung Lee, Hyun Joo Kim, Eung Ryeol Seo, Dong Woo Shin, Seung-Mok Lee, Hwang Mook Cho
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Publication number: 20220302043Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.Type: ApplicationFiled: June 6, 2022Publication date: September 22, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Young Woo Lee, Jae Ung Lee, Byong Jin Kim, EunNaRa Cho, Ji Hoon Oh, Young Seok Kim, Jin Young Khim, Tae Kyeong Hwang, Jin Seong Kim, Gi Jung Kim
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Patent number: 11396042Abstract: A serial multi-cavity high pressure casting apparatus includes a three stage mold comprising a fixed mold, an operation mold, and a medium mold disposed between the fixed mold and the operation mold, a main sleeve penetrating a lower portion of the fixed mold, and having molten metal injected thereinto, a main runner formed to extend upward from the main sleeve, an auxiliary sleeve branched to both directions from the main runner, an auxiliary runner formed to extend upward from each of both ends of the auxiliary sleeve and connected to each of a first cavity formed between the fixed mold and the medium mold, and a second cavity formed between the medium mold and the operation mold, and a sleeve core disposed on a lower portion of the medium mold, and having the main sleeve, the main runner, and the auxiliary sleeve inserted thereinto.Type: GrantFiled: October 14, 2021Date of Patent: July 26, 2022Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Cheol-Ung Lee, Ji-Yong Lee, Dae-Ho Lee, Seong-Jun Lim, Hyo-Moon Joo, Cheon-Hee Kim, Sung-Hyun Kwon, Yoon-Ki Lee
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Publication number: 20220217197Abstract: A proxy server for uploading a file according to an embodiment of the present disclosure improves the upload speed of a file and to minimize upload delay due to the occurrence of an error in the upload process. Due to the fact that the upload of the upload target file is started by the client delivering only one HTTP request to the proxy server to start the upload of the upload target file instead of requesting an upload link for each divided chunk to the backend server and receiving the response message from the backend server, a transaction over a network having a relatively slow communication speed can be minimized and the upload speed can be improved accordingly.Type: ApplicationFiled: September 13, 2021Publication date: July 7, 2022Inventor: Sun Ung LEE
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Patent number: 11368516Abstract: A proxy server for uploading a file according to an embodiment of the present disclosure improves the upload speed of a file and to minimize upload delay due to the occurrence of an error in the upload process. Due to the fact that the upload of the upload target file is started by the client delivering only one HTTP request to the proxy server to start the upload of the upload target file instead of requesting an upload link for each divided chunk to the backend server and receiving the response message from the backend server, a transaction over a network having a relatively slow communication speed can be minimized and the upload speed can be improved accordingly.Type: GrantFiled: September 13, 2021Date of Patent: June 21, 2022Assignee: CLOUDIKE INC.Inventor: Sun Ung Lee
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Patent number: 11355449Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.Type: GrantFiled: April 24, 2020Date of Patent: June 7, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Young Woo Lee, Jae Ung Lee, Byong Jin Kim, EunNaRa Cho, Ji Hoon Oh, Young Seok Kim, Jin Young Khim, Tae Kyeong Hwang, Jin Seong Kim, Gi Jung Kim
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Patent number: 11305337Abstract: A method of forming a casting with a flow passage may include forming a core obtained by filling a tubular pipe with a filler; inserting the core into a mold having a cavity corresponding to a shape of the casting to be formed; performing a casting process by injecting molten metal into the cavity; and removing the filler from the core, wherein the casting process is performed through a high-pressure casting process.Type: GrantFiled: November 25, 2019Date of Patent: April 19, 2022Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATIONInventors: Ji-Yong Lee, Cheol-Ung Lee, Young-Rae Jo, Jin-Ho Yoo
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Publication number: 20220101308Abstract: Payment methods and systems for processing a payment using a Central Bank Digital Currency (CBDC) without a double payment in an offline situation (e.g., in a situation in which a terminal of a user is unable to be connected) to a server through a network may be provided.Type: ApplicationFiled: August 24, 2021Publication date: March 31, 2022Applicant: LINE Plus CorporationInventors: Hongsup SO, Inseon RYU, Hwang Wook KIM, Cheol Ung LEE
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Publication number: 20220049132Abstract: Disclosed is a semiconductor package polyimide film, which may prevent the stripping of a thermoplastic polyimide layer by reducing a difference in the average coefficient of linear thermal expansion between a substrate film and the thermoplastic polyimide layer, and may be readily detached after a reflow process is completed since the thermoplastic polyimide layer to be attached to a lead frame has a glass transition temperature less than or equal to a reflow process temperature.Type: ApplicationFiled: June 18, 2019Publication date: February 17, 2022Inventors: Kye Ung LEE, Sung Su KIM, Ho Young PARK, Tae Seok LEE
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Publication number: 20220051973Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises a substrate having a first surface and a second surface opposite to the first surface, and comprising at least one first recess portion formed in a direction ranging from the first surface toward the second surface, a plurality of first recess conductive patterns formed in the first recess portion, and a first passive element inserted into the first recess portion of the substrate and having a first electrode and a second electrode electrically connected to the plurality of first recess conductive patterns.Type: ApplicationFiled: October 14, 2021Publication date: February 17, 2022Inventors: Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong, Byong Jin Kim, Min Chul Shin, Ho Jeong Lim, Ji Hyun Kim, Chang Hun Kim
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Patent number: 11241732Abstract: A method of casting a casting product having tubular flow passages includes: attaching a cast-in pipe insert, having outer and inner fixing members to which both ends of pipes are coupled, respectively, to a fixed mold; assembling a movable mold with the fixed mold; injecting a molten metal into a cavity defined inside the fixed and movable molds; ejecting a casting product from the assembled molds after injecting the molten metal; and removing the outer and inner fixing members from the casting product.Type: GrantFiled: November 26, 2019Date of Patent: February 8, 2022Assignees: Hyundai Motor Company, Kia Motors Corporation, Sambo Motors Co LtdInventors: Yoon-Ki Lee, Hyung-Sop Yoon, Cheol-Ung Lee, Jae-Gi Sim, Jun Bak, Sang-Muk Park, Sung-Chun Jang, Jin-Hee Lee, Young-Han No, Young-Jae Do
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Patent number: 11242638Abstract: Provided is a washing machine having an improved structure for efficiently controlling a distribution of washing water to improve washing performance. The washing machine includes a tub, a rotary tub rotatably provided inside of the tub, a tub cover coupled to the tub to prevent washing water from overflowing the tub, and a plurality of guide units formed on a bottom surface of the tub cover to guide the washing water into the inside of the rotary tub. The plurality of guide units includes a first guide having an outer end spaced from an edge of the tub cover in an inward direction of the tub cover, a second guide having an outer end spaced from the edge of the tub cover in the inward direction of the tub cover, and disposed to be spaced apart from the first guide in a circumferential direction of the tub cover, and a third guide connecting the outer end of the first guide and the outer end of the second guide.Type: GrantFiled: February 6, 2017Date of Patent: February 8, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hwang Mook Cho, Jun Hong Park, Eung Ryeol Seo, Geon Ung Lee
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Publication number: 20220009968Abstract: The present disclosure relates to a composition for enhancing the cell permeability and gene correction efficiency of Cas protein and guide RNA. The currently used CRISPR-Cas-based gene correction technology has the problems of difficult intracellular injection in a complex form, unverified stability and low efficiency even after injection, and the off-target problem. In contrast, the composition for gene correction of the present disclosure can be usefully used for gene therapy due to remarkably high intracellular delivery efficiency, inhibited off-target, and ensured stability.Type: ApplicationFiled: December 27, 2019Publication date: January 13, 2022Applicant: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITYInventors: Je-Min CHOI, Ja-Hyun KOO, Hong-Gyun LEE, Jae-Ung LEE
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Patent number: 11219944Abstract: A casting method for forming a fastening part on an inclined plane of a casting may include mounting a plug unit including a casting plug and a screw thread insert combined with the casting plug on a movable mold or a fixed mold; performing casting by moving and combining the movable mold with the fixed mold and injecting a molten metal into a cavity formed between the movable mold and the fixed mold; performing mold opening after the casting; and separating the casting plug from the screw thread insert, wherein when the plug unit is mounted on the mold, the screw thread insert is deployed in the cavity, and a mold plane on which the casting plug is mounted forms an inclined plane having an acute angle against a horizontal plane that is parallel to a movement direction of the movable mold.Type: GrantFiled: April 6, 2020Date of Patent: January 11, 2022Assignees: Hyundai Motor Company, Kia Motors Corporation, Jinhap Bollhoff Ltd.Inventors: Cheol-Ung Lee, Yoon-Ki Lee, Jin-Yong Kim, Jae-Young An, Woo-Seok Jang
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Patent number: 11201592Abstract: The present invention relates to a Doherty combiner used in a Doherty power amplifier, the Doherty combiner comprising: a phase shift section connected to one end of a carrier amplifier so as to change a phase of an RF signal output from the carrier amplifier; a matching section connected to an output terminal of the Doherty power amplifier so as to impedance-match an output of the Doherty power amplifier; and a bandwidth improvement section connected to one end of a peaking amplifier so as to change at least one of a phase bandwidth and an amplitude bandwidth of the Doherty power amplifier.Type: GrantFiled: October 23, 2017Date of Patent: December 14, 2021Assignee: SOONCHUNHYANG UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATIONInventors: Dal Ahn, Kwan-Sun Choi, Jong-Sik Lim, Sang-Min Han, Sung-Min Kim, You-Na Jang, Dae-Ung Lee, Jun-Seok Oh, Seo Koo, Tae-Hoon Kang, Ji-Won Kim, Ik-Soo Jang